Semiconductor device and method for manufacturing the same

ABSTRACT

Disclosed is a semiconductor device comprising a thin film transistor and wirings connected to the thin film transistor, in which the thin film transistor has a channel formation region in an oxide semiconductor layer, and a copper metal is used for at least one of a gate electrode, a source electrode, a drain electrode, a gate wiring, a source wiring, and a drain wiring. The extremely low off current of the transistor with the oxide semiconductor layer contributes to reduction in power consumption of the semiconductor device. Additionally, the use of the copper metal allows the combination of the semiconductor device with a display element to provide a display device with high display quality and negligible defects, which results from the low electrical resistance of the wirings and electrodes formed with the copper metal.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.16/196,091, filed Nov. 20, 2018, now allowed, which is a continuation ofU.S. application Ser. No. 15/685,005, filed Aug. 24, 2017, now U.S. Pat.No. 10,396,236, which is a continuation of U.S. application Ser. No.13/899,736, filed May 22, 2013, now U.S. Pat. No. 9,748,436, which is acontinuation of U.S. application Ser. No. 12/954,181, filed Nov. 24,2010, now U.S. Pat. No. 8,471,256, which claims the benefit of a foreignpriority application filed in Japan as Serial No. 2009-270784 on Nov.27, 2009, all of which are incorporated by reference.

TECHNICAL FIELD

The present invention relates to a semiconductor device including asemiconductor element and a manufacturing method thereof.

Note that a semiconductor device in this specification indicates all thedevices that can operate by using semiconductor characteristics, andsemiconductor elements such as transistors; and electro-optical devices,semiconductor circuits, and electronic appliances which include thesemiconductor element are all included in the category of thesemiconductor devices.

BACKGROUND ART

In recent years, a technique by which transistors are manufactured usingan oxide semiconductor as a semiconductor material and the transistorsare applied to semiconductor circuits, ICs, electro-optical devices,electronic appliances and the like has attracted attention.

For example, Patent Document 1 and Patent Document 2 disclose atechnique with which a thin film transistor (also referred to as a TFT)is manufactured using a semiconductor thin film (a thickness of aboutseveral nanometers to several hundreds nanometers) including zinc oxide,an In-Ga-Zn-O-based oxide semiconductor, or the like over a substratehaving an insulating surface, and such a TFT is used for a switchingelement of an image display device.

The conventional transistor is manufactured mainly using a semiconductormaterial such as amorphous silicon or polycrystalline silicon. The TFTusing amorphous silicon has a low electric field-effect mobility but canrelatively easily respond to an increase in size of a manufacturingsubstrate such as a glass substrate. On the other hand, the TFT usingpolycrystalline silicon has a high electric field-effect mobility, butneeds a crystallization step such as laser annealing and is not alwaysadaptable to an increase in size of a manufacturing substrate such as aglass substrate.

In contrast, a TFT in which a channel formation region (also referred toas a channel region) is provided in an oxide semiconductor can havehigher field-effect mobility than a TFT using amorphous silicon.Further, an oxide semiconductor film can be formed by a sputteringmethod or the like. A manufacturing process of the TFT using an oxidesemiconductor is simpler than that of a TFT using polycrystallinesilicon and easily responds to an increase in size of a manufacturingsubstrate.

An oxide semiconductor which can be used for a high-performancetransistor over a glass substrate, a plastic substrate, or the like isexpected to be applied to display devices such as a liquid crystaldisplay, an electroluminescent display (also referred to as an ELdisplay), and electronic paper.

In particular, there is a trend in an active matrix semiconductor devicetypified by a liquid crystal display device towards a larger screen,e.g., a 60-inch diagonal screen, and further, the development of anactive matrix semiconductor device is aimed even at a screen size of adiagonal of 120 inches or more. In addition, a trend in resolution of ascreen is toward higher definition, e.g., high-definition (HD) imagequality (1366×768) or full high-definition (FHD) image quality(1920×1080), and a so-called 4K Digital Cinema display device, which hasa resolution of 3840×2048 or 4096×2180, is also urgently developed.

As a display device has a larger size and a higher definition, thenumber of pixels needed for the display device is significantlyincreased. As a result, writing time for one pixel is required to beshortened, and thus a transistor arranged in a pixel is required to havehigh speed operation characteristics, large on current, and the like. Inthe meantime, a problem of energy depletion in recent years has causeddemand for a display device whose power consumption is suppressed.Therefore, a transistor is also required to have low off current andsuppressed unnecessary leakage current.

As described above, transistors having high ratio of on current to offcurrent are desired. A technique of a transistor using an oxidesemiconductor, in which the ratio of on current to off current isincreased to about 10³, is disclosed in Patent Document 3.

Increase in screen size or definition tends to increase wiringresistance in a display portion. Increase in wiring resistance causesdelay of signal transmission to an end portion of a signal line, drop involtage of a power supply line, or the like. As a result, deteriorationof display quality, such as display unevenness or a defect in grayscale,or increase in power consumption is caused.

In order to suppress increase in wiring resistance, the technique bywhich a low-resistance wiring layer is formed using copper (Cu) has beenconsidered (for example, see Patent Document 4 or 5).

Reference

[Patent Document 1] Japanese Published Patent Application No.2007-123861

[Patent Document 2] Japanese Published Patent Application No.2007-096055

[Patent Document 3] Japanese Published Patent Application No.2007-134496

[Patent Document 4] Japanese Published Patent Application No.2004-133422

[Patent Document 5] Japanese Published Patent Application No.2004-163901

DISCLOSURE OF INVENTION

In a semiconductor device in which delay due to resistance is recognizedas a problem, like a large-sized display device, reduction in wiringresistance is needed, and for example, a method with use of a copperwiring is considered. However, in a transistor including an oxidesemiconductor which easily responds to an increase in size of amanufacturing substrate and has high electric field-effect mobility,when the oxide semiconductor is connected to a copper wiring having lowwiring resistance, a problem is caused that the ratio of on current tooff current is not sufficient and remains in a figure of approximately10³.

In addition, there is another problem in that an impurity enters theinside of the transistor from the outside after long-term use, resultingin change in transistor characteristics such as a threshold value.

An object of one embodiment of the present invention is to provide asemiconductor device in which a defect in signal writing to atransistor, which is caused by voltage drop or signal delay due towiring resistance, is prevented. For example, one of objects is toprovide a display device which achieves high display quality bypreventing a defect in grayscale caused by a defect in writing to atransistor provided in a display of the display device.

Another object of one embodiment of the present invention is to realizehigh-speed operation of a semiconductor device.

Another object of one embodiment of the present invention is to realizereduction in power consumption of a semiconductor device.

Another object of one embodiment of the present invention is to providea transistor which operates stably and a semiconductor device whichincludes the transistor.

Another object of one embodiment of the present invention is to realizea semiconductor device having excellent productivity.

Another object of one embodiment of the present invention is to realizea semiconductor device having higher reliability.

A transistor in which a wiring including copper with low wiringresistance is connected to a highly purified oxide semiconductor havinga wide band gap and the reduced carrier concentration is manufactured.Use of an oxide semiconductor with a wide band gap enables off currentof a transistor to be reduced. In addition, when such an oxidesemiconductor is highly purified and has the reduced carrierconcentration, a transistor has a positive threshold voltage. That is,with use of the highly purified oxide semiconductor with a wide band gapand the reduced carrier concentration, a so-called normally offtransistor can be provided to make the ratio between off current and oncurrent higher.

In order to achieve the above objects, in one embodiment of the presentinvention, is used a conductive film which includes copper with highelectric conductivity as a main component for a source wiring, a gatewiring, and source and drain electrodes. In addition, the conductivefilm and an oxide semiconductor layer which is highly purified and hasthe reduced carrier concentration are connected. Further, the transistorincluding an oxide semiconductor may be sealed by surrounding with aninsulating film.

One embodiment of the present invention is a semiconductor device whichincludes an insulating base film including silicon nitride over asubstrate, a gate electrode formed using a first conductive layer overthe base film, a first insulating layer including silicon nitride overthe gate electrode, an oxide semiconductor layer which is highlypurified over the first insulating layer, a source electrode and a drainelectrode which have an end portion over and overlapping with the gateelectrode and are formed using a second conductive layer in contact withthe highly purified oxide semiconductor layer, a second insulating layerincluding silicon nitride over the second conductive layer and thehighly purified oxide semiconductor layer, a gate wiring formed usingthe first conductive layer, and a source wiring formed using the secondconductive layer. The first conductive layer includes a conductive layerincluding copper as a main component, and the second conductive layerincludes a conductive layer including copper as a main component. Thecarrier concentration of the highly purified oxide semiconductor layeris lower than 1×10¹² cm³.

Further, one embodiment of the present invention is the abovesemiconductor device in which the conductive layer including copper as amain component which is included in the second conductive layer isconnected to the highly purified oxide semiconductor layer with a metalnitride having conductivity interposed therebetween.

Further, one embodiment of the present invention is the abovesemiconductor device in which the gate wiring formed using the firstconductive layer and the source wiring formed using the secondconductive layer are intersected with each other with the highlypurified oxide semiconductor layer interposed therebetween.

Further, one embodiment of the present invention is the abovesemiconductor device in which the base film and the first insulatinglayer are provided to surround the first conductive layer and be incontact with each other, and the first insulating layer and the secondinsulating layer are provided to surround the oxide semiconductor layerand the second conductive layer and be in contact with each other. Thefirst insulating layer and the second insulating layer may contain thesame material.

One embodiment of the present invention is a method for manufacturing asemiconductor device including the following steps of: forming aninsulating base film including silicon nitride over a substrate; forminga gate electrode and a gate wiring which are formed using a firstconductive layer over the base film; forming a first insulating layerincluding silicon nitride over the first conductive layer; forming anoxide semiconductor layer over the first insulating layer; heating thesubstrate over which the oxide semiconductor layer is provided in anitrogen atmosphere to a temperature equal to or higher than 350° C. andequal to or lower than 700° C.; cooling the substrate over which theoxide semiconductor layer is provided in a dry air containing oxygenafter the heating; forming a source electrode, a drain electrode, and asource wiring over the first insulating layer, the source and drainelectrodes having an end portion over and overlapping with the gateelectrode and being formed using a second conductive layer electricallyconnected to the oxide semiconductor layer; and forming a secondinsulating layer including silicon nitride over the second conductivelayer and the oxide semiconductor layer.

Further, one embodiment of the present invention is the above method formanufacturing a semiconductor device in which: the substrate over whichthe oxide semiconductor layer is provided is heated in a nitrogenatmosphere so that a temperature of the substrate is equal to or higherthan 350° C. and equal to or lower than 700° C.; after the heating, thesubstrate is cooled; the substrate is heated in a dry air containingoxygen so that a temperature of the substrate is equal to or higher than350° C. and equal to or lower than 700° C.; and after the heating, thesubstrate is cooled.

Further, one embodiment of the present invention is the above method formanufacturing a semiconductor device in which: the substrate over whichthe oxide semiconductor layer is provided is heated in a nitrogenatmosphere so that a temperature of the substrate is equal to or higherthan 350° C. and equal to or lower than 700° C.; the substrate is heatedin a dry air containing oxygen while the temperature of the substrate iskept; and the substrate is cooled in the dry air containing oxygen.

Note that a gate in this specification refers to the entire gateelectrode and gate wiring or part thereof. The gate wiring is a wiringfor electrically connecting a gate electrode of at least one transistorto another electrode or another wiring, and includes a scan line in adisplay device in its category, for example.

The source refers to the entire source region, source electrode, andsource wiring or part thereof. The source region indicates a region in asemiconductor layer, where the resistivity is equal to or less than agiven value. The source electrode indicates part of a conductive layer,which is connected to the source region. The source wiring is a wiringfor electrically connecting a source electrode of at least onetransistor to another electrode or another wiring. For example, in thecase where a signal line in a display device is electrically connectedto a source electrode, the source wiring includes the signal line in itscategory.

The drain is the entire drain region, drain electrode, and drain wiringor part thereof. The drain region indicates a region in a semiconductorlayer, where the resistivity is equal to or less than a given value. Thedrain electrode indicates part of a conductive layer, which is connectedto the drain region. The drain wiring is a wiring for electricallyconnecting a drain electrode of at least one transistor to anotherelectrode or another wiring. For example, in the case where a signalline in a display device is electrically connected to a drain electrode,the drain wiring includes the signal line in its category.

In addition, in this document (the specification, the scope of claims,the drawings), a source and a drain of a transistor are interchangeddepending on the structure, the operating conditions, or the like of thetransistor; therefore, it is difficult to determine which is the sourceand which is the drain. Therefore, in this document (the specification,the scope of claims, the drawings), one terminal which is freelyselected from the source and the drain is referred to as one of thesource and the drain, whereas the other terminal is referred to as theother of the source and the drain.

Note that in this specification, silicon nitride oxide refers to siliconthat includes more nitrogen than oxygen and, in the case wheremeasurements are performed using RBS and HFS, includes oxygen, nitrogen,silicon, and hydrogen at concentrations ranging from 5 at. % to 30 at.%, 20 at. % to 55 at. %, 25 at. % to 35 at. %, and 10 at. % to 30 at. %,respectively.

Note that in this specification, a “light-emitting device”□ refers to animage display device, or a light source (including a lighting device).In addition, the light-emitting device includes any of the followingmodules in its category: a module in which a connector such as an FPC(flexible printed circuit), a TAB (tape automated bonding) tape, or aTCP (tape carrier package) is attached to a light-emitting device; amodule having a TAB tape or a TCP provided with a printed wiring boardat the end thereof; and a module having an IC (integrated circuit)directly mounted over a substrate over which a light-emitting element isformed by a COG (chip on glass) method.

According to the present invention, a semiconductor device having thehigh ratio between on current and off current and the reduced wiringresistance can be provided.

Further, a semiconductor device in which change in characteristics oftransistors due to entry of impurities from the outside after long-termuse is hardly caused can be provided.

Further, a semiconductor device typified by a display device havinghigher display quality, in which an adverse effect such as voltage drop,a defect in signal writing to a pixel, a defect in grayscale, and thelike due to wiring resistance are prevented can be provided.

Furthermore, a semiconductor device which operates at high speed can beprovided.

Furthermore, a semiconductor device whose power consumption is reducedcan be provided.

Furthermore, a transistor which operates stably and a semiconductordevice including the transistor can be provided.

Furthermore, a semiconductor device having excellent productivity can beprovided.

Furthermore, a semiconductor device having higher reliability can beprovided.

BRIEF DESCRIPTION OF DRAWINGS

FIGS. 1A and 1B illustrate a semiconductor device according to anembodiment.

FIG. 2 is a longitudinal cross-sectional view of an inverted staggeredtransistor which includes an oxide semiconductor.

FIGS. 3A and 3B are each an energy band diagram (schematic diagram) of across section along A-A′ in FIG. 2 .

FIG. 4A illustrates a state in which a positive potential (+V_(G)) isapplied to a gate (G1), and FIG. 4B illustrates a state in which anegative potential (−V_(G)) is applied to the gate (G1).

FIG. 5 is a diagram illustrating a relation between a vacuum level andwork function (ϕ_(M)) of a metal and a relation between a vacuum leveland electron affinity (χ) of an oxide semiconductor.

FIG. 6 is a diagram illustrating energy needed for injection of hotcarriers in silicon (Si).

FIG. 7 is a diagram illustrating energy needed for injection of hotcarriers in an In-Ga-Zn-O-based oxide semiconductor (IGZO).

FIG. 8 is a diagram illustrating energy needed for injection of hotcarriers in silicon carbide (4H-SiC).

FIG. 9 shows results of device simulation relating to the short channeleffect.

FIG. 10 shows results of device simulation relating to the short channeleffect.

FIG. 11 is a graph showing C-V characteristics.

FIG. 12 is a graph showing a relation between Vg and (1/C)².

FIGS. 13A to 13E illustrate a method for manufacturing a semiconductordevice according to one embodiment.

FIGS. 14A and 14B are diagrams describing a heating process according toone embodiment.

FIGS. 15A and 15B illustrate a semiconductor device according to oneembodiment.

FIGS. 16A to 16C illustrate an inverter circuit according to oneembodiment.

FIGS. 17A and 17B are block diagrams of display devices.

FIG. 18A is a configuration of a signal line driver circuit and FIG. 18Bis a timing chart describing operation of the signal line drivercircuit.

FIGS. 19A to 19C are circuit diagrams showing a structure of a shiftregister.

FIG. 20A is a circuit diagram of a shift register and FIG. 20B is atiming chart describing operation of the shift register.

FIGS. 21A1, 21A2, and 21B illustrate a semiconductor device according toone embodiment.

FIG. 22 illustrates a semiconductor device according to one embodiment.

FIG. 23 illustrates a pixel equivalent circuit of a semiconductor deviceaccording to one embodiment.

FIGS. 24A to 24C each illustrate a semiconductor device according to anembodiment.

FIGS. 25A and 25B illustrate a semiconductor device according to oneembodiment.

FIG. 26 illustrates a semiconductor device according to one embodiment.

FIGS. 27A and 27B each illustrate an example of applications ofelectronic paper.

FIG. 28 illustrates an external view of an example of an electronic bookdevice.

FIG. 29A illustrates an external view of an example of a television setand FIG. 29B illustrates an external view of an example of a digitalphoto frame.

FIGS. 30A and 30B are external views of examples of amusement machines.

FIG. 31 illustrates an external view of an example of a mobile phone.

FIG. 32 illustrates a semiconductor device according to one embodiment.

FIG. 33 illustrates a semiconductor device according to one embodiment.

FIG. 34 illustrates a semiconductor device according to one embodiment.

FIG. 35 illustrates a semiconductor device according to one embodiment.

FIG. 36 illustrates a semiconductor device according to one embodiment.

FIG. 37 illustrates a semiconductor device according to one embodiment.

FIG. 38 illustrates a semiconductor device according to one embodiment.

FIG. 39 illustrates a semiconductor device according to one embodiment.

FIG. 40 illustrates a semiconductor device according to one embodiment.

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiments will be described in detail with reference to theaccompanying drawings. Note that the present invention is not limited tothe following description, and it will be easily understood by thoseskilled in the art that various changes and modifications can be madewithout departing from the spirit and scope of the invention. Therefore,the present invention should not be construed as being limited to thedescription in the following embodiments. Note that in the structures ofthe invention described below, the same portions or portions havingsimilar functions are denoted by the same reference numerals indifferent drawings, and description of such portions is not repeated.

Embodiment 1

In this embodiment, one embodiment of a substrate provided with acircuit of a display device will be described as one embodiment of asemiconductor device, with reference to FIGS. 1A and 1B.

A structure of a pixel provided in the display device is illustrated inFIGS. 1A and 1B. FIG. 1A is a top view illustrating a plan structure ofthe pixel, and FIG. 1B is a cross-sectional view illustrating a stackedstructure in the pixel. Note that chain lines A1-A2, B1-B2, and C1-C2 inFIG. 1A correspond to cross sections A1-A2, B1-B2, and C1-C2 in FIG. 1B,respectively.

In the cross section A1-A2, a stacked structure in a transistor 151 usedin the pixel portion is illustrated. The transistor 151 is oneembodiment of a transistor having a bottom gate structure.

In the cross section B1-B2, a stacked structure in a capacitor formed inthe pixel portion is illustrated.

Further, in the cross section C1-C2, a stacked structure in a wiringintersection portion of a gate wiring and a source wiring isillustrated.

The transistor 151 includes a base film 101 over a substrate 100, a gateelectrode 111 a formed using a first conductive layer over the base film101, and a first insulating layer 102 over the gate electrode 111 a.Further, the transistor 151 includes an oxide semiconductor layer 113 aincluding a channel formation region which is in contact with the firstinsulating layer 102 over the gate electrode 111 a. Further, in thetransistor 151, a first electrode 115 a and a second electrode 115 b areformed using a second conductive layer, each of which has an end portionover and overlapping with the gate electrode 111 a and is in contactwith the oxide semiconductor layer 113 a. The first electrode 115 a andthe second electrode 115 b function as a source electrode or a drainelectrode of the transistor 151. Further, a second insulating layer 107is provided over the first electrode 115 a, the second electrode 115 b,the first insulating layer 102, and the oxide semiconductor layer 113 a.Furthermore, a third insulating layer 108 is provided over the secondinsulating layer 107, and a first pixel electrode 109 is provided overthe third insulating layer 108. The first pixel electrode 109 is formedusing a third conductive layer to be electrically connected to thesecond electrode 115 b through a contact hole 128 which is formed in thesecond insulating layer 107 and the third insulating layer 108.

The capacitor formed in the pixel portion has a structure in which thefirst insulating layer 102, the second insulating layer 107, and thethird insulating layer 108 are interposed between a capacitor wiring 111b formed using the first conductive layer and the first pixel electrode109 formed using the third conductive layer.

The intersection portion of the gate wiring and the source wiring mayhave a structure in which the first insulating layer 102 and an oxidesemiconductor layer 113 b are interposed between a gate wiring 111 cformed using the first conductive layer and a source wiring 115 c formedusing the second conductive layer. With the oxide semiconductor layer113 b interposed between the wirings, the distance between the wiringscan be increased; thus, capacitance generated at the intersection of thewirings can be reduced.

In this embodiment, copper is used for the first conductive layer. Asthe first conductive layer, a single layer of a layer including copperas a main component or a stacked layer including a layer includingcopper as a main component and another conductive film can be used. Thefirst conductive layer including copper as a main component has highconductivity and can reduce wiring resistance.

In addition, a layer including a refractory metal material such as Cr,Ta, Ti, Mo, or W or an alloy material layer including any of the metalmaterials may be stacked to be in contact with one of or both sidesurfaces of the layer including copper as a main component. Further, inthe case of using an Al material to which an element such as Si, Ti, Ta,W, Mo, Cr, Nd, Sc, or Y, which prevents generation of hillocks orwhiskers in an Al film, is added, heat resistance can be improved. Notethat it is preferable that the conductive layer have enough heatresistance to withstand at least heat treatment.

Further, for example, a tantalum nitride film may be formed to overlapwith the layer including copper as a main component, so that a barrierfilm which suppresses diffusion of copper is formed.

The first conductive layer including copper as a main component blockslight at a wavelength in the vicinity of 400 nm to 450 nm. When the gateelectrode 111 a overlapping with the oxide semiconductor layer is formedusing the first conductive layer including copper as a main component,light at a wavelength in the vicinity of 400 nm to 450 nm can beprevented from entering the oxide semiconductor layer from the substrate100 side. The oxide semiconductor layer has photosensitivity at awavelength in the vicinity of 400 nm to 450 nm. Thus, the gate electrode111 a formed using the first conductive layer including copper as a maincomponent can prevent electric characteristics of a transistor includingan oxide semiconductor layer or operation of a semiconductor deviceincluding an oxide semiconductor layer from being unstable due to lightat a wavelength in the vicinity of 400 nm to 450 nm.

The first conductive layer including copper as a main component isformed between the base film 101 and the first insulating layer 102.

Note that a wiring material may be selected as appropriate in accordancewith the performance needed for the display device. For example, onlythe second conductive layer including the source wiring which needs tohave a higher conduction property than the gate wiring may be formedusing the wiring including Cu.

In this embodiment, a silicon nitride (SiN_(y) (y>0)) layer is used forthe base film 101. With use of the silicon nitride layer, a phenomenonin which copper diffuses from the first conductive layer includingcopper as a main component can be prevented. In addition, a phenomenonin which an impurity element diffuses from the substrate 100 into asemiconductor element can be prevented.

The base film 101 and the first insulating layer 102 each include atleast a silicon nitride layer and may have a stacked layer includinganother insulating layer. As another insulating layer to be stacked, asilicon nitride oxide layer, a silicon oxynitride layer, or a siliconoxide layer may be used for example. Alternatively, a layer of one kindof oxide, nitride, oxynitride, and nitride oxide of aluminum, tantalum,yttrium, or hafnium; or a compound layer including at least two or morekinds of the above may be used.

In particular, it is preferred to use, as a gate insulating film, acombination of an insulating film having a higher permittivity thansilicon nitride with a silicon nitride layer, because the property asthe gate insulating film is improved.

Note that formation of the first conductive layer including copper as amain component between two silicon nitride layers can suppress diffusionof copper.

Note that the base film 101 and the first insulating layer 102 arepreferably formed by a sputtering method, a CVD method, or ahigh-density plasma CVD method.

In this embodiment, an In-Ga-Zn-O-based oxide semiconductor which ishighly purified to have a carrier concentration lower than 1×10¹² cm⁻³and has a wide band gap is used for the oxide semiconductor layer.

In a transistor including an oxide semiconductor layer which is highlypurified to have a carrier concentration lower than 1×10¹² cm⁻³, thethreshold voltage is a positive value and a so-called normally offcharacteristic is provided. Further, the transistor including an oxidesemiconductor with a wide band gap has small off current. Electriccharacteristics of the transistor including the oxide semiconductor withsuch characteristics are described at the end of this embodiment.

As an oxide semiconductor used for the oxide semiconductor layer, thefollowing metal oxides can also be used: a four-component metal oxidesuch as an In-Sn-Ga-Zn-O-based oxide semiconductor; a three-componentmetal oxide such as an In-Ga-Zn-O-based oxide semiconductor, anIn-Sn-Zn-O-based oxide semiconductor, an In-Al-Zn-O-based oxidesemiconductor, a Sn-Ga-Zn-O-based oxide semiconductor, anAl-Ga-Zn-O-based oxide semiconductor, and a Sn-Al-Zn-O-based oxidesemiconductor; a two-component metal oxide such as an In-Zn-O-basedoxide semiconductor, a Sn-Zn-O-based oxide semiconductor, anAl-Zn-O-based oxide semiconductor, a Zn-Mg-O-based oxide semiconductor,a Sn-Mg-O-based oxide semiconductor, an In-Mg-O-based oxidesemiconductor; an In-O-based oxide semiconductor; a Sn-O-based oxidesemiconductor; and a Zn-O-based oxide semiconductor. Silicon oxide maybe added to any of the above oxide semiconductor layers. Addition ofsilicon oxide (SiO_(x) (x>0)) which hinders crystallization into theoxide semiconductor layer can suppress crystallization of the oxidesemiconductor layer at the time when heat treatment is performed afterformation of the oxide semiconductor layer in the manufacturing process.

Note that as the oxide semiconductor layer, a thin film expressed byInMO₃(ZnO). (m>0) can be used. Here, M represents one or more metalelements selected from Ga, Al, Mn, and Co. For example, M can be Ga, Gaand Al, Ga and Mn, Ga and Co, or the like. An oxide semiconductor filmwhose composition formula is represented by InMO₃(ZnO). (m>0), whichincludes Ga as M, is referred to as an In-Ga-Zn-O-based oxidesemiconductor, and a thin film of the In-Ga-Zn-O-based oxidesemiconductor is also referred to as an In-Ga-Zn-O-basednon-single-crystal film.

For the oxide semiconductor layer, the one which is subjected todehydration or dehydrogenation at high temperature in a short time by anRTA (rapid thermal anneal) method or the like is used. The heating stepmakes a superficial portion of the oxide semiconductor layer have acrystal region including so-called nanocrystals with a grain size ofgreater than or equal to 1 nm and less than or equal to 20 nm, and therest portion is amorphous or is formed of a mixture of amorphousness andmicrocrystals, where an amorphous region is dotted with microcrystals.Note that the size of the nanocrystal is just an example, and thepresent invention is not construed as being limited to the above range.

By using an oxide semiconductor layer which has such a structure, achange to an n-type caused by entry of moisture or elimination of oxygento or from the superficial portion can be prevented because a densecrystal region including nanocrystals exists in the superficial portion.As a result, deterioration of electric characteristics due to a changeto an n-type, specifically, an increase in off current, can beprevented.

Note that the crystal region may include another crystal grain otherthan the above crystal grains. The crystal structure of the crystalgrains is not limited to the above structure, and the crystal region mayinclude crystal grains of another structure. For example, in the case ofusing an In-Ga-Zn-O-based oxide semiconductor materal, crystal grains ofInGaZnO₄ may be included in addition to crystal grains of In₂Ga₂ZnO₇.

In this embodiment, copper is used for the second conductive layer.Further, a tantalum nitride film, for example, may be formed as abarrier film which suppresses diffusion of copper over the layerincluding copper as a main component.

Note that the second conductive layer includes at least a layerincluding copper as a main component, like the first conductive layer,and may have a single layer structure or a stacked-layer structureincluding the layer including copper as a main component and anotherconductive layer. The second conductive layer including copper as a maincomponent has high conductivity and can reduce wiring resistance.

In the structure where the layer including copper as a main componentwhich is included in the second conductive layer is in contact with theoxide semiconductor layer, copper oxide is formed in some cases betweenthe layer including copper as a main component and the oxidesemiconductor layer due to performance of heat treatment which isnecessary for the oxide semiconductor layer to be highly purified. Thecopper oxide formed between the layer including copper as a maincomponent and the oxide semiconductor layer is a semiconductor, whichdoes not disturb electrical connection between the oxide semiconductorlayer and the second conductive layer.

Note that in the structure where the layer including copper as a maincomponent is in contact with the oxide semiconductor layer, copperdiffuses to the oxide semiconductor layer in some cases. However,characteristics of the oxide semiconductor layer is hardly influenced bydiffusion of a heavy atom typified by copper or the like, which isdifferent from a silicon semiconductor.

The second conductive layer may include another conductive layer whichis additionally provided between the layer including copper as a maincomponent and the oxide semiconductor layer.

The another conductive layer provided between the layer including copperas a main component and the oxide semiconductor layer is preferablyformed using a material including metal with high oxygen affinity. Asthe metal with high oxygen affinity, one or more materials includingmetal selected from titanium (Ti), manganese (Mn), magnesium (Mg),zirconium (Zr), beryllium (Be), thorium (Th), and the like arepreferable.

When the oxide semiconductor layer and the conductive layer with highoxygen affinity are formed in contact with each other, the carrierdensity in the vicinity of the interface is increased and alow-resistance region is formed, whereby the contact resistance betweenthe oxide semiconductor layer and the conductive layer can be reduced.This is because the conductive layer with high oxygen affinity extractsoxygen from the oxide semiconductor layer, and thus either or both alayer which includes an excessive amount of metal in the oxidesemiconductor layer (such a layer is referred to as a composite layer)and an oxidized conductive film are formed in the interface between theoxide semiconductor layer and the conductive layer.

For example, in a structure where an In-Ga-Zn-O-based oxidesemiconductor layer is in contact with a titanium film, an indium-excesslayer and a titanium oxide layer are formed in some cases in thevicinity of the interface between the oxide semiconductor layer and thetitanium film. In other cases, one of the indium-excess layer and thetitanium oxide layer is formed in the vicinity of the interface wherethe oxide semiconductor layer is in contact with the titanium film. Theindium-excess layer which is an oxygen-deficient In-Ga-Zn-O-based oxidesemiconductor layer has high electric conductivity; therefore, thecontact resistance between the oxide semiconductor layer and theconductive layer can be reduced.

Note that a titanium film or a titanium oxide film having conductivitymay be used as the conductive film which is in contact with the oxidesemiconductor layer. In that case, in the structure where theIn-Ga-Zn-O-based oxide semiconductor layer is in contact with thetitanium oxide film, an indium-excess layer might be formed in thevicinity of the interface where the oxide semiconductor layer is incontact with the titanium oxide film.

Alternatively, as another conductive layer provided between the layerincluding copper as a main component and the oxide semiconductor layer,a conductive layer including a low electronegativity metal ispreferable. As the low electronegativity metal, one or more of materialsselected from titanium, magnesium, yttrium, aluminum tungsten,molybdenum, and the like are preferable.

By removing an impurity such as moisture or hydrogen from the oxidesemiconductor layer by providing the conductive layer including a lowelectronegativity metal between the layer including copper as a maincomponent and the oxide semiconductor layer, an intrinsic (i-type)semiconductor or a substantially i-type semiconductor can be formed. Asa result, deterioration in characteristics of a transistor, such asshift in the threshold voltage due to the above impurity, can beprevented; thus, off current can be reduced.

An impurity such as hydrogen or water absorbed by the conductive layerincluding a low electronegativity metal tends to be combined with thelow electronegativity metal. An impurity chemically bonded to metal inthe conductive layer has the stable bond with the metal. After once theimpurity is absorbed into the conductive layer, the impurity is lesslikely to diffuse to the oxide semiconductor layer.

Therefore, since a state where an impurity such as hydrogen or water iscaptured in the conductive layer including a low electronegativity metalis held, the hydrogen concentration in the conductive layer including alow electronegativity metal is higher than that of the oxidesemiconductor layer. Specifically, the hydrogen concentration in thefirst electrode 115 a and the second electrode 115 b is 1.2 times ormore as high as that of the oxide semiconductor layer, preferably, 5times or more as high as that of the oxide semiconductor layer.

The concentration of hydrogen in the conductive layer is measured bysecondary ion mass spectroscopy (SIMS).

The analysis of the hydrogen concentrations in the oxide semiconductorlayer and the conductive layer is described here. The hydrogenconcentrations in the oxide semiconductor layer and the conductive layerare measured by secondary ion mass spectroscopy (SIMS). It is known thatit is difficult to obtain data accurately in the proximity of a surfaceof a sample or in the proximity of an interface between stacked filmsformed using different materials by the SIMS analysis in principle.Thus, in the case where distributions of the hydrogen concentrations ofthe layers in thickness directions are analyzed by SIMS, an averagevalue which is constant and does not largely vary in a region where thelayers are provided is employed as the hydrogen concentration. Further,in the case where the thickness of the layer is small, a region showinga constant value cannot be found in some cases due to the influence ofthe adjacent layers. In this case, the maximum value or the minimumvalue of the hydrogen concentration of a region where the layers areprovided is employed as the hydrogen concentration of the layer.Furthermore, in the case where a maximum peak and a minimum peak do notexist in the region where the layers are provided, the value of theinflection point is employed as the hydrogen concentration.

Note that in the above-described low electronegativity metal, titanium,molybdenum, and tungsten have low contact resistance with the oxidesemiconductor layer. Thus, the first electrode 115 a and the secondelectrode 115 b with low contact resistance with the oxide semiconductorlayer can be formed. Further, when the conductive layer in contact withthe oxide semiconductor layer is formed using any of titanium,molybdenum, and tungsten, an impurity in the oxide semiconductor layercan be reduced.

Alternatively, the another conductive layer provided between the layerincluding copper as a main component and the oxide semiconductor layercan be formed using a metal material such as Al, Cr, Ta, Ti, Mo, or W,or an alloy material including any of the metal materials.

Further alternatively, a conductive metal oxide can be used. As theconductive metal oxide, indium oxide (In₂O₃), tin oxide (SnO₂), zincoxide (ZnO), an alloy of indium oxide and tin oxide (In₂O₃—SnO₂,abbreviated to ITO), an alloy of indium oxide and zinc oxide(In₂O₃—ZnO), or the above metal oxide material to which silicon orsilicon oxide is added may be used.

The conductive layer is not limited to a single layer and may be a stackof two or more layers. Note that it is preferable that the conductivelayer have enough heat resistance to withstand at least heat treatment.

Note that a layer including refractory metal such as Cr, Ta, Ti, Mo, orW may be stacked to be in contact with one of or both side surfaces ofthe layer including copper as a main component. Further, in the case ofusing an Al material to which an element such as Si, Ti, Ta, W, Mo, Cr,Nd, Sc, or Y, which prevents generation of hillocks or whiskers in an Alfilm, is added, heat resistance can be improved.

In this embodiment, the second insulating layer 107 is a silicon nitride(SiN_(y) (y>0)) layer.

The second insulating layer 107 does not include impurities such asmoisture, hydrogen ions, or OH⁻ and is formed using an inorganicinsulating film which prevents entry of these from the outside. With useof the silicon nitride layer, diffusion of copper from the firstconductive layer and the second conductive layer including copper as amain component can be prevented.

In this embodiment, the first insulating layer 102 and the secondinsulating layer 107 are each formed using silicon nitride. In addition,the first insulating layer 102 and the second insulating layer 107 arein contact with each other. In such a manner, the inorganic insulatinglayers which are of the same kind are provided to be in contact witheach other so as to surround the transistor 151, whereby the transistorcan be sealed more tightly. In the case where the same kinds ofinorganic insulating layers are in contact with each other, theabove-described inorganic insulating layer can be used; in particular, asilicon nitride film is preferable because it can block impuritieseffectively.

The second insulating layer 107 includes at least a silicon nitridelayer and may have a stacked-layer structure including the siliconnitride layer and another insulating layer. As the another insulatinglayer to be stacked, an inorganic insulating layer such as an oxideinsulating layer, an oxynitride insulating layer, a nitride insulatinglayer, or a nitride oxide insulating layer can be used. For example, asilicon nitride oxide layer, a silicon oxynitride layer, a silicon oxidelayer, or the like can be stacked.

Further, when an oxide insulating film is provided to be in contact withthe oxide semiconductor layer and a silicon nitride (SiN_(y) (y>0))layer is stacked over the oxide insulating film, oxygen deficiency inthe oxide semiconductor layer can be lowered. Specifically, in thesecond insulating layer 107, a silicon oxide (SiO_(x) (x>0)) layer maybe formed on the side in contact with the oxide semiconductor layer anda silicon nitride layer may be stacked thereover. Further, when thesecond conductive layer including copper as a main component is coveredwith a silicon nitride layer, diffusion of copper can be suppressed.

The second insulating layer 107 is preferably formed by a sputteringmethod so as to prevent the oxide semiconductor layer from beingcontaminated with an impurity such as moisture, a hydrogen ion, or OH⁻.

The third insulating layer 108 can be provided. The third insulatinglayer 108 is formed with a single layer or a stacked layer and functionsto planarize unevenness caused by a structural body such as thetransistor formed below to form a planar surface. The third insulatinglayer 108 can be formed, for example, using a heat-resistant organicmaterial, such as a polyimide, an acrylic resin, abenzocyclobutene-based resin, a polyamide, or an epoxy resin. Other thansuch organic materials, it is also possible to use a low-dielectricconstant material (a low-k material), a siloxane-based resin, PSG(phosphosilicate glass), BPSG (borophosphosilicate glass), or the like.Note that the third insulating layer 108 may be formed by stacking aplurality of insulating films formed using the above materials.

The first pixel electrode 109 is electrically connected to thetransistor and used for a pixel of the display device. The first pixelelectrode 109 functions as an electrode for a display element and isformed using a conductive film transmitting visible light.

For the conductive film transmitting visible light, a light-transmittingconductive material such as indium tin oxide (hereinafter, referred toas ITO), indium zinc oxide, or indium tin oxide containing silicon oxidecan be used.

Described below is the effect that the oxide semiconductor layer ishighly purified to have a carrier concentration lower than 1 ×10¹² cm⁻³and has a wide band gap.

<Intrinsic Oxide Semiconductor>

Although many researches on properties of an oxide semiconductor such asdensity of states (DOS) have been conducted, they do not include theidea of sufficiently reducing the localized levels itself. According toone embodiment of the disclosed invention, a highly purified oxidesemiconductor is formed by removing water or hydrogen which might affectthe DOS in the energy gap, so that an intrinsic (i-type) oxidesemiconductor is formed. This is based on the idea of sufficientlyreducing the localized level itself. Thus, excellent industrial productscan be manufactured.

Note that oxygen may be removed while hydrogen, water, or the like isbeing removed. Therefore, it is preferable to realize a purified(i-type) oxide semiconductor in such a manner that oxygen is supplied tometal dangling bonds that results from oxygen deficiency so that thelocalized levels due to oxygen deficiency are reduced. For example, anoxygen-excess oxide film is formed in contact with a channel formationregion and heat treatment is performed at a temperature of 200° C. to400° C., typically 250° C., whereby oxygen can be supplied from theoxide film and the localized levels due to oxygen deficiency can bereduced.

Factors of deterioration in characteristics of an oxide semiconductorare considered to be attributed to levels of 0.1 eV to 0.2 eV under theconduction band due to excessive hydrogen, deep levels due to shortageof oxygen, or the like. Hydrogen is thoroughly removed and oxygen issufficiently supplied to eliminate such a defect.

An oxide semiconductor is generally considered as an n-typesemiconductor; however, according to an embodiment of the disclosedinvention, an i-type oxide semiconductor is realized by removing animpurity such as water or hydrogen and supplying oxygen which is aconstituent element of the oxide semiconductor. In this respect, it canbe said that an embodiment of the disclosed invention includes a noveltechnical idea which is far from an idea that an i-type semiconductor isobtained by adding an impurity in the case of silicon and the like.

<Electrical Conduction Mechanism of Transistor Including OxideSemiconductor>

A transistor including an oxide semiconductor has some characteristics.Here, electrical conduction mechanism of the transistor is describedwith reference to FIG. 2 , FIGS. 3A and 3B, FIGS. 4A and 4B, and FIG. 5. Note that the following description is based on the assumption of anideal situation for easy understanding and does not necessarily reflecta real situation. Note also that the following description is just aconsideration and does not affect the validity of the invention.

FIG. 2 is a cross-sectional view of an inverted-staggered transistorincluding an oxide semiconductor. An oxide semiconductor layer (OS) isprovided over a gate electrode layer (G1) with a gate insulating layer(GI) therebetween, and a source electrode (S) and a drain electrode (D)are formed thereover. Further, a back gate (G2) is provided over thesource electrode and the drain electrode with an insulating layerinterposed therebetween.

FIGS. 3A and 3B are energy band diagrams (schematic diagrams) of across-section taken along line A-A′ in FIG. 2 . FIG. 3A illustrates thecase where the potential difference between the source and the drain iszero (the source and the drain have the same potential, V_(D)=V_(S)=0V). FIG. 3B illustrates the case where the potential of the drain ishigher than that of the source (V_(D)>V_(S)).

FIGS. 4A and 4B are energy band diagrams (schematic diagrams) of thecross section B-B′ in FIG. 2 . FIG. 4A illustrates a state where apositive voltage (V_(G)>0) is applied to the gate electrode (G1), thatis, an on state where a carrier (electron) flows between the source andthe drain. FIG. 4B illustrates a state where a negative voltage(V_(G)<0) is applied to the gate electrode (G1), that is, an off state(where a minority carrier does not flow).

FIG. 5 is a diagram illustrating a relation between a vacuum level andwork function (ϕ_(M)) of metal and a relation between a vacuum level andelectron affinity (χ) of an oxide semiconductor.

Electrons in metal at room temperature are degenerated, and the Fermilevel is located in a conduction band. Meanwhile, a conventional oxidesemiconductor is n-type, and the Fermi level (E_(F)) is distant from theintrinsic Fermi level (E_(i)) in the center of the band gap and islocated near the conduction band. Note that it is known that part ofhydrogen in an oxide semiconductor serves as a donor, which is one ofthe factors that make the oxide semiconductor an n-type semiconductor.

In contrast, an oxide semiconductor according to an embodiment of thedisclosed invention is an oxide semiconductor that is made to beintrinsic (i-type) or to be close to intrinsic in the following manner:hydrogen, which is the cause to produce an n-type oxide semiconductor,is removed from the oxide semiconductor for high purification, so thatthe oxide semiconductor includes an element (impurity element) otherthan the main component of the oxide semiconductor as little aspossible. In other words, the oxide semiconductor according to oneembodiment of the invention disclosed herein is a highly purified i-type(intrinsic) semiconductor or a substantially intrinsic semiconductorobtained by removing impurities such as hydrogen and water as much aspossible, not by adding an impurity element. Thus, the Fermi level(E_(F)) can be comparable with the intrinsic Fermi level (E_(i)).

The band gap (Eg) of an oxide semiconductor is said to 3.15 eV, and theelectron affinity (χ) is said to be 4.3 V. The work function of copper(Cu) included in the source electrode and the drain electrode is 4.6 eVand slightly lower than the electron affinity (χ) of the oxidesemiconductor. The work function of titanium (Ti) is substantially equalto the electron affinity (χ) of the oxide semiconductor. In that case, ahigh Schottky barrier for electrons is not formed at an interfacebetween the metal and the oxide semiconductor.

In the case where the work function of metal (ϕ_(M)) and the electronaffinity (χ) of the oxide semiconductor are substantially equal to eachother and the metal and the oxide semiconductor are in contact with eachother, an energy band diagram (a schematic diagram) as illustrated inFIG. 3A is obtained.

In FIG. 3B, a black dot (●) indicates an electron. In addition, a dashedline indicates the case where a voltage is not applied to the gate(V_(G)=0) when a positive voltage (V_(D)>0) is applied to the drain, anda solid line indicates the case where a positive voltage (V_(G)>0) isapplied to the gate and a positive voltage (V_(D)>0) is applied to thedrain. When a positive potential (V_(G)>0) is supplied to the gate and apositive potential is applied to the drain, the electron crosses over abarrier (h) to be injected into the oxide semiconductor, and flows tothe drain. The height of the barrier (h) depends on a gate voltage and adrain voltage. When a positive voltage (V_(G)>0) is supplied to the gateand a positive drain voltage is applied, the height of the barrier (h)is lower than the height of the barrier (h) in FIG. 3A where a voltageis not applied, that is, the height of the barrier (h) is smaller thanhalf of the band gap (Eg). In the case where a voltage is not applied tothe gate, a carrier (electron) is not injected to the oxidesemiconductor side from an electrode because of high potential barrier,so that a current does not flow, which means an off state. On the otherhand, when a positive voltage is applied to the gate, a potentialbarrier is reduced and thus a current flows, which means an on state.

At this time, as illustrated in FIG. 4A, the electron injected to theoxide semiconductor travels in the vicinity of the interface between thegate insulating layer and the highly purified oxide semiconductor (thelowest part of the oxide semiconductor, which is energetically stable).

As illustrated in FIG. 4B, when a negative potential (reverse bias) issupplied to the gate electrode (G1), a hole which is a minority carrierdoes not exist substantially. Thus, the current value is substantiallyclose to zero.

In such a manner, the oxide semiconductor layer becomes intrinsic (ani-type semiconductor) or substantially intrinsic by being highlypurified so as to contain an element (i.e., an impurity element) otherthan its main element as little as possible. Thus, characteristics ofthe interface between the oxide semiconductor and the gate insulatinglayer causes large influence. For that reason, the gate insulating layerneeds to form a favorable interface with the oxide semiconductor.Specifically, it is preferable to use the following insulating layer,for example: an insulating layer formed by a CVD method usinghigh-density plasma generated with a power supply frequency in the rangeof the VHF band to the microwave band, or an insulating layer formed bya sputtering method.

When the interface between the oxide semiconductor and the gateinsulating layer is made favorable while the oxide semiconductor ishighly purified, in the case where the transistor has a channel width(W) of 1 ×10⁴ μm and a channel length (L) of 3 μm, for example, it ispossible to realize an off-state current of 1×10⁻¹³ A or less and asubthreshold swing (S value) of 0.1 V/dec at room temperature (with a100-nm-thick gate insulating layer).

When the oxide semiconductor is highly purified as described above so asto contain an element (i.e., an impurity element) other than its mainelement as little as possible, the transistor can operate in a favorablemanner.

<Resistance of Transistor Including Oxide Semiconductor to Hot CarrierDegradation>

Next, the resistance of a transistor including an oxide semiconductor tohot carrier degradation will be described with reference to FIG. 6 ,FIG. 7 , and FIG. 8 . Note that the following description is based onthe assumption of an ideal situation for easy understanding and does notnecessarily reflect a real situation. Note also that the followingdescription is just a consideration.

Main causes of hot carrier degradation are channel hot electroninjection (CHE injection) and drain avalanche hot carrier injection(DAHC injection). Note that only electrons are considered below forsimplicity.

CHE injection refers to a phenomenon in which electrons having gainedenergy higher than the barrier of a gate insulating layer are injectedfrom a semiconductor layer into the gate insulating layer or the like.Electrons gain energy by being accelerated by low electric field.

DAHC injection refers to a phenomenon in which electrons that receivesenergy caused by collision of electrons accelerated by a high electricfield are injected to a gate insulating layer or the like. A differencebetween DAHC injection and CHE injection is whether or not they involveavalanche breakdown caused by impact ionization. Note that DAHCinjection requires electrons having a kinetic energy higher than a bandgap of a semiconductor.

FIG. 6 illustrates energy required for each hot carrier injection whichis estimated from the band structure of silicon (Si), and FIG. 7illustrates energy required for each hot carrier injection which isestimated from the band structure of an In-Ga-Zn-O-based oxidesemiconductor (IGZO). In each of FIG. 6 and FIG. 7 , the left part showsCHE injection, and the right part shows DAHC injection.

Regarding silicon, degradation caused by DAHC injection is more seriousthan that caused by CHE injection. This results from the fact thatcarriers (e.g., electrons) which are accelerated without colliding arevery few in silicon whereas silicon has a narrow band gap and avalanchebreakdown readily occurs therein. The avalanche breakdown increases thenumber of electrons capable of travelling over the barrier of the gateinsulating layer, and the probability of DAHC injection readily becomeshigher than that of CHE injection.

Regarding an In-Ga-Zn-O-based oxide semiconductor, the energy requiredfor CHE injection does not greatly differ from that in the case ofsilicon, and the probability of CHE injection is still low. In addition,the energy required for DAHC injection is substantially equal to theenergy required for CHE injection due to a wide band gap.

In other words, in an In-Ga-Zn-O-based oxide semiconductor, theprobabilities of both CHE injection and DAHC injection are low and theresistance to hot carrier degradation is higher than that of silicon.

Meanwhile, the band gap of an In-Ga-Zn-O-based oxide semiconductor iscomparable to that of silicon carbide (SiC) which attracts attention asa material having a high withstand voltage. FIG. 8 illustrates energyrequired for each hot carrier injection regarding 4H-SiC. FIGS. 8 showsthe CHE injection and the DAHC injection. Regarding CHE injection, anIn-Ga-Zn-O-based oxide semiconductor has a slightly higher threshold andcan be said to have an advantage.

As described above, it can be seen that an In-Ga-Zn-O-based oxidesemiconductor has significantly higher resistance to hot carrierdegradation and higher resistance to source-drain breakdown thansilicon. It can also be said that a withstand voltage comparable to thatof silicon carbide can be obtained.

<Short-Channel Effect in Transistor Including Oxide Semiconductor>

Next, a short-channel effect in a transistor including an oxidesemiconductor will be described with reference to FIG. 9 and FIG. 10 .Note that the following description is based on the assumption of anideal situation for easy understanding and does not necessarily reflecta real situation. Note also that the following description is just aconsideration.

The short-channel effect refers to degradation of electriccharacteristics which becomes obvious with miniaturization of atransistor (a reduction in channel length (L)). The short-channel effectresults from the effect of a drain on a source. Specific examples of theshort-channel effect are a decrease in threshold voltage, an increase insubthreshold swing (S value), an increase in leakage current, and thelike.

Here, a structure capable of suppressing a short-channel effect isexamined by device simulation. Specifically, four kinds of models eachhaving a different carrier concentration and a different thickness of anoxide semiconductor layer were prepared, and the relationship between achannel length (L) and a threshold voltage (V_(t)h) was evaluated. Asthe models, bottom-gate transistors were employed, each of whichincluded an oxide semiconductor layer whose carrier concentration was1.7×10⁻⁸/cm³ or 1.0×10¹⁵/cm³ and thickness was 1 μm or 30 nm. Note thatan In-Ga-Zn-O-based oxide semiconductor was used for the oxidesemiconductor layer, and a silicon oxynitride film with a thickness of100 nm was used as a gate insulating layer. The oxide semiconductor wasassumed to have a band gap of 3.15 eV, an electron affinity of 4.3 eV, arelative permittivity of 15, and an electron mobility of 10 cm²/Vs. Therelative permittivity of the silicon oxynitride film was assumed to be4.0. The calculation was performed using device simulation software“ATLAS” produced by Silvaco Inc.

Note that there was no significant difference in calculation resultsbetween a top-gate transistor and a bottom-gate transistor.

FIG. 9 and FIG. 10 show calculation results. FIG. 9 shows the case wherethe carrier concentration is 1.7×10⁻⁸/cm³ and FIG. 10 shows the casewhere the carrier concentration is 1.0×10¹⁵/cm³. FIG. 9 and FIG. 10 eachshow the amount of shift (ΔV_(th)) in threshold voltage (V_(th)) when atransistor whose channel length (L) is 10 μm was used as a reference andchannel lengths (L) varied from 10 μm to 1 μm. As shown in FIG. 9 , inthe case where the carrier concentration in the oxide semiconductor was1.7×10⁻⁸/cm³ and the thickness of the oxide semiconductor layer was 1μm, the amount of shift (ΔV_(th)) in threshold voltage was −3.6 V. Asshown in FIG. 9 , in the case where the carrier concentration in theoxide semiconductor was 1.7×10⁻⁸/cm³ and the thickness of the oxidesemiconductor layer was 30 nm, the amount of shift (AN in thresholdvoltage was —0.2 V. As shown in FIG. 10 , in the case where the carrierconcentration in the oxide semiconductor was 1.0×10¹⁵/cm³ and thethickness of the oxide semiconductor layer was 1 μm, the amount of shift(ΔV_(th)) in threshold voltage was −3.6 V. As shown in FIG. 10 , in thecase where the carrier concentration in the oxide semiconductor was1.0×10¹⁵/cm³ and the thickness of the oxide semiconductor layer was 30nm, the amount of shift (ΔV_(th)) in threshold voltage was −0.2 V. Theresults show that a short-channel effect can be suppressed in atransistor including an oxide semiconductor by a reduction in thicknessof an oxide semiconductor layer. For example, in the case where thechannel length (L) is approximately 1 μm, even with an oxidesemiconductor layer having sufficiently high carrier concentration, itcan be understood that a short-channel effect can be sufficientlysuppressed when the thickness of the oxide semiconductor layer is set toapproximately 30 nm.

<Carrier Concentration>

A technical idea according to the disclosed invention is to make anoxide semiconductor layer as close as possible to an intrinsic (i-type)oxide semiconductor layer by sufficiently reducing the carrierconcentration thereof. A method for calculating the carrierconcentration and an actually measured carrier concentration will bedescribed with reference to FIG. 11 and FIG. 12 .

First, a method for calculating the carrier concentration is brieflyexplained. The carrier concentration can be calculated in such a mannerthat a MOS capacitor is manufactured and the results of C-V(capacitance-voltage) measurement (C-V characteristics) of the MOScapacitor are evaluated.

Specifically, carrier concentration Nd can be calculated in thefollowing manner: C-V characteristics are obtained by plotting therelationship between the gate voltage V_(G) and capacitance C of a MOScapacitor; a graph of the relationship between the gate voltage V_(G)and (1/C)² is obtained from the C-V characteristics; a differentialvalue of (1/C)² in a weak inversion region of the graph is found; andthe differential value is substituted into Formula 1. Note that e, ε₀,and ε in Formula 1 represent elementary electric charge, vacuumpermittivity, and relative permittivity of an oxide semiconductor,respectively.

$\begin{matrix}{N_{d} = {{- \left( \frac{2}{e\varepsilon_{0}\varepsilon} \right)}/\frac{{d\left( {1/C} \right)}^{2}}{dV}}} & (1)\end{matrix}$

Next, carrier concentration actually measured by the above method isdescribed. A sample (a MOS capacitor) used for the measurement wasformed as follows: a titanium film was formed to a thickness of 300 nmover a glass substrate; a titanium nitride film was formed to athickness of 100 nm over the titanium film; an oxide semiconductor layerincluding an In-Ga-Zn-O-based oxide semiconductor was formed to athickness of 2 μm over the titanium nitride film; a silicon oxynitridefilm was formed to a thickness of 300 nm over the oxide semiconductorlayer; and a silver film was formed to a thickness of 300 nm over thesilicon oxynitride film. Note that the oxide semiconductor layer wasformed using a metal oxide target for depositing an oxide semiconductorincluding In, Ga, and Zn (In:Ga:Zn=1:1:0.5 [atomic ratio]) by asputtering method. Further, an atmosphere in which the oxidesemiconductor layer was formed was a mixed atmosphere of argon andoxygen (with a flow ratio of Ar:O₂=30 (sccm): 15 (sccm)).

FIG. 11 and FIG. 12 illustrate the C-V characteristics and therelationship between V_(G) and (1/C)², respectively. Calculation usingFormula 1 with the differential value of (1/C)² in a weak inversionregion of the graph of FIG. 12 led to the carrier concentration of6.0×10¹⁰/cm³.

In this manner, by using an i-type or substantially i-type oxidesemiconductor (for example, with a carrier concentration of lower than1×10¹²/cm³, preferably lower than or equal to 1×10¹¹/cm³, furtherpreferably lower than 1.4×10¹⁰/cm³), a transistor with excellentoff-state current characteristics can be obtained.

In this embodiment, the first conductive layer and the second conductivelayer each include a conductive layer including copper as a maincomponent, whereby a semiconductor device in which wiring resistance isreduced can be provided. When the semiconductor device described in thisembodiment is applied to a display device with a large screen or adisplay device with high definition, delay of signal transmission to anend portion of a signal line, drop in voltage of a power supply line, orthe like is hardly caused. As a result, a display device in whichdeterioration of display quality such as display unevenness or a defectin grayscale is suppressed to improve display quality can be provided.

Further, with use of an oxide semiconductor layer which is highlypurified to have a carrier concentration lower than 1×10¹² cm⁻³, aswitching element having the positive threshold voltage, that is, aso-called normally off characteristic can be realized.

Furthermore, when an oxide semiconductor having a wide band gap which islarger than 2 eV is used for a transistor, off current can be reduced.For example, in the case where a reverse bias is applied to a MOSFET inwhich an In-Ga-Zn-O-based oxide semiconductor having a band gap of 3.15eV is used and a channel length is 10 μm, the leakage current is 1×10⁻¹⁶A/μm (per micrometer in the channel width) or lower. In addition, theratio of on current to off current is 10¹⁰ or higher, which issufficiently high.

As a result, a power-saving semiconductor device in which power is notconsumed in an off state and leakage current is suppressed can beprovided. Further, a semiconductor device with a high ratio between theon current and the off current can be provided. Further, a displaydevice with high contrast and high display quality can be provided.

With use of a highly purified oxide semiconductor layer, a semiconductordevice which has high electron field-effect mobility and operates athigh speed can be provided.

Further, since a wiring including copper as a main component is sealedwith nitride films, diffusion of copper is suppressed, so that asemiconductor device with higher reliability can be provided.

This embodiment can be freely combined with any of the other embodimentsin this specification.

Embodiment 2

In this embodiment, a manufacturing process of the semiconductor devicedescribed in Embodiment 1 will be described with reference to FIGS. 13Ato 13E. Note that cross sections A1-A2, B1-B2, and C1-C2 in FIGS. 13A to13E are cross-sectional views taken along chain lines A1-A2, B1-B2, andC1-C2 in FIG. 1A, respectively.

First, the base film 101 including silicon nitride is formed to athickness greater than or equal to 50 nm and less than or equal to 300nm, preferably greater than or equal to 100 nm and less than or equal to200 nm over the substrate 100. As the substrate 100, other than a glasssubstrate or a ceramic substrate, a plastic substrate or the like withheat resistance which can withstand a process temperature in thismanufacturing process can be used. In the case where the substrate doesnot need a light-transmitting property, a metal substrate such as astainless steel alloy substrate, provided with an insulating film on itssurface may be used. As the glass substrate, for example, an alkali-freeglass substrate of barium borosilicate glass, aluminoborosilicate glass,aluminosilicate glass, or the like may be used. Alternatively, a quartzsubstrate, a sapphire substrate, or the like can be used. Further, asthe substrate 100, a glass substrate with any of the following sizes canbe used: the 3rd generation (550 mm×650 mm), the 3.5th generation (600mm×720 mm or 620 mm×750 mm), the 4th generation (680×880 mm or 730mm×920 mm), the 5th generation (1100 mm×1300 mm), the 6th generation(1500 mm×1850 mm), the 7th generation (1870 mm×2200 mm), the 8thgeneration (2200 mm×2400 mm), the 9th generation (2400 mm×2800 mm or2450 mm×3050 mm), or the 10th generation (2950 mm×3400 mm).

In this embodiment, aluminoborosilicate glass is used for the substrate100.

The base film 101 can be formed as a single layer or a stacked layer ofa silicon nitride film and/or a silicon nitride oxide film. The basefilm 101 can be formed by a sputtering method, a CVD method, a coatingmethod, a printing method, or the like as appropriate. Note that thefilm may be doped with phosphorus (P) or boron (B).

In this embodiment, as the base film 101, a silicon nitride film isformed to a thickness of 100 nm by a PCVD method.

Next, the gate electrode 111 a, the storage capacitor wiring 111 b, andthe gate wiring 111 c are formed. First, over the base film 101, thefirst conductive layer including Cu is formed to a thickness greaterthan or equal to 100 nm and less than or equal to 500 nm, preferablygreater than or equal to 200 nm and less than or equal to 300 nm, by asputtering method, a vacuum evaporation method, or a plating method. Amask is formed over the conductive layer by a photolithography method,an ink jet method, or the like, and the first conductive layer is etchedwith use of the mask, so that the gate electrode 111 a, the storagecapacitor wiring 111 b, and the gate wiring 111 c are formed. In orderto improve adhesion between the base film 101 and the first conductivelayer, a layer including metal such as W, Ta, Mo, Ti, Cr, or the like,an alloy layer including any of these in combination, or a layer of anitride or an oxide of any of these may be formed in the firstconductive layer to be in contact with the base film 101.

Formation of the resist mask by an inkjet method needs no photomask;thus, manufacturing cost can be reduced. Alternatively, the gateelectrode 111 a, the storage capacitor wiring 111 b, and the gate wiring111 c can be formed at low cost by discharging a conductive nanopaste ofcopper or the like over the substrate by an inkjet method and baking theconductive nanopaste.

In this embodiment, a Cu film is formed with a thickness of 250 nm overthe base film 101, and the Cu film is selectively etched with use of aresist mask formed by a first photolithography step, so that the gateelectrode 111 a, the storage capacitor wiring 111 b, and the gate wiring111 c are formed.

Next, the first insulating layer 102 is formed. The first insulatinglayer 102 which functions as a gate insulating layer is formed to athickness greater than or equal to 50 nm and less than or equal to 800nm, preferably, greater than or equal to 100 nm and less than or equalto 600 nm, over the first conductive layer and the base film 101.

In this embodiment, a silicon nitride (SiN_(y) (y>0)) layer is depositedover the first conductive layer and the base film 101 by a sputteringmethod, so that the first insulating layer 102 with a thickness of 100nm is formed.

Note that an interface with the gate insulating layer is importantbecause an oxide semiconductor which becomes an i-type or substantiallyi-type oxide semiconductor (an oxide semiconductor which is highlypurified) by removal of an impurity is extremely sensitive to aninterface state density or an interface electric charge. Thus, higherquality is demanded for the insulating layer in contact with the highlypurified oxide semiconductor.

For example, high-density plasma CVD with use of microwaves (2.45 GHz)is preferably employed because formation of a dense and high-qualityinsulating film having high withstand voltage is possible. When thehighly purified oxide semiconductor and the high-quality gate insulatingfilm are in contact with each other, the interface state density can bereduced and favorable interface characteristics can be obtained.

In addition, since the insulating film formed using the high-densityplasma CVD apparatus can have a uniform thickness, the insulating filmhas excellent step coverage. In addition, in the insulating film formedusing the high-density plasma CVD apparatus, the thickness of a thinfilm can be controlled precisely. Note that in this specification, ahigh-density plasma CVD apparatus refers to an apparatus which canrealize a plasma density higher than or equal to 1×10¹¹/cm³.

Needless to say, if an insulating film that is favorable as a gateinsulating film can be formed, other film formation methods such as asputtering method and a plasma CVD method can be employed.Alternatively, an insulating film whose film quality and characteristicsof the interface with the oxide semiconductor are improved by heattreatment performed after formation of the insulating film may be used.In any case, any insulating film can be employed as long as it has areduced interface state density of the interface with the oxidesemiconductor and can form a favorable interface as well as having afavorable film quality for a gate insulating film.

Next, an oxide semiconductor film 103 is formed. The oxide semiconductorfilm 103 is formed to a thickness greater than or equal to 5 nm and lessthan or equal to 200 nm inclusive, preferably, greater than or equal to10 nm and less than or equal to 20 nm inclusive, over the firstinsulating layer 102 (see FIG. 13A).

In this embodiment, as the oxide semiconductor film, a 15-nm-thickIn-Ga-Zn-O-based non-single-crystal film is formed by a sputteringmethod using an In-Ga-Zn-O-based oxide semiconductor target.

Note that before the oxide semiconductor film 103 is formed, reversesputtering in which plasma is generated by introduction of an argon gasis preferably performed to remove dust attached to a surface of thefirst insulating layer 102. The reverse sputtering refers to a method inwhich an RF power supply is used for application of a voltage to asubstrate side in an argon atmosphere to generate plasma to modify asurface. Note that instead of an argon atmosphere, a nitrogenatmosphere, a helium atmosphere, or the like may be used. Alternatively,an argon atmosphere to which oxygen, N₂O, or the like is added may beused. Further alternatively, an argon atmosphere to which Cl₂, CF₄, orthe like is added may be used. After the reverse sputtering, the oxidesemiconductor film is formed without being exposed to air, whereby dustor moisture can be prevented from attaching to an interface between theoxide semiconductor film 103 and the first insulating layer 102.

As the oxide semiconductor film, the following oxide semiconductorswhich are also described in Embodiment 1 can be used: a four-componentmetal oxide such as an In-Sn-Ga-Zn-O-based oxide semiconductor; athree-component metal oxide such as an In-Ga-Zn-O-based oxidesemiconductor, an In-Sn-Zn-O-based oxide semiconductor, anIn-Al-Zn-O-based oxide semiconductor, a Sn-Ga-Zn-O-based oxidesemiconductor, an Al-Ga-Zn based oxide semiconductor, and aSn-Al-Zn-O-based oxide semiconductor; a two-component metal oxide suchas an In-Zn-O-based oxide semiconductor, a Sn-Zn-O-based oxidesemiconductor, an Al-Zn-O-based oxide semiconductor, a Zn-Mg-O-basedoxide semiconductor, a Sn-Mg-O-based oxide semiconductor, anIn-Mg-O-based oxide semiconductor; an In-O-based oxide semiconductor; aSn-O-based oxide semiconductor; and a Zn-O-based oxide semiconductor.Silicon oxide may be added to any of the above oxide semiconductors. Asthe oxide semiconductor film, a thin film represented by InMO₃(ZnO)_(m)(m>0) which is described above can be used.

Alternatively, the oxide semiconductor film can be formed by asputtering method in a rare gas (typically argon) atmosphere, an oxygenatmosphere, or an atmosphere including a rare gas (typically argon) andoxygen. In the case of using a sputtering method, film deposition may beperformed using a target containing SiO₂ at greater than or equal to 2percent by weight and less than or equal to 10 percent by weight andSiO_(x) (x>0) which inhibits crystallization may be contained in theoxide semiconductor film.

Here in this embodiment, the oxide semiconductor film is formed using anoxide semiconductor target, which contains In, Ga, and Zn (the ratio ofIn₂O₃ to Ga₂O₃ to ZnO is 1:1:1 or 1:1:2 in molar ratio) under conditionswhere the distance between the substrate and the target is 100 mm, thepressure is 0.6 Pa, and the direct current (DC) power is 0.5 kW, and theatmosphere is an oxygen atmosphere (the proportion of the oxygen flow is100%). Note that it is preferable to use a pulsed direct-current (DC)power source as a power source, with which dusts can be reduced and athickness distribution can be reduced.

In that case, the oxide semiconductor film is preferably formed whileremoving moisture remaining in the treatment chamber. This is forpreventing hydrogen, a substance having a hydroxyl group, or moisturefrom being contained in the oxide semiconductor film.

A multi-chamber sputtering apparatus used in this embodiment is providedwith a target of silicon or silicon oxide (artificial quarts), and atarget for the oxide semiconductor film. A deposition chamber providedwith the target for the oxide semiconductor film is further providedwith at least a cryopump as an evacuation unit. Note that a turbomolecular pump may be used instead of the cryopump, and a cold trap maybe provided so that moisture or the like may be adsorbed onto an inletof the turbo molecular pump.

From the chamber in which evacuation is performed with the use of acryopump, a hydrogen atom, a compound including a hydrogen atom such aswater (H₂O), a carbon atom, a compound including a carbon atom, or thelike, for example, is evacuated. Accordingly, the concentration of animpurity included in the oxide semiconductor film formed in thedeposition chamber can be reduced.

In addition, it is preferable that the oxide semiconductor film besuccessively formed over the first insulating layer 102.

As a sputtering gas used for deposition of the oxide semiconductor film,a high-purity gas is preferably used, in which an impurity such ashydrogen, water, a substance containing a hydroxyl group, or a hydrideis reduced to such a degree that the impurity concentration level isrepresented by the unit “ppm” or “ppb”.

The oxide semiconductor film may be formed under a condition where thesubstrate is heated. At this time, the substrate temperature is set athigher than or equal to 100° C. and lower than or equal to 600° C.,preferably higher than or equal to 200° C. and lower than or equal to400° C. Film formation is performed while the substrate is being heated,whereby the concentration of an impurity contained in the formed oxidesemiconductor film can be reduced.

Examples of a sputtering method include an RF sputtering method in whicha high-frequency power source is used as a sputtering power source, a DCsputtering method, and a pulsed DC sputtering method in which a bias isapplied in a pulsed manner. An RF sputtering method is mainly used inthe case of forming an insulating film, and a DC sputtering method ismainly used in the case of forming a metal conductive film.

In addition, there is also a multi-source sputtering apparatus in whicha plurality of targets of different materials can be set. With themulti-source sputtering apparatus, films of different materials can beformed to be stacked in the same chamber, or a film of plural kinds ofmaterials can be formed by electric discharge at the same time in thesame chamber.

In addition, there are a sputtering apparatus provided with a magnetsystem inside the chamber and used for a magnetron sputtering, and asputtering apparatus used for an ECR sputtering in which plasmagenerated with the use of microwaves is used without using glowdischarge.

Furthermore, as a deposition method by sputtering, there are also areactive sputtering method in which a target substance and a sputteringgas component are chemically reacted with each other during depositionto form a thin compound film thereof, and a bias sputtering in which avoltage is also applied to a substrate during deposition.

Next, by performance of a second photolithography step, a resist mask isformed, and the oxide semiconductor film 103 formed from anIn-Ga-Zn-O-based non-single-crystal film is etched into an island shape.In etching, for example, organic acid such as citric acid or oxalic acidcan be used for etchant. In the case where etching is performed so thatthe end portions of the island-shaped oxide semiconductor layer havetapered shapes, breakage of a wiring due to a step shape can beprevented. Note that etching here is not limited to wet etching and dryetching may also be performed.

Then, first heat treatment is performed on the substrate over which theisland-shaped oxide semiconductor layer is provided, so that theisland-shaped oxide semiconductor layer is dehydrated or dehydrogenated.

Note that in this specification, heat treatment in an atmosphere of aninert gas such as nitrogen, a rare gas, or the like is referred to asheat treatment for dehydration or dehydrogenation. In thisspecification, “dehydrogenation” does not indicate elimination of onlyH₂ by heat treatment. For convenience, elimination of H, OH, and thelike is called “dehydration or dehydrogenation”.

In this embodiment, as first heat treatment, the temperature of thesubstrate over which the island-shaped oxide semiconductor layer isprovided is heated to a temperature T. The temperature T is equal to orlower than 700° C. (or the temperature equal to or lower than a strainpoint of a glass substrate), preferably, equal to or higher than 350° C.and equal to or lower than 500° C., and the first heat treatment isperformed for about 1 minute to 10 minutes by RTA (rapid thermal anneal)treatment.

In the first heat treatment, the temperature of the substrate is changedover time as shown in FIG. 14A.

In a period (a-1), the atmosphere including the substrate is a nitrogenatmosphere, the substrate temperature is increased to the temperature Tand then kept at the temperature T, and after that, the substratetemperature is decreased in a nitrogen atmosphere. In the subsequentperiod (a-2), the atmosphere including the substrate is changed from anitrogen atmosphere to an oxygen atmosphere or a dry air atmosphere.Then, the substrate temperature is increased to the temperature T andkept at the temperature T, and after that, the substrate temperature isdecreased in an oxygen atmosphere or a dry air atmosphere.

Note that the process during the period (a-1) and the process during theperiod (a-2) may be performed in different apparatuses from each other.When the processes are concurrently performed with the differentapparatuses, the process time can be shortened.

Alternatively, in the first heat treatment, the substrate temperaturemay be changed over time as shown in FIG. 14B.

In a period (b-1), the atmosphere including the substrate is a nitrogenatmosphere, and the substrate temperature is increased to thetemperature T and kept at the temperature T. In the subsequent period(b-2), the atmosphere including the substrate is changed from a nitrogenatmosphere to an oxygen atmosphere or a dry air atmosphere while keepingthe substrate temperature at the temperature T, and then the substratetemperature is held at the temperature T. After that, the substratetemperature may be decreased in an oxygen atmosphere or a dry airatmosphere.

Note that, when the process during the period (b-1) and the processduring the period (b-2) are performed in one apparatus, the time fordelivering the substrate can be shortened, which is preferable.

The inert gas atmosphere used in the first heat treatment is preferablyan atmosphere which contains nitrogen or a rare gas (e.g., helium, neon,or argon) as its main component and does not contain water, hydrogen, orthe like. Alternatively, the purity of an inert gas which is introducedinto a heat treatment apparatus is preferably 6N (99.9999%) or more,more preferably 7N (99.99999%) or more (that is, the impurityconcentration is 1 ppm or less, preferably 0.1 ppm or less).

Further, oxygen or dry air introduced into the heat treatment apparatusis preferably a high-purity oxygen gas or an ultra dry air (having a dewpoint of −40° C. or lower, preferably −60° C. or lower), respectively.

When the oxide semiconductor layer is dehydrated or dehydrogenated, itis important not to expose the oxide semiconductor layer to air and notto enter water or hydrogen into the oxide semiconductor layer.

The heat treatment apparatus used for the first heat treatment may be anelectric furnace, an apparatus that heats an object with thermalconduction or thermal radiation given by a medium such as a heated gas,or the like. For example, an RTA (rapid thermal anneal) apparatus suchas a GRTA (gas rapid thermal anneal) apparatus or an LRTA (lamp rapidthermal anneal) apparatus can be used. An LRTA apparatus is an apparatusfor heating an object to be processed by radiation of light (anelectromagnetic wave) emitted from a lamp such as a halogen lamp, ametal halide lamp, a xenon arc lamp, a carbon arc lamp, a high pressuresodium lamp, or a high pressure mercury lamp.

Since dehydration or dehydrogenation can be performed in a short timewith a RTA method, the first heat treatment can be performed even at atemperature over the strain point of a glass substrate. A GRTA apparatusis an apparatus for performing heat treatment using a high-temperaturegas.

Note that the timing of the first heat treatment is not limited to thistiming and may be performed plural times, for example, before and afterthe photolithography step or the deposition step.

In the oxide semiconductor layer which is sufficiently dehydrated ordehydrogenated under the above conditions, at least one of the two peaksat around 250° C. to 300° C. in spectra which show discharge of moistureis not detected with thermal desorption spectroscopy (TDS) even when thetemperature of the dehydrated or dehydrogenated oxide semiconductorlayer is increased to 450° C.

The oxide semiconductor layer which is in a just deposited state is anamorphous layer having many dangling bonds. By performance of the firstheat treatment for the dehydration or dehydrogenation, dangling bondswithin a short distance are bonded to each other, so that the oxidesemiconductor layer can have an ordered amorphous structure. As orderingproceeds, the oxide semiconductor layer comes to be formed of a mixtureof amorphousness and microcrystals, where an amorphous region is dottedwith microcrystals.

Further, by the first heat treatment in a nitrogen atmosphere, the oxidesemiconductor layer becomes of oxygen-deficient type, as well as beingdehydrated or dehydrogenated, and resistance of the oxide semiconductorlayer is reduced, so that the oxide semiconductor layer becomes a n-type(such as n⁻-type or n+-type) layer. For example, by performance of thefirst heat treatment in a nitrogen atmosphere, the carrier concentrationof the oxide semiconductor layer is higher than that of the oxidesemiconductor layer which is just after deposition, which is preferably1×10¹⁸/cm³ or higher.

The oxide semiconductor layer which is of n-type (such as n⁻-type orn⁺-type) is subjected to treatment in which heating and sequentialcooling are performed in an oxygen atmosphere or a dry air atmosphere,whereby oxygen is supplied to the oxygen-deficient portion. The oxidesemiconductor layer in which oxygen is supplied to the oxygen-deficientportion has increased resistance; that is, the oxide semiconductor layerbecomes an i-type layer.

Through the above steps, the oxide semiconductor layers 113 a and 113 bwhich are highly purified are obtained. A transistor including thehighly purified oxide semiconductor layer 113 a has a positive thresholdvoltage and realizes a so-called normally off switching element.

Among the electric characteristics of the transistor, the thresholdvoltage (V_(th)) is particularly important. When the threshold voltagevalue is high or is on the minus side even when the field effectmobility is high, it is difficult to control the circuit. In the case ofa transistor where the threshold voltage is high and an absolute valueof the threshold voltage is large, the transistor cannot function as aswitching and might be a load when the transistor is driven at lowvoltage.

In the case of an n-channel transistor, it is desirable that only aftera positive voltage is applied as a gate voltage, a channel be formed anda drain current flows. A transistor in which a channel is not formedunless the driving voltage is increased and a transistor in which achannel is formed and drain current flows even in the case of thenegative voltage state are unsuitable for a transistor used for acircuit. If the threshold voltage of the transistor is negative, ittends to be normally on; in other words, current flows between thesource electrode and the drain electrode even when the gate voltage is 0V.

As for an active-matrix display device, electric characteristics of atransistor included in a circuit are significantly important andperformance of the display device depends on the electriccharacteristics. In the case of using the transistor for a displaydevice, it is desirable for a display device that a channel be formed byapply of a positive threshold voltage which is as close to 0V aspossible to a gate.

The first heat treatment of the oxide semiconductor layer can beperformed on the oxide semiconductor film 103 which has not yet beenprocessed into the island-shaped oxide semiconductor layer. In thatcase, after performance of the first heat treatment, the substrate istaken out from the heat apparatus, and then a photolithography step isperformed to process the oxide semiconductor film into the island-shapedoxide semiconductor layer.

Further, before formation of a second conductive layer including Cu, thefirst insulating layer 102 may be selectively etched, so that a contacthole reaching the first conductive layer is formed. In the case wherethe second conductive layer is formed after the contact hole reachingthe first conductive layer is formed, the first conductive layer and thesecond conductive layer can be connected to each other not throughanother conductive layer but directly. When the number of contact holesneeded for a connection is small, electric resistance can be reduced andthe area occupied by the contact hole can also be reduced.

Next, the second conductive layer including Cu is formed. The secondconductive layer including Cu is formed to have a thickness greater thanor equal to 100 nm and less than or equal to 500 nm, preferably greaterthan or equal to 200 nm and less than or equal to 300 nm over the oxidesemiconductor layers 113 a and 113 b and the first insulating layer by asputtering method, a vacuum evaporation method, or a plating method.Then, a mask is formed by a photolithography method, an inkjet method,or the like over the conductive layer, and the second conductive layeris etched with use of the mask, so that the first electrode 115 a andthe second electrode 115 b which function as source and drain electrodesand the source wiring 115 c are formed.

In this embodiment, a 250-nm-thick Cu film is formed over the oxidesemiconductor layers 113 a and 113 b and the first insulating layer.Then, the Cu film is selectively etched with use of a resist mask formedby a third photolithography step, so that the first electrode 115 a andthe second electrode 115 b which function as source and drain electrodesand the source wiring 115 c are formed.

Note that an exposed region of the oxide semiconductor layer issometimes etched in the third photolithography step depending on theetching conditions. In that case, the oxide semiconductor layer in aregion over the gate electrode 111 a which does not overlap with thefirst electrode 115 a or the second electrode 115 b has a thicknesssmaller than the oxide semiconductor layer in a region which overlapswith the first electrode 115 a or the second electrode 115 b (see FIG.13C).

Note that copper oxide is generated on a surface of a Cu film which isin contact with the oxide semiconductor layer, by heat applied in amanufacturing step of a semiconductor device described in thisembodiment. However, copper oxide does not block electrical connectionbecause it is a semiconductor.

Next, the second insulating layer 107 is formed. The second insulatinglayer 107 includes at least a silicon nitride film and is formed withuse a method by which an impurity such as water or hydrogen is notincorporated (e.g., a sputtering method or the like) so as not tocontaminate the highly purified oxide semiconductor layer.

In this embodiment, a silicon nitride (SiN_(y) (y>0)) layer is formed asthe second insulating layer 107 to be in contact with the firstelectrode 115 a and the second electrode 115 b, the source wiring 115 c,the first insulating layer 102, and the oxide semiconductor layer. Thesilicon nitride (SiN_(y) (y>0)) layer is formed, for example, by an RFsputtering method with use of a silicon nitride target in a rare gas(such as an argon gas) to have a thickness of 400 nm.

Deposition of a silicon nitride film is performed by a sputtering methodwith use of a high-purity gas and a sputtering apparatus provided with acryopump. Note that a nitride insulating film formed by a sputteringmethod is distinctively dense and even a single layer of the nitrideinsulating film can be used as a protective film for suppressing aphenomenon in which an impurity is diffused into a layer in contacttherewith.

At this stage, a region where the oxide semiconductor layer and thesecond insulating layer 107 are in contact with each other is formed. Aregion of the oxide semiconductor layer which overlaps with the gateelectrode and is in contact with and interposed between the firstinsulating layer 102 and the second insulating layer 107 is a channelformation region. Further, the second insulating layer 107 functions asa channel protective layer (see FIG. 13D).

Next, second heat treatment is performed in an inert gas atmosphere oran oxygen gas atmosphere. The temperature of the heat treatment ishigher than or equal to 200° C. and lower than or equal to 400° C.,preferably higher than or equal to 250° C. and lower than or equal to350° C. For example, the heat treatment may be performed in a nitrogenatmosphere at 250° C. for one hour. The second heat treatment can reducevariation in electric characteristics of the transistor. Note that inthis embodiment, the second heat treatment is performed after the secondinsulating layer 107 is formed; however, the timing of performance ofthe second heat treatment is not particularly limited as long as it isperformed after the first heat treatment.

Next, the third insulating layer 108 is formed to a thickness greaterthan or equal to 50 nm and less than or equal to 300 nm, preferablygreater than or equal to 100 nm and less than or equal to 200 nm. Themethod for the formation of the third insulating layer 108 is notlimited to a particular method, and the following method can be useddepending on the material: a sputtering method, an SOG method, spincoating, dip coating, spray coating, a droplet discharge method (e.g.,an inkjet method, screen printing, or offset printing), or the like.

In the case where the third insulating layer 108 is formed by coating amaterial solution and performing baking, the second heat treatment (athigher than or equal to 200° C. and lower than or equal to 400° C.,preferably higher than or equal to 250° C. and lower than or equal to350° C.) may be performed in this baking step. When the baking of thethird insulating layer 108 and the annealing of the oxide semiconductorlayer are performed at the same time, a semiconductor device can bemanufactured efficiently.

Next, a contact hole 128 for connecting the second electrode 115 b andthe first pixel electrode 109 is formed in the second insulating layer107 and the third insulating layer 108. The contact hole is formed byforming a mask over the third insulating layer 108 by a photolithographymethod, an inkjet method, or the like, and then selectively etching thesecond insulating layer 107 and the third insulating layer 108 using themask. In this embodiment, the second insulating layer 107 and the thirdinsulating layer 108 are selectively etched using a resist mask formedby a fourth photolithography step, whereby the contact hole 128 isformed.

Then, the first pixel electrode 109 is formed. First, a conductive filmtransmitting visible light is formed with a thickness greater than orequal to 30 nm and less than or equal to 200 nm, preferably greater thanor equal to 50 nm and less than or equal to 100 nm by a sputteringmethod, a vacuum evaporation method, or the like to be in contact withthe third insulating layer 108 and the second electrode 115 b throughthe contact hole 128. A mask is formed over the conductive film by aphotolithography method, an inkjet method, or the like, and theconductive film is etched with use of the mask, so that the first pixelelectrode 109 is formed.

In this embodiment, a 80-nm-thick indium tin oxide (hereinafter, alsoreferred to as ITO) film is formed as the conductive film transmittingvisible light, and then the conductive film transmitting visible lightis selectively etched using a resist mask formed by a fifthphotolithography step, whereby the first pixel electrode 109 is formed(see FIG. 13E).

For the conductive film transmitting visible light, a light-transmittingconductive material such as indium oxide including tungsten oxide,indium zinc oxide including tungsten oxide, indium oxide includingtitanium oxide, indium tin oxide including titanium oxide, ITO, indiumzinc oxide, or indium tin oxide to which silicon oxide is added can beused.

Alternatively, the conductive film transmitting visible light can beformed using a conductive composition including a conductive highmolecule (also referred to as a conductive polymer). The pixel electrodeformed using a conductive composition desirably has a sheet resistanceof less than or equal to 10000 ohms per square and a light transmittanceof more than or equal to 70% at a wavelength of 550 nm. Further, theresistivity of the conductive high molecule included in the conductivecomposition is preferably less than or equal to 0.1 Ω·cm.

In this embodiment, an oxide semiconductor layer from which an impuritytypified by a hydrogen atom or a compound including a hydrogen atom suchas H₂O is removed with use of a high-purity gas, a cryopump, and thelike is formed, and the oxide semiconductor layer is subjected to firstheat treatment to be highly purified, so that an oxide semiconductorlayer in which the carrier concentration is further reduced can beformed. As a result, a transistor can be formed by using an intrinsic orsubstantially intrinsic oxide semiconductor (for example, in which thecarrier concentration is lower than 1×10¹²/cm³, preferably 1×10¹¹/cm³ orlower), whereby a transistor with a significantly excellent off currentcharacteristic can be provided.

In addition, in this embodiment, dehydration or dehydrogenation which isperformed by the first heat treatment in an inert gas atmosphere, andsupply of oxygen to the oxygen-deficient portion which is performed inan oxygen atmosphere or a dry air atmosphere are conducted insuccession, whereby the process time can be shortened.

This embodiment can be freely combined with any of the other embodimentsin this specification.

Embodiment 3

In this embodiment, one embodiment of a substrate provided with acircuit of a display device which has a structure different from that ofEmbodiment 1 will be described with reference to FIGS. 15A and 15B.

A structure of a pixel in the display device is illustrated in FIGS. 15Aand 15B. FIG. 15A is a top view illustrating a plan structure of thepixel, and FIG. 15B is a cross-sectional view illustrating a stackedstructure in the pixel. Note that chain lines A1-A2, B1-B2, and C1-C2 inFIG. 15A correspond to cross sections A1-A2, B1-B2, and C1-C2 in FIG.15B, respectively.

In the cross section A1-A2, a stacked structures in a transistor 152used in the pixel portion is illustrated. The transistor 152 is oneembodiment of a transistor having a bottom gate structure.

In the cross section B1-B2, a stacked structure in a capacitor formed inthe pixel portion is illustrated.

Further, in the cross section C1-C2, a stacked structure in anintersection portion of a gate wiring and a source wiring isillustrated.

The substrate provided with a circuit of a display device described inthis embodiment has a difference in structures of the first insulatinglayer 102, the second insulating layer 107, and the second conductivelayer from those of the substrate provided with a circuit of a displaydevice described in Embodiment 1. In addition, a structure of theintersection portion of the gate wiring and the source wiring isdifferent.

Specifically, the first insulating layer 102 is a stacked layer of aninsulating layer 102 a and an insulating layer 102 b, and the secondinsulating layer 107 is a stacked layer of an insulating layer 107 a andan insulating layer 107 b. A layer including copper as a main componentwhich is included in the second conductive layer is in contact with abarrier layer. In the intersection portion of the gate wiring and thesource wiring, the first insulating layer 102 is interposed between thegate wiring 111 c formed using the first conductive layer and the sourcewiring 115 c formed using the second conductive layer.

The substrate provided with a circuit of a display portion described inthis embodiment has the same structure as the substrate provided with acircuit of a display portion described in Embodiment 1 except for thefirst insulating layer 102, the second insulating layer 107, the barrierlayer in contact with a layer including copper as a main component whichis included in the second conductive layer, and the structure of theintersection portion of the gate wiring and the source wiring; thus, thedetailed description is omitted.

In this embodiment, the first insulating layer 102 includes two layers.A silicon nitride (SiN_(y) (y>0)) layer is used for the insulating layer102 a which is in contact with the first conductive layer includingcopper as a main component and the base film 101, and a silicon oxide(SiO_(x) (x>0)) layer is used for the insulating layer 102 b which is incontact with the oxide semiconductor layer. The thickness of the firstinsulating layer 102 is 100 nm.

The first insulating layer 102 functions as a gate insulating layer andis formed over the first conductive layer and the base film 101 to havea thickness greater than or equal to 50 nm and less than or equal to 800nm, preferably greater than or equal to 100 nm and less than or equal to600 nm.

The first conductive layer including copper as a main component isformed between two silicon nitride films which are the base film 101 andthe insulating layer 102 a, whereby diffusion of copper can besuppressed.

The oxide semiconductor which becomes an i-type or becomes substantiallyi-type semiconductor (an oxide semiconductor which is highly purified)due to removal of an impurity is extremely sensitive to an interfacestate density or an interface electric charge; thus, an interface withthe gate insulating film is important. Therefore, the insulating layer102 b that is in contact with the highly purified oxide semiconductorneeds to have higher quality.

For example, high-density plasma CVD with use of microwaves (2.45 GHz)is preferably employed since formation of a dense and high-qualityinsulating film having high withstand voltage is possible. When thepurified oxide semiconductor and the high-quality gate insulating filmare in contact with each other, the interface state density can bereduced and favorable interface characteristics can be obtained.

In addition, since the insulating film formed with use of thehigh-density plasma CVD apparatus can have a uniform thickness, theinsulating film has excellent step coverage. In addition, in theinsulating film formed with use of the high-density plasma CVDapparatus, the thickness of a thin film can be controlled precisely.

If an insulating film that is favorable as a gate insulating film can beformed, other film formation methods such as a sputtering method and aplasma CVD method can be employed. Alternatively, an insulating filmwhose film quality and characteristics of the interface with the oxidesemiconductor are improved by heat treatment performed after formationof the insulating film may be used. In any case, any insulating film canbe employed as long as it has a reduced interface state density of theinterface with the oxide semiconductor and can form a favorableinterface as well as having a favorable film quality for a gateinsulating film.

In this embodiment, in the case where the insulating layer 102 b isformed with use of a high-density plasma CVD apparatus (in thisspecification, the high-density plasma CVD apparatus indicates a devicewhich can achieve the plasma density of 1×10¹¹/cm³ or higher), plasma isgenerated by application of a microwave power of 3 kW to 6 kW, forexample, so that the insulating film is formed.

A monosilane gas (SiH4), nitrous oxide (N₂O), and a rare gas areintroduced into a chamber as a source gas to generate high-densityplasma at a pressure of 10 Pa to 30 Pa so that an insulating film isformed over a substrate having an insulating surface, such as a glasssubstrate. After that, the supply of a monosilane gas is stopped, andnitrous oxide (N₂O) and a rare gas are introduced without exposure toair, so that plasma treatment may be performed on a surface of theinsulating film. The plasma treatment performed on the surface of theinsulating film by introducing nitrous oxide (N₂O) and a rare gas isperformed at least after the insulating film is formed. The insulatingfilm formed through the above process procedure has small thickness andcorresponds to an insulating film whose reliability can be ensured eventhough it has a thickness less than 100 nm, for example.

In forming the insulating layer 102b, the flow ratio of a monosilane(SiH₄) gas to nitrous oxide (N₂O) which are introduced into the chamberis in the range of 1:10 to 1:200. In addition, as a rare gas which isintroduced into the chamber, helium, argon, krypton, xenon, or the likecan be used. In particular, argon which is inexpensive is preferablyused.

In addition, since the insulating film formed by using the high-densityplasma apparatus can have uniform thickness, the insulating film hasexcellent step coverage. Further, in the insulating film formed by usingthe high-density plasma apparatus, the thickness of a thin film can becontrolled precisely.

The insulating film formed through the above process procedure isgreatly different from the insulating film formed using a conventionalparallel plate plasma CVD apparatus. The etching rate of the insulatingfilm formed through the above process procedure is lower than that ofthe insulating film formed using the conventional parallel plate plasmaCVD apparatus by 10% or more or 20% or more in the case where theetching rates with the same etchant are compared to each other. Thus, itcan be said that the insulating film formed using the high-densityplasma apparatus is a dense film.

Alternatively, a silicon oxide layer formed by CVD using an organosilanegas can be used for the insulating layer 102 b. As an organosilane gas,a silicon-containing compound such as tetraethoxysilane (TEOS) (chemicalformula: Si(OC₂H₅)₄), tetramethylsilane (TMS) (chemical formula:Si(CH₃)₄), tetramethylcyclotetrasiloxane (TMCTS),octamethylcyclotetrasiloxane (OMCTS), hexamethyldisilazane (HMDS),triethoxysilane (chemical formula: SiH(OC₂H₅)₃), ortrisdimethylaminosilane (chemical formula: SiH(N(CH₃)₂)₃) can be used.

In this embodiment, the layer including copper as a main component whichis included in the second conductor layer is in contact with the barrierlayers, and tantalum nitride which is a conductive metal nitride is usedfor the barrier layers. Specifically, the first electrode 115 a, thesecond electrode 115 b, and the source wiring 115 c which are formedusing the second conductive layer each have a structure in which a layerincluding copper as a main component is stacked between tantalum nitridelayers.

The barrier layer may be formed using a material which suppressesdiffusion of copper, particularly, metal nitride. Note that if the firstinsulating layer 102 or the second insulating layer 107 which is incontact with the layer including copper as a main component is formedusing metal nitride, such insulating layers may function as a barrierlayer.

In particular, the barrier layer which is in contact with the oxidesemiconductor layer 113 a is formed using a metal nitride havingconductivity. For example, titanium nitride, tantalum nitride, tungstennitride, or the like can be used for the barrier layer. The oxidesemiconductor layer 113 a and the layer including copper as a maincomponent which is included in the second conductive layer are stackedwith the conductive barrier layer interposed therebetween, wherebydiffusion of copper can be suppressed and the oxide semiconductor layer113 a and the layer including copper as a main component which isincluded in the second conductive layer can be electrically connected.

The barrier layer of the second conductive layer is formed over theoxide semiconductor layers 113 a and the first insulating layer 102, andthe layer including copper as a main component is formed to be incontact with the barrier layer. The second conducive layer is formed toa thickness greater than or equal to 100 nm and less than or equal to500 nm, preferably greater than or equal to 200 nm and less than orequal to 300 nm, by a sputtering method, a vacuum evaporation method, aplating method, or the like.

Next, a mask is formed over the second conductive layer by aphotolithography method, an inkjet method, or the like, and the etchingis performed with use of the mask, so that the first electrode 115 a andthe second electrode 115 b which function as source and drain electrodesand the source wiring 115 c are formed.

In this embodiment, the second insulating layer 107 has a stacked layerof the insulating layer 107 a and the insulating layer 107 b. Theinsulating layer 107 a in contact with the barrier layer of the secondconductive layer and the oxide semiconductor layer is formed using asilicon oxide (SiO_(x) (x>0)) layer, and the insulating layer 107 b incontact with the insulating layer 107 a is formed using a siliconnitride (SiN_(y) (y>0)) layer with a thickness of 400 nm.

As a method for forming the second insulating layer 107, a method bywhich an impurity such as water or hydrogen is not incorporated (e.g., asputtering method or the like) is selected so as not to contaminate thehighly purified oxide semiconductor layer.

The insulating layer 107 a is formed by a pulsed DC sputtering methodusing a columnar polycrystalline silicon target doped with boron (theresistivity is 0.01 Ωcm) with a purity of 6 N under conditions where thedistance between the substrate and the target (T-S distance) is 89 mm,the pressure is 0.4 Pa, the direct-current (DC) power is 6 kW, and theatmosphere is an oxygen atmosphere (the proportion of the oxygen flow is100%). The thickness thereof is 300 nm.

The substrate temperature in film formation may be higher than or equalto room temperature and lower than or equal to 300° C. and in thisembodiment, is 100° C.

Formation of the silicon oxide layer by a sputtering method is performedwith use of a high-purity gas and a sputtering apparatus provided with acryopump. The sputtering method can be carried out in a rare gas(typically argon) atmosphere, an oxygen atmosphere, or an atmosphereincluding a rare gas (typically argon) and oxygen. Note that the oxideinsulating film formed by a sputtering method is distinctively dense,and even a single layer of the oxide insulating film can be used as aprotective film for suppressing a phenomenon in which an impurity isdiffused into a layer in contact therewith.

As a target, a silicon oxide target or a silicon target may be used. Inaddition, a target doped with phosphorus (P) or boron (B) can be used sothat phosphorus (P) or boron (B) is added to the oxide insulating film.

Note that in the case where the oxide insulating film is used for theinsulating layer 107 a in contact with the oxide semiconductor layer,for example, in the case where a silicon oxide (SiO_(x) (x>0)) layerwith a thickness of 1 nm or more is formed, a silicon target ispreferably used. A silicon oxide film formed by sputtering in an oxygenand rare gas atmosphere by using the silicon target contains a largenumber of dangling bonds of silicon atoms or oxygen atoms.

The impurity left in the oxide semiconductor layer diffuses into theinsulating layer 107 a including a large number of dangling bonds ofsilicon atoms or oxygen atoms and is fixed. Specifically, a hydrogenatom, a compound including a hydrogen atom such as H2O, or the like inthe oxide semiconductor layer is likely to diffuse and move into theinsulating layer 107 a and fixed in the insulating layer 107 a.

At this stage, a region where the oxide semiconductor layer is incontact with the insulating layer 107 a is formed. A region of the oxidesemiconductor layer, which overlaps with the gate electrode andsandwiched between and in contact with the insulating layer 102 b andthe insulating layer 107 a, functions as a channel formation region.Further, the second insulating layer 107 functions as a channelprotective layer.

Note that in this embodiment, the insulating layer 107 b is formed by anRF sputtering method.

In this embodiment, the layer including copper as a main component whichis included in the second conductive layer is in contact with thebarrier layer; thus, diffusion of copper is suppressed. In addition, theoxide semiconductor layer and the layer including copper as a maincomponent which is included in the second conductive layer are stackedwith the conductive barrier layer interposed therebetween, wherebydiffusion of copper can be suppressed and the oxide semiconductor layercan be electrically connected to the layer including copper as a maincomponent which is included in the second conductive layer.

An oxide insulating layer is used for the second insulating layer whichis on the side in contact with the oxide semiconductor layer, wherebyoxygen deficiency in the oxide semiconductor layer can be reduced.

This embodiment can be freely combined with any of the other embodimentsin this specification.

Embodiment 4

In this embodiment, with reference to FIGS. 16A to 16C, described is anexample in which an inverter circuit is formed using two transistorswith four-terminal structure in which a pair of electrode layers areprovided over and below a channel formation region of an oxidesemiconductor layer with insulating films therebetween. A transistorillustrated in FIG. 16A can be manufactured by the same method as thetransistor 151 illustrated in FIGS. 1A and 1B in Embodiment 1. Note thatthe inverter circuit of this embodiment can be used for a driver circuitfor driving a pixel portion.

The driver circuit for driving a pixel portion is provided in theperiphery of the pixel portion, for example, and formed using aninverter circuit, a capacitor, a resistor, and the like. As one ofembodiments of the inverter circuit, the inverter circuit is formed bycombination of two n-channel transistors. For example, there are aninverter circuit having a combination of an enhancement type transistorand a depletion type transistor (hereinafter, referred to as an EDMOScircuit) and an inverter circuit having a combination of two enhancementtype transistors (hereinafter, referred to as an EEMOS circuit).

FIG. 16A illustrates a cross-sectional structure of the inverter circuitof the driver circuit. A first transistor 440A includes a base film overa substrate 400, a gate electrode 421 a formed using a first conductivelayer over the base film, and an oxide semiconductor layer 404 aincluding a channel formation region which is over the gate electrode421 a and in contact with a first insulating layer 402. In addition, thefirst transistor 440A includes a first electrode 455 a and a secondelectrode 455 b formed using a second conductive layer, each of whichhas an end portion over and overlapping with the gate electrode 421 aand is in contact with the oxide semiconductor layer 404 a. Note thatthe first electrode 455 a and the second electrode 455 b each serve as asource electrode or a drain electrode of the first transistor 440A.Moreover, a second insulating layer 428 is provided over the firstelectrode 455 a, the second electrode 455 b, the first insulating layer402, and the oxide semiconductor layer 404 a, and an electrode 422 aformed using a third conductive layer is provided over the secondinsulating layer 428.

A second transistor 440B includes a base film over the substrate 400, agate electrode 421 b formed using the first conductive layer over thebase film, and an oxide semiconductor layer 404 b including a channelformation region which is over the gate electrode 421 b and in contactwith the first insulating layer 402. In addition, the second transistor440B includes a third electrode 455 c and a fourth electrode 455 dformed using the second conductive layer, each of which has an endportion over and overlapping with the gate electrode 421 b and is incontact with the oxide semiconductor layer 404 b. Note that the thirdelectrode 455 c and the fourth electrode 455 d each serve as a sourceelectrode or a drain electrode of the second transistor 440B. Moreover,the second insulating layer 428 is provided over the third electrode 455c, the fourth electrode 455 d, the first insulating layer 402, and theoxide semiconductor layer 404 b, and an electrode 422 b formed using thethird conductive layer is provided over the second insulating layer 428.

Note that in the first transistor 440A and the second transistor 440B,the second electrode 455 b and the third electrode 455 c are connectedthrough a second wiring 410 b. The third electrode 455 c is connected tothe gate electrode 421 b of the second transistor 440B through a contacthole 408.

The first transistor 440A and the second transistor 440B can be formedin a manner similar to the transistor described in Embodiment 2; thus,the detailed description of the manufacturing method is omitted. Notethat after the contact hole 408 is formed in the first insulating layer402, the second conductive layer is provided, whereby the second wiring410 b connected to the third electrode 455 c is directly connected tothe gate electrode 421 b through the contact hole 408. Such a structureis preferable. Since the number of contact holes needed for a connectionis small, electric resistance is reduced and the area occupied by thecontact hole can also be reduced. Note that the second electrode 455 b,the third electrode 455 c, and the second wiring 410 b are formed usingthe second conductive layer and electrically connected to one another.

A first wiring 410 a connected to the first electrode 455 a of the firsttransistor 440A is a power supply line to which a negative voltage VDLis applied (a negative power supply line). This power supply line may bea power supply line with a ground potential (a ground potential powersupply line).

A third wiring 410 c connected to the fourth electrode 455 d of thesecond transistor 440B is a power supply line to which a positivevoltage VDH is applied (a positive power supply line).

FIG. 16C is a top view of the inverter circuit of the driver circuit. InFIG. 16C, a cross section taken along chain line Z1-Z2 corresponds toFIG. 16A.

An equivalent circuit of the EDMOS circuit is illustrated in FIG. 16B.The circuit connection in FIG. 16A corresponds to FIG. 16B. An examplein which the first transistor 440A is an enhancement type n-channeltransistor and the second transistor 440B is a depletion type n-channeltransistor is illustrated. The term “OS” in FIG. 16B indicates a thinfilm transistor in which an oxide semiconductor is used

In this embodiment, in order to control the threshold voltages of thefirst transistor 440A and the second transistor 440B, electrodes formedusing the third conductive layer are provided over the channel formationregions of the highly purified oxide semiconductor layers with aninsulating film interposed therebetween. Specifically, voltages areapplied to the electrode 422 a and the electrode 422 b so that the firsttransistor 440A can be an enhancement type transistor and the secondtransistor 440B can be a depletion type transistor.

Note that an example in which the second wiring 410 b is directlyconnected to the gate electrode 421 b through the contact hole 408formed in the first insulating layer 402 is illustrated in FIGS. 16A and16C; however, a connection electrode may be additionally provided,thereby electrically connecting the second wiring 410 b and the gateelectrode 421 b without being particularly limited to the above example.

As described above, the inverter circuit can be formed to have astructure in which the threshold value of the transistor is controlledby providing an electrode layer over the channel formation region of theoxide semiconductor layer with the insulating film therebetween. Thethreshold value of the transistor is controlled with a dual gatestructure, whereby an enhancement type transistor and the depletion typetransistor can be formed over one substrate without forming oxidesemiconductor films separately; thus, the manufacturing process issimple.

Further, with use of a transistor with high field effect mobility inwhich the highly purified oxide semiconductor is included and a copperwiring having high conductivity, an inverted circuit with excellentdynamic characteristics can be provided.

This embodiment can be freely combined with any of the otherembodiments.

Embodiment 5

In this embodiment, an example in which a pixel portion, a transistordisposed in the pixel portion, and at least part of a driver circuit fordriving the pixel portion are manufactured over one substrate will bedescribed below.

A pixel portion and a transistor disposed in the pixel portion areformed according to any of Embodiments 1 to 3. Further, the transistorsdescribed in Embodiments 1 to 3 are each an n-channel transistor, andthus a part of a driver circuit that can be formed of re-channeltransistors among driver circuits is formed over the same substrate asthe transistor of the pixel portion.

FIG. 17A is an example of a block diagram of an active matrix displaydevice. Over a substrate 5300 in the display device, a pixel portion5301, a first scan line driver circuit 5302, a second scan line drivercircuit 5303, and a signal line driver circuit 5304 are provided. In thepixel portion 5301, a plurality of signal lines extended from the signalline driver circuit 5304 are arranged and a plurality of scan linesextended from the first scan line driver circuit 5302 and the secondscan line driver circuit 5303 are arranged. Note that pixels whichinclude display elements are provided in a matrix in respective regionswhere the scan lines and the signal lines intersect with each other.Further, the substrate 5300 in the display device is connected to atiming control circuit 5305 (also referred to as a controller or acontroller IC) through a connection portion such as a flexible printedcircuit (FPC).

In FIG. 17A, the first scan line driver circuit 5302, the second scanline driver circuit 5303, and the signal line driver circuit 5304 areformed over the same substrate 5300 as the pixel portion 5301.Accordingly, the number of components of a drive circuit which isprovided outside and the like are reduced, so that reduction in cost canbe achieved. Further, if the driver circuit is provided outside thesubstrate 5300, wirings would need to be extended and the number ofconnections of wirings would be increased. However, by providing thedriver circuit over the substrate 5300, the number of connections of thewirings can be reduced. Accordingly, the reliability or yield can beimproved.

Note that as an example, the timing control circuit 5305 supplies afirst scan line driver circuit start signal (GSP1) and a scan linedriver circuit clock signal (GCK1) to the first scan line driver circuit5302. The timing control circuit 5305 supplies, for example, a secondscan line driver circuit start signal (GSP2) (also referred to as astart pulse) and a scan line driver circuit clock signal (GCK2) to thesecond scan line driver circuit 5303. Moreover, the timing controlcircuit 5305 supplies a signal line driver circuit start signal (SSP), asignal line driver circuit clock signal (SCK), video signal data (DATA,also simply referred to as a video signal), and a latch signal (LAT) tothe signal line driver circuit 5304. Note that each clock signal may bea plurality of clock signals whose periods are different or may besupplied together with an inverted clock signal (CKB). Note that one ofthe first scan line driver circuit 5302 and the second scan line drivercircuit 5303 can be omitted.

FIG. 17B illustrates a structure in which circuits with low drivingfrequency (e.g., the first scan line driver circuit 5302 and the secondscan line driver circuit 5303) are formed over the same substrate 5300as the pixel portion 5301 and the signal line driver circuit 5304 isformed over a different substrate from the pixel portion 5301. With thisstructure, the driver circuits formed over the substrate 5300 can beformed using transistors having lower field-effect mobility than thoseformed using single crystal semiconductor.

Accordingly, increase in the size of the display device, reduction inthe number of steps, reduction in cost, improvement in yield, or thelike can be achieved.

The transistors described in Embodiments 1 to 3 are n-channeltransistors. An example of a structure and operation of a signal linedriver circuit including the n-channel TFT will be described withreference to FIGS. 18A and 18B.

The signal line driver circuit includes a shift register 5601 and aswitching circuit 5602. The switching circuit 5602 includes a pluralityof switching circuits 5602_1 to 5602_N (N is a natural number). Theswitching circuits 5602_1 to 5602_N each include a plurality oftransistors 5603_1 to 5603_k (k is a natural number). An example inwhich the transistors 5603_1 to 5603_k are n-channel TFTs will bedescribed.

A connection relation of the signal line driver circuit will bedescribed by using the switching circuit 5602_1 as an example.Respective first terminals of the transistors 5603_1 to 5603_k areconnected to corresponding wirings 5604_1 to 5604_k. Second terminals ofthe transistors 5603_1 to 5603_k are connected to signal wirings S1 toSk, respectively. Gates of the transistors 5603_1 to 5603_k areconnected to a wiring 5605_1.

The shift register 5601 has a function of outputting an H level signal(also referred to as a H signal or a high power supply potential level)to the wirings 5605_1 to 5605_N in order and selecting the switchingcircuits 5602_1 to 5602_N in order.

The switching circuit 5602_1 has a function of controlling conductionstates between the wirings 5604_1 to 5604_k and the signal lines S1 toSk (electrical continuity between the first terminal and the secondterminal), that is, a function of controlling whether the potentials ofthe wirings 5604_1 to 5604_k are supplied or not to the signal lines S1to Sk. In this manner, the switching circuit 5602_1 functions as aselector. Further, the transistors 5603_1 to 5603_k have a function ofcontrolling conduction between the wirings 5604_1 to 5604_k and thesignal lines S1 to Sk, that is, a function of supplying potentials ofthe wirings 5604_1 to 5604_k to the signal lines S1 to Sk. Thus, thetransistors 5603_1 to 5603_k each function as a switch.

Note that video signal data (DATA) is inputted to each of the wirings5604_1 to 5604_k. The video signal data (DATA) is an analog signalcorresponding to image data or image signals in many cases.

Next, operation of the signal line driver circuit shown in FIG. 18A isdescribed with reference to a timing chart of FIG. 18B. Examples ofsignals Sout1 to Sout_N and signals Vdata_1 to Vdata_k are shown in FIG.18B. The signals Sout_1 to Sout_N are examples of output signals of theshift register 5601, and the signals Vdata_1 to Vdata_k are examples ofsignals which are input to the wirings 5604_1 to 5604_k. Note that oneoperation period of the signal line driver circuit corresponds to onegate selection period in a display device. For example, one gateselection period is divided into periods T1 to TN. The periods T1 to TNare periods for writing video signal data (DATA) to the pixels whichbelong to a selected row.

In the periods T1 to TN, the shift register 5601 sequentially outputs Hlevel signals to the wirings 5605_1 to 5605_N. For example, in theperiod T1, the shift register 5601 outputs an H level signal to thewiring 5605_1. Then, the transistors 5603_1 to 5603_k are turned on, sothat the wirings 5604_1 to 5604_k and the signal lines S1 to Sk arebrought into conduction. In this case, Data (S1) to Data (Sk) are inputto the wirings 5604_1 to 5604_k, respectively. The Data (S1) to Data(Sk) are input to pixels in the first to k-th columns in the selectedrow through the transistors 5603_1 to 5603_k. Thus, in the periods T1 toTN, video signal data (DATA) is sequentially written to the pixels inthe selected row of every k columns.

By writing video signal data (DATA) to pixels of every plurality ofcolumns, the number of video signal data (DATA) or the number of wiringscan be reduced. Thus, connections to an external circuit can be reduced.By writing video signals to pixels of every plurality of columns,writing time can be extended and insufficient writing of video signalscan be prevented.

Note that a circuit including the transistor described in any ofEmbodiments 1 to 3 can be used as the shift register 5601 and theswitching circuit 5602.

Further, a structure of a scan line driver circuit is described. Thescan line driver circuit includes a shift register. Additionally, thescan line driver circuit may include a level shifter, a buffer, or thelike in some cases. In the scan line driver circuit, when the clocksignal (CLK) and the start pulse signal (SP) are input to the shiftregister, a selection signal is generated. The generated selectionsignal is buffered and amplified by the buffer, and the resulting signalis supplied to a corresponding scan line. Gate electrodes of transistorsin pixels of one line are connected to the scan line. Since thetransistors in the pixels of one line must be turned on all at once, abuffer which can supply a large current is used.

One mode of the shift register used for part of the scan line drivercircuit and/or the signal line driver circuit is described withreference to FIGS. 19A to 19C and FIGS. 20A and 20B.

A shift register of a scan line driver circuit and/or a signal linedriver circuit is described with reference to FIGS. 19A to 19C and FIGS.20A and 20B. The shift register includes first to N-th pulse outputcircuits 10_1 to 10_N (N is a natural number which is 3 or more) (seeFIG. 19A). A first clock signal CK1, a second clock signal CK2, a thirdclock signal CK3, and a fourth clock signal CK4 are supplied to thefirst to N-th pulse output circuits 10_1 to 10_N of the shift registershown in FIG. 19A from a first wiring 11, a second wiring 12, a thirdwiring 13, and a fourth wiring 14, respectively. A start pulse SP1 (afirst start pulse) from a fifth wiring 15 is input to the first pulseoutput circuit 10_1. To the nth pulse output circuit 10_n of the secondor subsequent stage (n is a natural number greater than or equal to 2and less than or equal to N), a signal from the pulse output circuit ofthe preceding stage (such a signal is referred to as a preceding-stagesignal OUT(n−1)) (n is a natural number greater than or equal to 2) isinput. To the first pulse output circuit 10_1, a signal from the thirdpulse output circuit 10_3 of the stage following the next stage isinput. Similarly, to the nth pulse output circuit 10_n of the second orits subsequent stage, a signal from the (n+2)th pulse output circuit10_(n+2) of the stage following the next stage (such a signal isreferred to as a subsequent-stage signal OUT(n+2)) is input. Therefore,the pulse output circuits of the respective stages output first outputsignals OUT(1)(SR) to OUT(N)(SR) to be input to the pulse output circuitof the subsequent stage and/or the pulse output circuit of the stagebefore the preceding stage and second output signals OUT(1) to OUT(N) tobe input to another circuit or the like. Note that since thesubsequent-stage signal OUT(n+2) is not input to the last two stages ofthe shift register as illustrated in FIG. 19A, a second start pulse SP2and a third start pulse SP3 may be additionally inputted from a sixthwiring 16 and a seventh wiring 17, respectively, to the pulse outputcircuits of the last two stages, for example. Alternatively, a signalwhich is additionally generated in the shift register may be used. Forexample, an (N+1)-th pulse output circuit 10_(N+1) and an (N+2)-th pulseoutput circuit 10_(N+2) which do not contribute to output of pulses tothe pixel portion (such circuits are also referred to as dummy stages)may be provided so that signals corresponding to the second start pulse(SP2) and the third start pulse (SP3) are generated in the dummy stages.

Note that a clock signal (CK) is a signal which oscillates between an Hlevel and an L level (referred to as an L signal or a low power supplypotential level) at a constant cycle. The first to the fourth clocksignals (CK1) to (CK4) are delayed by ¼ period sequentially. In thisembodiment, by using the first to fourth clock signals (CK1) to (CK4),control of driving of a pulse output circuit is performed. Note that theclock signal is also called GCK or SCK in accordance with an drivercircuit to which the clock signal is input; however, description is madeusing CK as the clock signal.

A first input terminal 21, a second input terminal 22, and a third inputterminal 23 are electrically connected to any of the first to fourthwirings 11 to 14. For example, in FIG. 19A, the first input terminal 21of the first pulse output circuit 10_1 is electrically connected to thefirst wiring 11, the second input terminal 22 of the first pulse outputcircuit 10_1 is electrically connected to the second wiring 12, and thethird input terminal 23 of the first pulse output circuit 10_1 iselectrically connected to the third wiring 13. In addition, the firstinput terminal 21 of the second pulse output circuit 10_2 iselectrically connected to the second wiring 12, the second inputterminal 22 of the second pulse output circuit 10_2 is electricallyconnected to the third wiring 13, and the third input terminal 23 of thesecond pulse output circuit 10_2 is electrically connected to the fourthwiring 14.

Each of the first to N-th pulse output circuits 10_1 to 10_N includesthe first input terminal 21, the second input terminal 22, the thirdinput terminal 23, a fourth input terminal 24, a fifth input terminal25, a first output terminal 26, and a second output terminal 27 (seeFIG. 19B). In the first pulse output circuit 10_1, the first clocksignal CK1 is input to the first input terminal 21; the second clocksignal CK2 is input to the second input terminal 22; the third clocksignal CK3 is input to the third input terminal 23; the start pulse isinput to the fourth input terminal 24; the next stage signal OUT (3) isinput to the fifth input terminal 25; the first output signal OUT (1)(SR) is output from the first output terminal 26; and the second outputsignal OUT (1) is output from the second output terminal 27.

Next, an example of a specific circuit structure of the pulse outputcircuit is described with reference to FIG. 19C.

The first pulse output circuit 10_1 includes first to eleventhtransistors 31 to 41 (see FIG. 19C). A signal or a power sourcepotential is supplied to the first transistor 31 to the eleventhtransistor 41 from a power supply line 51 to which a first high powersource potential VDD is supplied, a power supply line 52 to which asecond high power source potential VCC is supplied, and a power supplyline 53 to which a low power source potential VSS is supplied, inaddition to the first input terminal 21 to the fifth input terminal 25,the first output terminal 26, and the second output terminal 27, whichare described above. The relation of the power supply potentials of thepower supply lines in FIG. 19C is as follows: the first high powersupply potential VDD is higher than or equal to the second high powersupply potential VCC, and the second high power supply potential VCC ishigher than the third low power supply potential VSS. The first tofourth clock signals (CK1) to (CK4) are signals which become H-levelsignals and L-level signals repeatedly at a regular interval. Thepotential is VDD when the clock signal is at the H level, and thepotential is VSS when the clock signal is at the L level. By making thepotential VCC of the power supply line 52 lower than the potential VDDof the power supply line 51, a potential applied to a gate electrode ofa transistor can be lowered, shift in threshold voltage of thetransistor can be reduced, and deterioration of the transistor can besuppressed without an adverse effect on the operation of the transistor.

In FIG. 19C, a first terminal of the first transistor 31 is electricallyconnected to the power supply line 51, a second terminal of the firsttransistor 31 is electrically connected to a first terminal of the ninthtransistor 39, and a gate electrode of the first transistor 31 iselectrically connected to the fourth input terminal 24. A first terminalof the second transistor 32 is electrically connected to the powersupply line 53, a second terminal of the second transistor 32 iselectrically connected to the first terminal of the ninth transistor 39,and a gate electrode of the second transistor 32 is electricallyconnected to a gate electrode of the fourth transistor 34. A firstterminal of the third transistor 33 is electrically connected to thefirst input terminal 21, and a second terminal of the third transistor33 is electrically connected to the first output terminal 26. A firstterminal of the fourth transistor 34 is electrically connected to thepower supply line 53, and a second terminal of the fourth transistor 34is electrically connected to the first output terminal 26. A firstterminal of the fifth transistor 35 is electrically connected to thepower supply line 53, a second terminal of the fifth transistor 35 iselectrically connected to the gate electrode of the second transistor 32and the gate electrode of the fourth transistor 34, and a gate electrodeof the fifth transistor 35 is electrically connected to the fourth inputterminal 24. A first terminal of the sixth transistor 36 is electricallyconnected to the power supply line 52, a second terminal of the sixthtransistor 36 is electrically connected to the gate electrode of thesecond transistor 32 and the gate electrode of the fourth transistor 34,and a gate electrode of the sixth transistor 36 is electricallyconnected to the fifth input terminal 25. A first terminal of theseventh transistor 37 is electrically connected to the power supply line52, a second terminal of the seventh transistor 37 is electricallyconnected to a second terminal of the eighth transistor 38, and a gateelectrode of the seventh transistor 37 is electrically connected to thethird input terminal 23. A first terminal of the eighth transistor 38 iselectrically connected to the gate electrode of the second transistor 32and the gate electrode of the fourth transistor 34, and gate electrodes(a lower gate electrode and an upper gate electrode) of the eighthtransistor 38 are electrically connected to the second input terminal22. The first terminal of the ninth transistor 39 is electricallyconnected to the second terminal of the first transistor 31 and thesecond terminal of the second transistor 32, a second terminal of theninth transistor 39 is electrically connected to a gate electrode of thethird transistor 33 and a gate electrode of the tenth transistor 40, anda gate electrode of the ninth transistor 39 is electrically connected tothe power supply line 51. A first terminal of the tenth transistor 40 iselectrically connected to the first input terminal 21, a second terminalof the tenth transistor 40 is electrically connected to the secondoutput terminal 27, and the gate electrode of the tenth transistor 40 iselectrically connected to the second terminal of the ninth transistor39. A first terminal of the eleventh transistor 41 is electricallyconnected to the power supply line 53, a second terminal of the eleventhtransistor 41 is electrically connected to the second output terminal27, and the gate electrode of the eleventh transistor 41 is electricallyconnected to the gate electrode of the second transistor 32 and the gateelectrode of the fourth transistor 34.

In FIG. 19C, the point at which the gate electrode of the thirdtransistor 33, the gate electrode of the tenth transistor 40, and thesecond terminal of the ninth transistor 39 are connected is referred toas a node A. Further, the point at which the gate electrode of thesecond transistor 32, the gate electrode of the fourth transistor 34,the second terminal of the fifth transistor 35, the second terminal ofthe sixth transistor 36, the first terminal of the eighth transistor 38,and the gate electrode of the eleventh transistor 41 are connected isreferred to as a node B (see FIG. 20A).

Note that a transistor is an element having at least three terminals ofa gate, a drain, and a source. The transistor has a channel regionbetween a drain region and a source region, and current can flow throughthe drain region, the channel region, and the source region. Here, sincethe source and the drain of the transistor may change depending on thestructure, the operating condition, and the like of the transistor, itis difficult to define which is a source or a drain. Therefore, a regionfunctioning as source and drain is not called the source or the drain insome cases. In such a case, for example, one of the source and the drainmay be referred to as a first terminal and the other thereof may bereferred to as a second terminal.

FIG. 20B shows a timing chart of the shift register including aplurality of pulse output circuits shown in FIG. 20A. In the case wherethe shift register is a scan line driver circuit, a period 61 in FIG.20B is a vertical retrace period and a period 62 is a gate selectionperiod.

When the ninth transistor 39 having the gate to which the second powersupply potential VCC is applied is provided as shown in FIG. 20A, thefollowing advantage can be obtained before and after the bootstrapoperation.

In the case where the ninth transistor 39 having the gate electrode towhich the second potential VCC is applied is not provided, when thepotential at the node A is increased due to the bootstrap operation, thepotential of a source which is the second terminal of the firsttransistor 31 increases to a value higher than the first power supplypotential VDD. Then, the first terminal of the first transistor 31,namely the power supply line 51, becomes to serve as the source thereof.Therefore, in the first transistor 31, a large bias voltage is appliedand thus significant stress is applied between the gate and the sourceand between the gate and the drain, which can cause deterioration in thetransistor. By providing the ninth transistor 39 whose gate is suppliedwith the second power supply potential VCC, the potential of the node Ais raised by the bootstrap operation, but at the same time, an increasein the potential of the second terminal of the first transistor 31 canbe prevented. In other words, by providing the ninth transistor 39, anegative bias voltage applied between the gate and the source of thefirst transistor 31 can be reduced. Accordingly, with a circuitstructure in this embodiment, a negative bias voltage applied betweenthe gate and the source of the first transistor 31 can be reduced, sothat deterioration in the first transistor 31, which is due to stress,can further be restrained.

Note that the ninth transistor 39 is provided so as to be connectedbetween the second terminal of the first transistor 31 and the gate ofthe third transistor 33 through the first terminal and the secondterminal thereof. In the case of employing a shift register including aplurality of pulse output circuits of this embodiment, the ninthtransistor 39 may be omitted in a signal line driver circuit in whichthe number of stages is larger than that of a scan line driver circuit,in order to reduce the number of transistors.

Note that when oxide semiconductors are used for semiconductor layersfor the first to the eleventh transistors 31 to 41, the off-statecurrent of the transistors can be reduced, the on-state current and thefield effect mobility can be increased, and the degree of deteriorationcan be reduced, whereby malfunction of a circuit can decrease. Comparedwith a transistor formed using amorphous silicon, the degree ofdeterioration of the transistor, which is formed using an oxidesemiconductor, due to the application of a high potential to the gateelectrode is low. Therefore, even when the first power supply potentialVDD is supplied to a power supply line to which the second power supplypotential VCC is supplied, a similar operation can be performed, and thenumber of power supply lines which are provided in a circuit can bereduced, so that the circuit can be miniaturized.

Note that a similar effect is obtained even when the connection relationis changed so that a clock signal that is supplied to the gate electrodeof the seventh transistor 37 from the third input terminal 23 and aclock signal that is supplied to the gate electrode of the eighthtransistor 38 from the second input terminal 22 may be supplied from thesecond input terminal 22 and the third input terminal 23, respectively.Note that in the shift register shown in FIG. 20A, if the state wherethe seventh transistor 37 and the eighth transistor 38 are both on ischanged through the state where the seventh transistor 37 is off and theeighth transistor 38 is on to the state where the seventh transistor 37is off and the eighth transistor 38 is off, potential reduction at thenode B, which is caused by potential reduction of the second inputterminal 22 and the third input terminal 23, is caused twice due to thepotential reduction of the gate electrode of the seventh transistor 37and the potential reduction of the gate electrode of the eighthtransistor 38. On the contrary, if the shift register shown in FIG. 20Ais driven so that the state where the seventh transistor 37 and theeighth transistor 38 are both on is changed through the state where theseventh transistor 37 is on and the eighth transistor 38 is off to thestate where the seventh transistor 37 is off and the eighth transistor38 is off, potential reduction at the node B, which is caused bypotential reduction of the second input terminal 22 and the third inputterminal 23, is caused only once due to the potential reduction of thegate electrode of the eighth transistor 38. Consequently, the connectionrelation, in which the clock signal is supplied from the third inputterminal 23 to the gate electrode of the seventh transistor 37 and theclock signal is supplied from the second input terminal 22 to the gateelectrode of the eighth transistor 38, is preferable. That is becausethe number of times of change in the potential of the node B can bereduced, whereby the noise can be decreased.

In this way, in a period during which the potentials of the first outputterminal 26 and the second output terminal 27 are held at the L level,the H level signal is regularly supplied to the node B; therefore,malfunction of a pulse output circuit can be suppressed.

Embodiment 6

In this embodiment, as an example of a semiconductor device of thepresent invention, a semiconductor device having a display function(also referred to as a display device) and comprising, in a pixelportion and further in a driver circuit, a transistor formed in a mannersimilar to that of Embodiment 1 or 3 is described. Further, part orwhole of a driver circuit can be formed over a substrate where a pixelportion is also provided, using a transistor formed in a manner similarto Embodiment 1 or 3, whereby a system-on-panel can be obtained.

The display device includes a display element. As the display element, aliquid crystal element (also referred to as a liquid crystal displayelement) or a light-emitting element (also referred to as alight-emitting display element) can be used. The light-emitting elementincludes, in its category, an element whose luminance is controlled by acurrent or a voltage, and specifically includes, in its category, aninorganic electroluminescent (EL) element, an organic EL element, andthe like. Furthermore, a display medium whose contrast is changed by anelectric effect, such as electronic ink, can be used.

Note that the display device includes a panel in which the displayelement is sealed, and a module in which an IC or the like including acontroller is mounted on the panel. One embodiment of the presentinvention relates to one mode of an element substrate before the displayelement is completed in a process for manufacturing the display device,and the element substrate is provided with a means for supplying currentto the display element in each of a plurality of pixels. As for theelement substrate, specifically, such a state may be employed that onlya pixel electrode layer of the display element is formed, or aconductive film to be a pixel electrode layer has been deposited and theconductive film is not etched yet to form a pixel electrode layer.Alternatively, any other mode may be applied to the element substrate.

Note that a display device in this specification includes an imagedisplay device, a display device, or a light source (including alighting device). Further, the “display device” includes the followingmodules in its category: a module including a connector such as aflexible printed circuit (FPC), a tape automated bonding (TAB) tape, ora tape carrier package (TCP) attached; a module having a TAB tape or aTCP which is provided with a printed wiring board at the end thereof;and a module having an integrated circuit (IC) which is directly mountedon a display element by a chip on glass (COG) method.

In this embodiment, the appearance and a cross section of a liquidcrystal display panel, which is one embodiment of the semiconductordevice of the present invention, will be described with reference toFIGS. 21A1, 21A2, and 21B. FIGS. 21A1 and 21A2 are each a top view of apanel in which a transistor 4010, a transistor 4011, and a liquidcrystal element 4013 formed over a first substrate 4001 are sealedbetween the first substrate 4001 and a second substrate 4006 with asealant 4005. FIG. 21B is a cross-sectional view taken along line M-N ofFIGS. 21A1 and 21A2.

The sealant 4005 is provided so as to surround a pixel portion 4002 anda scan line driver circuit 4004 which are provided over the firstsubstrate 4001. The second substrate 4006 is provided over the pixelportion 4002 and the scan line driver circuit 4004. Therefore, the pixelportion 4002 and the scan line driver circuit 4004 are sealed togetherwith a liquid crystal layer 4008, by the first substrate 4001 and thesecond substrate 4006. A signal line driver circuit 4003 which is formedusing a single crystal semiconductor film or a polycrystallinesemiconductor film over a substrate and which is separately prepared maybe mounted in a region that is different from the region surrounded bythe sealant 4005 over the first substrate 4001.

Note that there is no particular limitation on the connection method ofa driver circuit which is separately formed, and COG, wire bonding, TAB,or the like can be used. FIG. 21A1 illustrates an example of mountingthe signal line driver circuit 4003 by COG, and FIG. 21A2 illustrates anexample of mounting the signal line driver circuit 4003 by TAB.

The pixel portion 4002 and the scan line driver circuit 4004 providedover the first substrate 4001 include a plurality of transistors. FIG.21B illustrates the transistor 4010 included in the pixel portion 4002and the transistor 4011 included in the scan line driver circuit 4004,as an example. An insulating layer 4020 and an insulating layer 4021 areprovided over the transistor 4010 and the transistor 4011.

As each of the transistors 4010 and 4011, the transistor described inEmbodiment 1 or 3 can be used, for example. In this embodiment, thetransistors 4010 and 4011 are re-channel transistors.

A pixel electrode layer 4030 included in the liquid crystal element 4013is electrically connected to the transistor 4010. A counter electrodelayer 4031 of the liquid crystal element 4013 is provided for the secondsubstrate 4006. A portion where the pixel electrode layer 4030, thecounter electrode layer 4031, and the liquid crystal layer 4008 overlapwith one another corresponds to the liquid crystal element 4013. Notethat the pixel electrode layer 4030 and the counter electrode layer 4031are provided with an insulating layer 4032 and an insulating layer 4033respectively which each function as an alignment film, and the liquidcrystal layer 4008 is sandwiched between the pixel electrode layer 4030and the counter electrode layer 4031 with the insulating layers 4032 and4033 therebetween.

Note that the first substrate 4001 and the second substrate 4006 can beformed of glass, metal (typically, stainless steel), ceramic, orplastic. As plastic, a fiberglass-reinforced plastics (FRP) plate, apoly(vinyl fluoride) (PVF) film, a polyester film, or an acrylic resinfilm can be used. In addition, a sheet with a structure in which analuminum foil is sandwiched between PVF films or polyester films can beused.

Reference numeral 4035 denotes a columnar spacer obtained by selectivelyetching an insulating film and is provided to control the distancebetween the pixel electrode layer 4030 and the counter electrode layer4031 (a cell gap). Alternatively, a spherical spacer may also be used.The counter electrode layer 4031 is electrically connected to a commonpotential line provided over the substrate where the 4010 is alsoprovided, through conductive particles. Note that the conductiveparticles are included in the sealant 4005.

Alternatively, liquid crystal exhibiting a blue phase for which analignment film is unnecessary may be used. A blue phase is one of liquidcrystal phases, which is generated just before a cholesteric phasechanges into an isotropic phase while temperature of cholesteric liquidcrystal is increased. A blue phase appears only within narrowtemperature range; therefore, the liquid crystal layer 4008 is formedusing a liquid crystal composition in which a chiral agent of 5 wt. % ormore is mixed in order to expand the temperature range. The liquidcrystal composition which includes liquid crystal exhibiting a bluephase and a chiral agent have such characteristics that the responsetime is 10 μs to 100 μs, which is short, the alignment process isunnecessary because the liquid crystal composition has optical isotropy,and viewing angle dependency is small.

Note that this embodiment shows an example of a transmissive liquidcrystal display device; however, one embodiment of the present inventioncan be applied to a reflective liquid crystal display device or asemi-transmissive liquid crystal display device.

An example of the liquid crystal display device is described in which apolarizing plate is provided on the outer surface of the substrate (onthe viewer side) and a coloring layer and an electrode layer used for adisplay element are provided on the inner surface of the substrate inthis order; however, the polarizing plate may be provided on the innersurface of the substrate. The stacked structure of the polarizing plateand the coloring layer is not limited to this embodiment and may be setas appropriate depending on materials of the polarizing plate and thecoloring layer or conditions of manufacturing process. Further, alight-blocking film serving as a black matrix may be provided.

In this embodiment, in order to reduce the influence caused by thesurface roughness of the transistor and to improve the reliability ofthe transistor, the transistor obtained in Embodiment 1 or 3 is coveredwith insulating layers (the insulating layers 4020 and 4021) serving asa protective film and a planarization insulating film. Note that theprotective film is provided to prevent entry of contaminant impuritiessuch as organic substance, metal, or moisture existing in air and ispreferably a dense film. The protective film may be formed by asputtering method as a single layer of a silicon nitride film or as astacked layer of a silicon oxide film with a silicon oxynitride film, asilicon nitride oxide film, an aluminum oxide film, an aluminum nitridefilm, an aluminum oxynitride film, and/or an aluminum nitride oxide filmby a sputtering method. Although an example in which the protective filmis formed by a sputtering method is described in this embodiment, thepresent invention is not limited to this method and a variety of methodsmay be employed.

Further, after the protective film is formed, the oxide semiconductorlayer containing indium, gallium, and zinc may be subjected to annealing(300° C. to 400° C.).

The insulating layer 4021 is formed as the planarization insulatingfilm. As the insulating layer 4021, an organic material having heatresistance such as a polyimide, an acrylic resin, abenzocyclobutene-based resin, a polyamide, or an epoxy resin can beused. Other than such organic materials, it is also possible to use alow-dielectric constant material (a low-k material), a siloxane-basedresin, PSG (phosphosilicate glass), BPSG (borophosphosilicate glass), orthe like. A siloxane-based resin may include, as a substituent, anorganic group (e.g., an alkyl group, and an aryl group) or a fluorogroup. In addition, the organic group may include a fluoro group. Notethat the insulating layer 4021 may be formed by stacking a plurality ofinsulating films formed of these materials.

Note that the siloxane-based resin corresponds to a resin including aSi—O—Si bond formed using a siloxane-based material as a startingmaterial.

The method for the formation of the insulating layer 4021 is not limitedto a particular method, and the following method can be used dependingon the material: a sputtering method, an SOG method, spin coating, dipcoating, spray coating, a droplet discharge method (e.g., an inkjetmethod, screen printing, or offset printing), or the like. In the caseof forming the insulating layer 4021 using a material solution,annealing (300° C. to 400° C.) of the oxide semiconductor layercontaining indium, gallium, and zinc may be performed at the same timeas a baking step. The baking step of the insulating layer 4021 alsoserves as annealing of the oxide semiconductor layer containing indium,gallium, and zinc, whereby a semiconductor device can be manufacturedefficiently.

The pixel electrode layer 4030 and the counter electrode layer 4031 canbe formed using a light-transmitting conductive material such as indiumoxide containing tungsten oxide, indium zinc oxide containing tungstenoxide, indium oxide containing titanium oxide, indium tin oxidecontaining titanium oxide, indium tin oxide (hereinafter referred to asITO), indium zinc oxide, indium tin oxide to which silicon oxide isadded, or the like.

Conductive compositions including a conductive high molecule (alsoreferred to as a conductive polymer) can be used for the pixel electrodelayer 4030 and the counter electrode layer 4031. The pixel electrodelayer formed using the conductive composition has preferably a sheetresistance of less than or equal to 10000 Ω/square and a transmittanceof greater than or equal to 70% at a wavelength of 550 nm. Further, theresistivity of the conductive high molecule included in the conductivecomposition is preferably less than or equal to 0.1 Ω·cm.

As the conductive macromolecule, a so-called π-electron conjugatedconductive macromolecule can be used. For example, polyaniline or aderivative thereof, polypyrrole or a derivative thereof, polythiopheneor a derivative thereof, a copolymer of two or more kinds of them, andthe like can be given.

A variety of signals and potentials are supplied from an FPC 4018 to thesignal line driver circuit 4003 which is formed separately, the scanline driver circuit 4004, and the pixel portion 4002.

In this embodiment, a connection terminal electrode 4015 is formed usingthe same conductive film that is used for the pixel electrode layer 4030included in the liquid crystal element 4013, and a terminal electrode4016 is formed using the same conductive film that is used for thesource and drain electrode layers of the transistors 4010 and 4011.

The connection terminal electrode 4015 is electrically connected to aterminal included in the FPC 4018 via an anisotropic conductive film4019.

Note that FIGS. 21A1 and 21A2 each illustrate an example in which thesignal line driver circuit 4003 is formed separately and mounted on thefirst substrate 4001; however, this embodiment is not limited to thisstructure. The scan line driver circuit may be separately formed andthen mounted, or only part of the signal line driver circuit or part ofthe scan line driver circuit may be separately formed and then mounted.

FIG. 22 illustrates an example of a liquid crystal display module whichis formed as a semiconductor device by using a TFT substrate 2600manufactured using an embodiment of the present invention.

FIG. 22 illustrates an example of a liquid crystal display module, inwhich the TFT substrate 2600 and a counter substrate 2601 are fixed toeach other with a sealant 2602, and a pixel portion 2603 including a TFTor the like, a display element 2604 including a liquid crystal layer,and a coloring layer 2605 are provided between the substrates 2600 and2601 to form a display region. The coloring layer 2605 is necessary toperform color display. In the RGB system, respective coloring layerscorresponding to colors of red, green, and blue are provided forrespective pixels. Polarizing plates 2606 and 2607 and a diffusion plate2613 are provided outside the TFT substrate 2600 and the countersubstrate 2601. A light source includes a cold cathode tube 2610 and areflective plate 2611, and a circuit board 2612 is connected to a wiringcircuit portion 2608 of the TFT substrate 2600 by a flexible wiringboard 2609 and includes an external circuit such as a control circuit ora power source circuit. The polarizing plate and the liquid crystallayer may be stacked with a retardation plate therebetween.

For the liquid crystal display module, a twisted nematic (TN) mode, anin-plane-switching (IPS) mode, a fringe field switching (FFS) mode, amulti-domain vertical alignment (MVA) mode, a patterned verticalalignment (PVA) mode, an axially symmetric aligned micro-cell (ASM)mode, an optical compensated birefringence (OCB) mode, a ferroelectricliquid crystal (FLC) mode, an antiferroelectric liquid crystal (AFLC)mode, or the like can be used.

Through the above process, a display device mounted with a transistorwhich is excellent in operation stability can be manufactured. A liquidcrystal display device of this embodiment is mounted with a transistorwhich is excellent in operation stability, and thus has highreliability.

According to this embodiment, by using a conductive layer includingcopper as a main component, a display device in which the wiringresistance is reduced can be provided. In a display device with a largescreen or a display device with high definition to which this embodimentis applied, delay of signal transmission to an end portion of a signalline, drop in voltage of a power supply line, or the like is hardlycaused. As a result, a display device in which deterioration of displayquality such as display unevenness or a defect in grayscale issuppressed to improve display quality can be provided.

In addition, by using an oxide semiconductor layer which is highlypurified to have a carrier concentration lower than 1×10¹² cm⁻³, offcurrent of 1×10⁻¹³ A or lower, which is extremely small, can beachieved. As a result, a power-saving display device in which leakagecurrent is suppressed can be provided. Further, a display device with ahigh ratio between the on current and the off current can be provided.Further, a display device with high contrast and high display qualitycan be provided.

The display device of this embodiment is provided with a transistor withhigh electron field-effect mobility in which a highly purified oxidesemiconductor is used; thus, the transistor can operate at high speedand achieve display characteristics of moving images and highdefinition.

Further, since a wiring including copper as a main component is sealedwith nitride films, diffusion of copper is suppressed, so that asemiconductor device with higher reliability can be provided.

This embodiment can be implemented in appropriate combination with thestructures described in the other embodiments.

Embodiment 7

In this embodiment, a light-emitting display device will be described asan example of a semiconductor device of the present invention. As adisplay element included in a display device, a light-emitting elementutilizing electroluminescence will be described in this embodiment.Light-emitting elements utilizing electroluminescence are classifiedaccording to whether a light-emitting material is an organic compound oran inorganic compound. In general, the former is referred to as anorganic EL element, and the latter is referred to as an inorganic ELelement.

In an organic EL element, by application of a voltage to alight-emitting element, electrons and holes are separately injected froma pair of electrodes into a layer containing a light-emitting organiccompound, so that current flows. Then, recombination of these carriers(the electrons and holes) makes the light-emitting organic compound toform an excited state and to emit light when it returns from the excitedstate to a ground state. Owing to such a mechanism, this light-emittingelement is referred to as a current-excitation light-emitting element.

The inorganic EL elements are classified according to their elementstructures into a dispersion-type inorganic EL element and a thin-filminorganic EL element. A dispersion-type inorganic EL element has alight-emitting layer where particles of a light-emitting material aredispersed in a binder, and its light emission mechanism isdonor-acceptor recombination type light emission that utilizes a donorlevel and an acceptor level. A thin-film inorganic EL element has astructure where a light-emitting layer is sandwiched between dielectriclayers, which are further sandwiched between electrodes, and its lightemission mechanism is localized type light emission that utilizesinner-shell electron transition of metal ions. Note that description ismade in this embodiment using an organic EL element as a light-emittingelement.

FIG. 23 shows an example of a pixel structure to which digital timegrayscale driving can be applied, as an example of a semiconductordevice according to one embodiment of the present invention. The term“OS” in the drawing indicates a thin film transistor in which an oxidesemiconductor is used.

A structure and operation of a pixel to which digital time grayscaledriving can be applied are described. In this embodiment, an example isdescribed in which one pixel includes two n-channel transistorsincluding an oxide semiconductor layer (an In-Ga-Zn-O-basedsemiconductor layer) for a channel formation region which are describedin Embodiment 1 or 2.

A pixel 6400 includes a switching transistor 6401, a driver transistor6402, a light-emitting element 6404, and a capacitor 6403. A gate of theswitching transistor 6401 is connected to a scan line 6406, a firstelectrode (one of a source electrode and a drain electrode) of theswitching transistor 6401 is connected to a signal line 6405, and asecond electrode (the other of the source electrode and the drainelectrode) of the switching transistor 6401 is connected to a gate ofthe driver transistor 6402. The gate of the driving transistor 6402 isconnected to a power supply line 6407 through the capacitor 6403, afirst electrode of the driving transistor 6402 is connected to the powersupply line 6407, and a second electrode of the driving transistor 6402is connected to a first electrode (a pixel electrode layer) of thelight-emitting element 6404. A second electrode of the light-emittingelement 6404 corresponds to a common electrode 6408. The commonelectrode 6408 is electrically connected to a common potential lineprovided over the same substrate.

The second electrode (common electrode 6408) of the light-emittingelement 6404 is set to a low power supply potential. Note that the lowpower supply potential is a potential satisfying the relation that lowpower supply potential is lower than the high power supply potential(low power supply potential<high power supply potential) with referenceto the high power supply potential that is set to the power supply line6407. As the low power supply potential, GND, 0 V, or the like may beemployed, for example. A potential difference between the high powersupply potential and the low power supply potential is applied to thelight-emitting element 6404 and current is supplied to thelight-emitting element 6404, so that the light-emitting element 6404emits light. Here, in order to make the light-emitting element 6404 emitlight, each potential is set so that the potential difference betweenthe high power supply potential and the low power supply potential is aforward threshold voltage or higher of the light-emitting element 6404.Note that the common electrode 6408 may be set to a high power supplypotential, and the power supply line 6407 may be set to a low powersupply potential. In that case, the structure of the light-emittingelement 6404 may be modified as appropriate because the current in thelight-emitting element 6404 flows reversely.

Note that gate capacitor of the driver transistor 6402 may be used as asubstitute for the capacitor 6403, so that the capacitor 6403 can beomitted. The gate capacitor of the driving transistor 6402 may be formedbetween a channel formation region and the gate electrode layer.

In the case of a voltage-input voltage driving method, a video signal isinput to the gate of the driver transistor 6402 so that the drivertransistor 6402 is in either of two states of being sufficiently turnedon or turned off. That is, the driver transistor 6402 operates in alinear region. Since the driver transistor 6402 operates in the linearregion, a voltage higher than the voltage of the power supply line 6407is applied to the gate of the driver transistor 6402. Note that avoltage higher than or equal to (voltage of the power supply line+V_(th) of the driver transistor 6402) is applied to the signal line6405.

In the case of using analog grayscale driving instead of the digitaltime ratio grayscale driving, the pixel structure the same as that ofFIG. 23 can be employed by inputting signals in a different way.

In the case of performing analog grayscale driving, a voltage higherthan or equal to (forward voltage of the light-emitting element6404+V_(th) of the driver transistor 6402) is applied to the gate of thedriver transistor 6402. The forward voltage of the light-emittingelement 6404 indicates a voltage at which a desired luminance isobtained, and includes at least forward threshold voltage. The videosignal by which the driver transistor 6402 operates in a saturationregion is input, so that current can be supplied to the light-emittingelement 6404. In order for the driver transistor 6402 to operate in thesaturation region, the potential of the power supply line 6407 is sethigher than the gate potential of the driver transistor 6402. When ananalog video signal is used, it is possible to feed current to thelight-emitting element 6404 in accordance with the video signal andperform analog grayscale driving.

Note that a pixel structure of the present invention is not limited tothat shown in FIG. 23 . For example, a switch, a resistor, a capacitor,a transistor, a logic circuit, or the like may be added to the pixelshown in FIG. 23 .

Next, structures of the light-emitting element will be described withreference to FIGS. 24A to 24C. In this embodiment, a cross-sectionalstructure of a pixel will be described by taking an n-channel drivingTFT as an example. Each of TFTs 7011, 7021, and 7001, which are driverTFTs used for semiconductor devices in FIGS. 24A to 24C can bemanufactured in a manner similar to the transistor described inEmbodiment 1 or 3.

In order to extract light emitted from the light-emitting element, atleast one of an anode and a cathode is required to transmit light. Alight-emitting element can have a top emission structure in which lightis extracted through the surface opposite to the substrate; a bottomemission structure in which light is extracted through the surface onthe substrate side; or a dual emission structure in which light isextracted through the surface opposite to the substrate and the surfaceon the substrate side. The pixel structure of an embodiment of thepresent invention can be applied to a light-emitting element having anyof these emission structures.

A light-emitting element having a bottom emission structure will bedescribed with reference to FIG. 24A.

FIG. 24A is a cross-sectional view of a pixel in the case where thedriving TFT 7011 is an n-channel TFT and light is emitted from alight-emitting element 7012 to a first electrode 7013 side. In FIG. 24A,the first electrode 7013 of the light-emitting element 7012 is formedover a conductive film 7017 transmitting visible light which iselectrically connected to a source or drain electrode layer of thedriving TFT 7011, and an EL layer 7014 and a second electrode 7015 arestacked in this order over the first electrode 7013.

As the conductive film 7017 transmitting visible light, a conductivefilm transmitting visible light such as a film of indium oxide includingtungsten oxide, indium zinc oxide including tungsten oxide, indium oxideincluding titanium oxide, indium tin oxide including titanium oxide,indium tin oxide, indium zinc oxide, or indium tin oxide to whichsilicon oxide is added can be used.

Any of a variety of materials can be used for the first electrode 7013of the light-emitting element. For example, in the case where the firstelectrode 7013 is used as a cathode, it is preferable to use a materialhaving a low work function, such as an alkali metal such as Li or Cs, analkaline-earth metal such as Mg, Ca, or Sr, an alloy containing any ofthese metals (Mg:Ag, Al:Li, or the like), or a rare-earth metal such asYb or Er. In FIG. 24A, the first electrode 7013 is formed to have athickness enough to transmit visible light (preferably, approximately 5nm to 30 nm). For example, an aluminum film having a thickness of 20 nmis used for the first electrode 7013.

Note that the conductive film transmitting visible light and thealuminum film may be stacked and then selectively etched to form theconductive film 7017 transmitting visible light and the first electrode7013; in this case, etching can be performed using the same mask, whichis preferable.

Further, the periphery of the first electrode 7013 is covered with apartition 7019. The partition 7019 is formed using an organic resin filmof a polyimide, an acrylic resin, a polyamide, an epoxy resin, or thelike, an inorganic insulating film, or an organic polysiloxane. It isparticularly preferable that the partition 7019 be formed using aphotosensitive resin material to have an opening over the firstelectrode 7013 so that a sidewall of the opening is formed to have aninclined surface with continuous curvature. In the case where aphotosensitive resin material is used for the partition 7019, a step offorming a resist mask can be omitted.

As the EL layer 7014 formed over the first electrode 7013 and thepartition 7019, an EL layer including at least a light-emitting layer isacceptable. The EL layer 7014 may be formed to have either asingle-layer structure or a stacked-layer structure. When the EL layer7014 is formed using a plurality of layers and the first electrode 7013functions as a cathode, an electron-injection layer, anelectron-transport layer, a light-emitting layer, a hole-transportlayer, and a hole-injection layer are stacked in the order presentedover the first electrode 7013. It is not necessary to form all of theselayers.

The stacking order is not limited to the above stacking order. The firstelectrode 7013 may function as an anode, and a hole-injection layer, ahole-transport layer, a light-emitting layer, an electron-transportlayer, and an electron-injection layer may be stacked in that order overthe anode. However, considering power consumption, it is preferable thatthe first electrode 7013 serve as a cathode and an electron-injectionlayer, an electron-transport layer, a light-emitting layer, ahole-transport layer, and a hole-injection layer be stacked in the orderpresented over the first electrode 7013 because an increase in voltageof a driver circuit portion can be prevented and power consumption canbe reduced more effectively.

Any of a variety of materials can be used for the second electrode 7015formed over the EL layer 7014. For example, in the case where the secondelectrode 7015 is used as an anode, a material having a high workfunction (specifically, 4.0 eV or more), for example, ZrN, Ti, W, Ni,Pt, Cr, or the like; or a transparent conductive material such as ITO,IZO, or ZnO is preferable. Further, a blocking film 7016, for example, ametal which blocks light, a metal which reflects light, or the like isprovided over the second electrode 7015. In this embodiment, an ITO filmis used as the second electrode 7015, and a Ti film is used as theblocking film 7016.

The light-emitting element 7012 corresponds to a region where the ELlayer 7014 including the light-emitting layer is sandwiched between thefirst electrode 7013 and the second electrode 7015. In the case of theelement structure illustrated in FIG. 24A, light is emitted from thelight-emitting element 7012 to the first electrode 7013 side asindicated by an arrow.

Note that in FIG. 24A, light emitted from the light-emitting element7012 passes through a color filter layer 7033, an insulating layer 7032,a gate insulating layer 7030, and a substrate 7010 to be emitted.

The color filter layer 7033 is formed by a droplet discharge method suchas an inkjet method, a printing method, an etching method with the useof a photolithography technique, or the like.

The color filter layer 7033 is covered with an overcoat layer 7034, andalso covered with a protective insulating layer 7035. Although theovercoat layer 7034 is illustrated to have a small thickness in FIG.24A, the overcoat layer 7034 has a function of reducing unevennesscaused by the color filter layer 7033 with use of a resin material suchas an acrylic resin.

A contact hole reaching the source or drain electrode is formed in theprotective insulating layer 7035 and the insulating layer 7032 tooverlap with the partition 7019.

Next, a light-emitting element having a dual emission structure isdescribed with reference to FIG. 24B.

In FIG. 24B, a first electrode 7023 of a light-emitting element 7022 isformed over a conductive film 7027 transmitting visible light which iselectrically connected to a source or drain electrode layer of thedriver TFT 7021, and an EL layer 7024 and a second electrode 7025 arestacked in the order presented over the first electrode 7023.

For the conductive film 7027 transmitting visible light, alight-transmitting conductive film of indium oxide containing tungstenoxide, indium zinc oxide containing tungsten oxide, indium oxidecontaining titanium oxide, indium tin oxide containing titanium oxide,indium tin oxide, indium zinc oxide, indium tin oxide to which siliconoxide is added, or the like can be used.

Any of a variety of materials can be used for the first electrode 7023.For example, in the case where the first electrode 7023 is used as acathode, the first electrode 7023 is preferably formed using, forexample, a material having a low work function such as an alkali metalsuch as Li or Cs; an alkaline earth metal such as Mg, Ca, or Sr; analloy containing any of these metals (e.g., Mg:Ag or Al:Li); or a rareearth metal such as Yb or Er. If the first electrode 7023 is formedusing a metal film, the metal film has a thickness enough to transmitvisible light (preferably, approximately 5 nm to 30 nm). For example, analuminum film having a thickness of 20 nm is used for the firstelectrode 7023.

Note that the conductive film transmitting visible light and thelight-transmitting metal film may be stacked and then selectivelyetched, whereby the conductive film 7027 transmitting visible light andthe first electrode 7023 may be formed. In this case, etching can beperformed with the use of the same mask, which is preferable.

Further, the periphery of the first electrode 7023 is covered with apartition 7029. The partition 7029 is formed using: an organic resinfilm of a polyimide, an acrylic resin, a polyamide, an epoxy resin, orthe like; an inorganic insulating film, or an organic polysiloxane. Itis particularly preferable that the partition 7029 be formed using aphotosensitive resin material to have an opening portion over the firstelectrode 7023 so that a sidewall of the opening portion is formed as atilted surface with continuous curvature. In the case where aphotosensitive resin material is used for the partition 7029, a step offorming a resist mask can be omitted.

As the EL layer 7024 formed over the first electrode 7023 and thepartition 7029, an EL layer including a light-emitting layer isacceptable. Further, the EL layer 7024 may be formed to have either asingle-layer structure or a stacked-layer structure. When the EL layer7024 is formed using a plurality of layers and the first electrode 7023functions as a cathode, an electron-injection layer, anelectron-transport layer, a light-emitting layer, a hole-transportlayer, and a hole-injection layer are stacked in the order presentedover the first electrode 7023. It is not necessary to form all of theselayers.

The stacking order is not limited to the above. When the first electrode7023 functions as an anode, a hole-injection layer, a hole-transportlayer, a light-emitting layer, an electron-transport layer, and anelectron-injection layer may be stacked in this order over the firstelectrode 7023. However, when power consumption is compared, it ispreferable that the first electrode 7023 serve as a cathode and anelectron-injection layer, an electron-transport layer, a light-emittinglayer, a hole-transport layer, and a hole-injection layer be stacked inthat order over the first electrode 7023 because voltage rise in thedriver circuit portion can be suppressed and power consumption can bedecreased.

Further, any of a variety of materials can be used for the secondelectrode 7025 formed over the EL layer 7024. For example, in the casewhere the second electrode 7025 is used as an anode, a material having ahigh work function, for example, a transparent conductive material suchas ITO, IZO, or ZnO is preferable. In this embodiment, an ITO filmincluding silicon oxide is used as the second electrode 7025 whichserves as an anode.

The light-emitting element 7022 corresponds to a region where the ELlayer 7024 including the light-emitting layer is sandwiched between thefirst electrode 7023 and the second electrode 7025. In the case of theelement structure illustrated in FIG. 24B, light is emitted from thelight-emitting element 7022 to both the second electrode 7025 side andthe first electrode 7023 side as indicated by arrows.

Note that in FIG. 24B, light emitted from the light-emitting element7022 to the first electrode 7023 side passes through a color filterlayer 7043, an insulating layer 7042, a gate insulating layer 7040, anda substrate 7020 to be emitted.

The color filter layer 7043 is formed by a droplet discharge method suchas an inkjet method, a printing method, an etching method with the useof a photolithography technique, or the like.

The color filter layer 7043 is covered with the overcoat layer 7044, andalso covered with a protective insulating layer 7045.

A contact hole which is formed in the protective insulating layer 7045and the insulating layer 7042 and reaches the drain electrode layer isprovided in a portion which overlaps with the partition 7029.

Note that in the case where the light-emitting element having a dualemission structure is used and full color display is performed on bothdisplay surfaces, light from the second electrode 7025 side does notpass through the color filter layer 7043; therefore, a sealing substrateprovided with another color filter layer is preferably provided on thesecond electrode 7025.

Next, a light-emitting element having a top emission structure isdescribed with reference to FIG. 24C.

FIG. 24C is a cross-sectional view of a pixel in the case where thedriving TFT 7001 is an n-channel transistor and light is emitted from alight-emitting element 7002 to a second electrode 7005 side. In FIG.24C, a first electrode 7003 of the light-emitting element 7002 which iselectrically connected to a source or drain electrode layer of thedriving TFT 7001 is formed, and an EL layer 7004 and the secondelectrode 7005 are stacked in this order over the first electrode 7003.

Any of a variety of materials can be used for the first electrode 7003.The first electrode 7003 can be formed using any of a variety ofmaterials; for example, when the first electrode 7003 is used as acathode, it is preferable to use a material having a low work function,such as an alkali metal such as Li or Cs, an alkaline earth metal suchas Mg, Ca, or Sr, an alloy containing any of these metals (e.g., Mg:Ag,Al:Li), or a rare earth metal such as Yb or Er.

Further, the periphery of the first electrode 7003 is covered with apartition 7009. The partition 7009 is formed using an organic resin filmof a polyimide, an acrylic resin, a polyamide, an epoxy resin, or thelike, an inorganic insulating film, or an organic polysiloxane. It isparticularly preferable that the partition 7009 be formed using aphotosensitive resin material to have an opening over the firstelectrode 7003 so that a sidewall of the opening is formed to have aninclined surface with continuous curvature. In the case where aphotosensitive resin material is used for the partition 7009, a step offorming a resist mask can be omitted.

As the EL layer 7004 formed over the first electrode 7003 and thepartition 7009, an EL layer including at least a light-emitting elementis acceptable. Further, the EL layer 7004 may be formed to have either asingle-layer structure or a stacked-layer structure. When the EL layer7004 is formed using a plurality of layers and the first electrode 7003functions as a cathode, an electron-injection layer, anelectron-transport layer, a light-emitting layer, a hole-transportlayer, and a hole-injection layer are stacked in the order presentedover the first electrode 7003. Note that all these layers are notnecessarily provided.

The stacking order is not limited to the above; a hole-injection layer,a hole-transport layer, a light-emitting layer, an electron-transportlayer, and an electron-injection layer may be stacked in this order overthe first electrode 7003 which serves an anode.

For example, the first electrode 7003 having a stacked film in which aTi film, an aluminum film, and a Ti film are formed in this orderfunctions as an anode, and a hole-injection layer, a hole-transportlayer, a light-emitting layer, an electron-transport layer, and anelectron-injection layer are stacked in this order over the anode. Thenthereover, a stacked layer of a Mg:Ag alloy thin film and an ITO film isformed.

Note that when the driver TFT 7001 is an n-channel transistor, it ispreferable to stack an electron-injection layer, an electron-transportlayer, a light-emitting layer, a hole-transport layer, and ahole-injection layer in this order over the first electrode 7003 becausean increase in voltage of the driver circuit can be suppressed and thuspower consumption can be reduced.

The second electrode 7005 is formed using a conductive film transmittingvisible light, such as a film of indium oxide containing tungsten oxide,indium zinc oxide containing tungsten oxide, indium oxide containingtitanium oxide, indium tin oxide containing titanium oxide, indium tinoxide, indium zinc oxide, indium tin oxide to which silicon oxide isadded, or the like may be used.

The light-emitting element 7002 corresponds to a region where the ELlayer 7004 including the light-emitting layer is sandwiched between thefirst electrode 7003 and the second electrode 7005. In the case of thepixel illustrated in FIG. 24C, light is emitted from the light-emittingelement 7002 to the second electrode 7005 side as indicated by arrows.

In FIG. 24C, the drain electrode layer of the driver TFT 7001 iselectrically connected to the first electrode 7003 through a contacthole provided in a protective insulating layer 7052 and an insulatinglayer 7055. A planarization insulating layer 7053 can be formed using aresin material such as a polyimide, an acrylic, a benzocyclobutene-basedresin, a polyamide, or an epoxy resin. In addition to such resinmaterials, it is also possible to use a low-dielectric constant material(low-k material), a siloxane-based resin, phosphosilicate glass (PSG),borophosphosilicate glass (BPSG), or the like. Note that theplanarization insulating layer 7053 may be formed by stacking aplurality of insulating films formed of these materials. There is noparticular limitation on the method for forming the planarizationinsulating layer 7053, and the planarization insulating layer 7053 canbe formed, depending on the material, by a method such as a sputteringmethod, an SOG method, spin coating, dip coating, spray coating, adroplet discharge method (such as an inkjet method, screen printing,offset printing, or the like), or the like.

The partition 7009 is provided so as to insulate the first electrode7003 and a first electrode 7008 (not shown) of an adjacent pixel. Thepartition 7009 is formed using an organic resin film of a polyimide, anacrylic resin, a polyamide, an epoxy resin, or the like, an inorganicinsulating film, or an organic polysiloxane. It is particularlypreferable that the partition 7009 be formed using a photosensitiveresin material to have an opening over the first electrode 7003 so thata sidewall of the opening is formed to have an inclined surface withcontinuous curvature. In the case where a photosensitive resin materialis used for the partition 7009, a step of forming a resist mask can beomitted.

In the structure in FIG. 24C, when full color display is performed, forexample, the light-emitting element 7002 is used as a greenlight-emitting element, one of the adjacent light-emitting elements isused as a red light-emitting element, and the other is used as a bluelight-emitting element. Alternatively, a light-emitting display devicecapable of full color display may be manufactured using four kinds oflight-emitting elements which include a white light-emitting element inaddition to three kinds of light-emitting elements.

In the structure of FIG. 24C, a light-emitting display device capable offull color display may be manufactured in such a way that all of aplurality of light-emitting elements to be provided are whitelight-emitting elements and a sealing substrate having a color filter orthe like is arranged on the light-emitting element 7002. A materialwhich exhibits a single color such as white or blue is formed andcombined with a color filter or a color conversion layer, whereby fullcolor display can be performed.

Needless to say, display of monochromatic light can also be performed.For example, a lighting system may be formed with use of white lightemission, or an area-color light-emitting device may be formed with theuse of a single color light emission.

If necessary, an optical film such as a polarizing film including acircularly polarizing plate may be provided.

Note that, although the organic EL elements are described here as thelight-emitting elements, an inorganic EL element can also be provided asa light-emitting element.

Note that the example is described in which a thin film transistor (adriving TFT) which controls the driving of a light-emitting element iselectrically connected to the light-emitting element; however, astructure may be employed in which a TFT for current control isconnected between the driving TFT and the light-emitting element.

A semiconductor device described in this embodiment is not limited tothe structures illustrated in FIGS. 24A to 24C and can be modified invarious ways based on the spirit of techniques according to the presentinvention.

Next, the appearance and the cross section of a light-emitting displaypanel (also referred to as a light-emitting panel) which corresponds toone embodiment of a semiconductor device to which the transistordescribed in Embodiment 1 or 3 is applied are described with referenceto FIGS. 25A and 25B. FIG. 25A is a top view of a panel in whichtransistors and a light-emitting element, which are formed over a firstsubstrate, are sealed between the first substrate and a second substratewith a sealant. FIG. 25B corresponds to a cross-sectional view takenalong line H-I of FIG. 25A.

A sealant 4505 is provided so as to surround a pixel portion 4502,signal line driver circuits 4503 a and 4503 b, and scan line drivercircuits 4504 a and 4504 b which are provided over a first substrate4501. In addition, a second substrate 4506 is provided over the pixelportion 4502, the signal line driver circuits 4503 a and 4503 b, and thescan line driver circuits 4504 a and 4504 b. Accordingly, the pixelportion 4502, the signal line driver circuits 4503 a and 4503 b, and thescan line driver circuits 4504 a and 4504 b are sealed together with afiller 4507, by the first substrate 4501, the sealant 4505, and thesecond substrate 4506. It is preferable that a panel be packaged(sealed) with a protective film (such as a laminate film or anultraviolet curable resin film) or a cover material with highair-tightness and little degasification so that the panel is not exposedto the outside air.

The pixel portion 4502, the signal line driver circuits 4503 a and 4503b, and the scan line driver circuits 4504 a and 4504 b formed over thefirst substrate 4501 each include a plurality of transistors, and thetransistor 4510 included in the pixel portion 4502 and the transistor4509 included in the signal line driver circuit 4503 a are illustratedas an example in FIG. 25B.

For each of the transistors 4509 and 4510, a highly reliable transistorincluding an oxide semiconductor layer (an In-Ga-Zn-O-basedsemiconductor layer) as described in Embodiment 1 or 3 can be applied.In this embodiment, the transistors 4509 and 4510 are n-channeltransistors.

Over an insulating layer 4544, a conductive layer 4540 is provided in aposition overlapping with a channel formation region of an oxidesemiconductor layer of the transistor 4509 used for a driver circuit. Byproviding the conductive layer 4540 so as to overlap with the channelformation region of the oxide semiconductor layer, the shift in thethreshold voltage of the transistor 4509 can be suppressed. Further,potential of the conductive layer 4540 may be the same as or differentfrom that of a gate electrode layer of the transistor 4509. Theconductive layer 4540 can function also as a second gate electrodelayer. Alternatively, the potential of the conductive layer 4040 may beGND or 0 V, or the conductive layer 4040 may be in a floating state.

Reference numeral 4511 denotes a light-emitting element. A firstelectrode layer 4517 which is a pixel electrode included in thelight-emitting element 4511 is electrically connected to a source ordrain electrode layer of the transistor 4510. Note that a structure ofthe light-emitting element 4511 is a stacked-layer structure of thefirst electrode layer 4517, the electroluminescent layer 4512, and thesecond electrode layer 4513, but there is no particular limitation onthe structure. The structure of the light-emitting element 4511 can bechanged as appropriate depending on the direction in which light isextracted from the light-emitting element 4511, or the like.

A partition 4520 is formed using an organic resin film, an inorganicinsulating film, or an organic polysiloxane. It is particularlypreferable that the partition 4520 be formed using a photosensitivematerial and an opening be formed over the first electrode layer 4517 sothat a sidewall of the opening is formed as an inclined surface withcontinuous curvature.

The electroluminescent layer 4512 may be formed with a single layer or aplurality of layers stacked.

A protective film may be formed over the second electrode layer 4513 andthe partition 4520 in order to prevent entry of oxygen, hydrogen,moisture, carbon dioxide, or the like into the light-emitting element4511. As the protective film, a silicon nitride film, a silicon nitrideoxide film, a DLC film, or the like can be formed.

A variety of signals and potentials are supplied to the signal linedriver circuits 4503 a and 4503 b, the scan line driver circuits 4504 aand 4504 b, or the pixel portion 4502 from FPCs 4518 a and 4518 b.

In this embodiment, a connection terminal electrode 4515 is formed usingthe same conductive film that is used for the first electrode layer 4517included in the light-emitting element 4511. A terminal electrode 4516is formed using the same conductive film that is used for the source anddrain electrode layers included in the transistors 4509 and 4510.

The connection terminal electrode 4515 is electrically connected to aterminal included in the FPC 4518 a via an anisotropic conductive film4519.

The second substrate located in the direction in which light isextracted from the light-emitting element 4511 needs to have alight-transmitting property with respect to visible light. In that case,a material having a light-transmitting property with respect to visiblelight, such as a glass plate, a plastic plate, a polyester film, or anacrylic film is used.

As the filler 4507, an ultraviolet curable resin or a thermosettingresin can be used, in addition to an inert gas such as nitrogen orargon. For example, PVC (poly(vinyl chloride)), an acrylic resin, apolyimide, an epoxy resin, a silicone resin, PVB (poly(vinyl butyral)),or EVA (ethylene vinyl acetate copolymer) can be used. In thisembodiment, nitrogen is used for the filler 4507.

In addition, if needed, an optical film, such as a polarizing plate, acircularly polarizing plate (including an elliptically polarizingplate), a retardation plate (a quarter-wave plate or a half-wave plate),or a color filter, may be provided as appropriate on a light-emittingsurface of the light-emitting element. Further, the polarizing plate orthe circularly polarizing plate may be provided with an anti-reflectionfilm. For example, anti-glare treatment by which reflected light can bediffused by projections and depressions on the surface so as to reducethe glare can be performed.

The signal line driver circuits 4503 a and 4503 b and the scan linedriver circuits 4504 a and 4504 b may be mounted as driver circuitsformed using a single crystal semiconductor film or a polycrystallinesemiconductor film over a substrate separately prepared. In addition,only the signal line driver circuits or part thereof, or the scan linedriver circuits or part thereof may be separately formed and mounted.This embodiment is not limited to the structure illustrated in FIGS. 25Aand 25B.

The light-emitting display device of this embodiment is mounted with atransistor which is excellent in operation stability, and thus has highreliability.

In this embodiment, by using a conductive layer including copper as amain component, a display device in which the wiring resistance isreduced can be provided. In a display device with a large screen or adisplay device with high definition to which this embodiment is applied,delay of signal transmission to an end portion of a signal line, drop involtage of a power supply line, or the like is hardly caused. As aresult, a display device in which deterioration of display quality suchas display unevenness or a defect in grayscale is suppressed to improvedisplay quality can be provided.

In addition, by using an oxide semiconductor layer which is highlypurified to have a carrier concentration lower than 1×10¹² cm⁻³, offcurrent of 1×10⁻¹³ A or lower, which is extremely small, can beachieved. As a result, a power-saving display device in which leakagecurrent is suppressed can be provided. Further, a display device with ahigh ratio between the on current and the off current can be provided.Further, a display device with high contrast and high display qualitycan be provided.

The display device of this embodiment is provided with a transistor withhigh electron field-effect mobility in which a highly purified oxidesemiconductor is used; thus, the transistor can operate at high speedand achieve display characteristics of moving images and highdefinition.

Further, since a wiring including copper as a main component is sealedwith nitride films, diffusion of copper is suppressed, so that asemiconductor device with higher reliability can be provided.

Note that the structure described in this embodiment can be combinedwith any of the structures described in the other embodiments asappropriate.

Embodiment 8

In this embodiment, an example of electronic paper will be described asa display device which is an example of a semiconductor device of thepresent invention.

FIG. 26 illustrates active matrix type electronic paper device as anexample of a display device according to one embodiment of the presentinvention. A transistor 581 used in the display device can bemanufactured in a manner similar to that of Embodiment 1 or 3.

The electronic paper in FIG. 26 is an example of a display device usinga twisting ball display system. The twisting ball display system refersto a method in which spherical particles each colored in black and whiteare arranged between a first electrode layer and a second electrodelayer which are electrode layers used for a display element, and apotential difference is generated between the first electrode layer andthe second electrode layer to control orientation of the sphericalparticles, so that display is performed.

The source electrode layer or the drain electrode layer of thetransistor 581 is in contact with and electrically connected to a firstelectrode layer 587 through an opening formed in an insulating layer585. Between the first electrode layer 587 and a second electrode layer588, spherical particles 589 each having a black region 590 a, a whiteregion 590 b, and a cavity 594 around the black region 590 a and thewhite region 590 b which is filled with liquid are provided. A spacearound the spherical particles 589 is filled with a filler 595 such as aresin (see FIG. 26 ). Note that in FIG. 26 , reference numeral 580denotes a substrate, reference numeral 583 denotes an interlayerinsulating film, and reference numeral 596 denotes a substrate.

Further, instead of the twisting ball, an electrophoretic element canalso be used. A microcapsule having a diameter of about 10 μm to 200 μmin which transparent liquid, positively charged white microparticles,and negatively charged black microparticles are encapsulated, is used.In the microcapsule provided between the first electrode layer and thesecond electrode layer, when an electric field is applied by the firstelectrode layer and the second electrode layer, the white microparticlesand the black microparticles move to opposite directions to each other,so that white or black can be displayed. A display element using thisprinciple is an electrophoretic display element and is generally calledelectronic paper. The electrophoretic display element has higherreflectance than a liquid crystal display element, and thus, anauxiliary light is unnecessary, power consumption is low, and a displayportion can be recognized in a dim place. Furthermore, an image which isdisplayed once can be retained even when power is not supplied to thedisplay portion. Accordingly, a displayed image can be stored eventhough a semiconductor device having a display function (which is alsoreferred to simply as a display device or a semiconductor deviceprovided with a display device) is disconnected from a power supply.

Electronic paper of this embodiment has high reliability since it ismounted with a transistor which is excellent in operation stability.

In this embodiment, by using a conductive layer including copper as amain component, a display device in which the wiring resistance isreduced can be provided. In a display device with a large screen or adisplay device with high definition to which this embodiment is applied,delay of signal transmission to an end portion of a signal line, drop involtage of a power supply line, or the like is hardly caused. As aresult, a display device in which deterioration of display quality suchas display unevenness or a defect in grayscale is suppressed to improvedisplay quality can be provided.

In addition, by using an oxide semiconductor layer which is highlypurified to have a carrier concentration lower than 1×10¹² cm⁻³, offcurrent of 1×10⁻¹³ A or lower, which is extremely small, can beachieved. As a result, a power-saving display device in which leakagecurrent is suppressed can be provided. Further, a display device with ahigh ratio between the on current and the off current can be provided.Further, a display device with high contrast and high display qualitycan be provided.

Further, since a wiring including copper as a main component is sealedwith nitride films, diffusion of copper is suppressed, so that asemiconductor device with higher reliability can be provided.

This embodiment can be combined with any content of Embodiment 1 or 3 asappropriate.

Embodiment 9

A display device according to one embodiment of the present inventioncan be applied as electronic paper. An electronic paper can be used forelectronic appliances of a variety of fields as long as they can displaydata. For example, an electronic paper can be applied to an e-bookreader (electronic book), a poster, an advertisement in a vehicle suchas a train, or displays of various cards such as a credit card. Examplesof such electronic devices are illustrated in FIGS. 27A and 27B and FIG.28 .

FIG. 27A illustrates a poster 2631 formed using electronic paper. If theadvertizing medium is printed paper, the advertisement is replaced bymanpower; however, when electronic paper according to one embodiment ofthe present invention is used, the advertisement display can be changedin a short time. Furthermore, stable images can be obtained withoutdisplay defects. Note that the poster may have a configuration capableof wirelessly transmitting and receiving data.

FIG. 27B illustrates an advertisement 2632 in a vehicle such as a train.If the advertizing medium is printed paper, the advertisement isreplaced by manpower; however, when electronic paper according to oneembodiment of the present invention is used, the advertisement displaycan be changed in a short time without much manpower. Furthermore,stable images can be obtained without display defects. Note that theadvertisement in a vehicle may have a configuration capable ofwirelessly transmitting and receiving data.

FIG. 28 illustrates an example of an electronic book device. Forexample, an electronic book device 2700 includes two housings, a housing2701 and a housing 2703. The housings 2701 and 2703 are bound with eachother by an axis portion 2711, along which the electronic book device2700 is opened and closed. With such a structure, the electronic bookdevice 2700 can operate like a paper book.

A display portion 2705 and a display portion 2707 are incorporated inthe housing 2701 and the housing 2703, respectively. The display portion2705 and the display portion 2707 may display one image or differentimages. When the display portions display different images, text can bedisplayed on the right display portion (the display portion 2705 in FIG.28 ) and an image can be displayed on the left display portion (thedisplay portion 2707 in FIG. 28 ), for example.

Further, FIG. 28 illustrates an example where the housing 2701 isprovided with an operation portion and the like. For example, thehousing 2701 is provided with a power switch 2721, an operation key2723, a speaker 2725, and the like. With the operation key 2723, pagescan be turned. Note that a keyboard, a pointing device, and the like maybe provided on the same surface as the display portion of the housing.Furthermore, an external connection terminal (an earphone terminal, aUSB terminal, a terminal that can be connected to various cables such asan AC adapter and a USB cable, or the like), a recording mediuminsertion portion, and the like may be provided on the back surface orthe side surface of the housing. Moreover, the electronic book device2700 may have a function of an electronic dictionary.

The electronic book device 2700 may have a configuration capable ofwirelessly transmitting and receiving data. Through wirelesscommunication, desired book data or the like can be purchased anddownloaded from an electronic book server.

Since a transistor excellent in operation stability is mounted, theaforementioned display devices have high reliability.

Embodiment 10

A semiconductor device according to one embodiment of the presentinvention can be applied to a variety of electronic devices (includinggame machines). Examples of electronic devices are a television set(also referred to as a television or a television receiver), a monitorof a computer or the like, a camera such as a digital camera or adigital video camera, a digital photo frame, a mobile phone handset(also referred to as a mobile phone or a mobile phone device), aportable game console, a portable information terminal, an audioreproducing device, a large-sized game machine such as a pachinkomachine, and the like.

FIG. 29A illustrates an example of a television set. In a television set9600, a display portion 9603 is incorporated in a housing 9601. Thedisplay portion 9603 can display images. The housing 9601 is supportedby a stand 9605 in this embodiment.

The television set 9600 can be operated with an operation switch of thehousing 9601 or a separate remote controller 9610. Channels and volumecan be controlled with an operation key 9609 of the remote controller9610 so that an image displayed on the display portion 9603 can becontrolled. Furthermore, the remote controller 9610 may be provided witha display portion 9607 for displaying data output from the remotecontroller 9610.

Note that the television set 9600 is provided with a receiver, a modem,and the like. With the use of the receiver, general televisionbroadcasting can be received. Moreover, when the display device isconnected to a communication network with or without wires via themodem, one-way (from a sender to a receiver) or two-way (between asender and a receiver or between receivers) information communicationcan be performed.

FIG. 29B illustrates an example of a digital photo frame. For example,in a digital photo frame 9700, a display portion 9703 is incorporated ina housing 9701. The display portion 9703 can display a variety ofimages. For example, the display portion 9703 can display data of animage taken with a digital camera or the like and function as a normalphoto frame

Note that the digital photo frame 9700 is provided with an operationportion, an external connection portion (a USB terminal, a terminal thatcan be connected to various cables such as a USB cable, or the like), arecording medium insertion portion, and the like. Although thesecomponents may be provided on the surface on which the display portionis provided, it is preferable to provide them on the side surface or theback surface for the design of the digital photo frame 9700. Forexample, a memory storing data of an image taken with a digital camerais inserted in the recording medium insertion portion of the digitalphoto frame, whereby the image data can be transferred and thendisplayed on the display portion 9703.

The digital photo frame 9700 may transmit and receive data wirelessly.The structure may be employed in which desired image data is transferredwirelessly to be displayed.

FIG. 30A illustrates a portable game machine including a housing 9881and a housing 9891 which are jointed with a connection portion 9893 soas to be able to open and close. A display portion 9882 and a displayportion 9883 are incorporated in the housing 9881 and the housing 9891,respectively. The portable game machine illustrated in FIG. 30Aadditionally includes a speaker portion 9884, a storage medium insertingportion 9886, an LED lamp 9890, an input means (operation keys 9885, aconnection terminal 9887, a sensor 9888 (including a function ofmeasuring force, displacement, position, speed, acceleration, angularspeed, the number of rotations, distance, light, liquid, magnetism,temperature, chemical substance, sound, time, hardness, electric field,current, voltage, electric power, radiation, flow rate, humidity, tiltangle, vibration, smell, or infrared ray), and a microphone 9889), andthe like. Needless to say, the structure of the portable game machine isnot limited to the above, and may be any structure as long as asemiconductor device according to one embodiment of the presentinvention is provided. Moreover, another accessory may be provided asappropriate. The portable game machine illustrated in FIG. 30A has afunction of reading out a program or data stored in a storage medium todisplay it on the display portion and a function of sharing informationwith another portable game machine by wireless communication. Thefunctions of the portable game machine illustrated in FIG. 30A are notlimited to these, and the portable game machine can have a variety offunctions.

FIG. 30B illustrates an example of a slot machine which is a large gamemachine. In a slot machine 9900, a display portion 9903 is incorporatedin a housing 9901. In addition, the slot machine 9900 includes anoperation means such as a start lever or a stop switch, a coin slot, aspeaker, and the like. Needless to say, the structure of the slotmachine 9900 is not limited to the above, and may be any structure aslong as at least a semiconductor device according to one embodiment ofthe present invention is provided. Moreover, another accessory may beprovided as appropriate.

FIG. 31 illustrates an example of a mobile phone. A mobile phone 1000includes a display portion 1002 incorporated in a housing 1001,operation buttons 1003, an external connection port 1004, a speaker1005, a microphone 1006 and the like.

When the display portion 1002 of the mobile phone 1000 illustrated inFIG. 31 is touched with a finger or the like, data can be input into themobile phone 1000. Users can make a call or text messaging by touchingthe display portion 1002 with their fingers or the like.

There are mainly three screen modes of the display portion 1002. Thefirst mode is a display mode mainly for displaying images. The secondmode is an input mode mainly for inputting data such as text. The thirdmode is a display-and-input mode in which two modes of the display modeand the input mode are combined.

For example, in the case of making a phone call or composing a mail, thedisplay portion 1002 is set to a text input mode where text input ismainly performed, and text input operation can be performed on a screen.In that case, it is preferable to display a keyboard or number buttonson almost all area of the screen of the display portion 1002.

When a detection device including a sensor for detecting inclination,such as a gyroscope or an acceleration sensor, is provided inside themobile phone 1000, display in the screen of the display portion 1002 canbe automatically switched by determining the installation direction ofthe mobile phone 1000 (whether the mobile phone 1000 is placedhorizontally or vertically for a landscape mode or a portrait mode).

The screen modes are switched by touching the display portion 1002 oroperating the operation button 1003 of the housing 1001. Alternatively,the screen modes may be switched depending on the kind of the imagedisplayed on the display portion 1002. For example, when a signal of animage displayed on the display portion is a signal of moving image data,the screen mode is switched to the display mode. When the signal is asignal of text data, the screen mode is switched to the input mode.

Further, in the input mode, when input by touching the display portion1002 is not performed for a certain period while a signal detected bythe optical sensor in the display portion 1002 is detected, the screenmode may be controlled so as to be switched from the input mode to thedisplay mode.

The display portion 1002 may function as an image sensor. For example,an image of a palm print, a fingerprint, or the like is taken when thedisplay portion 1002 is touched with a palm or a finger, wherebypersonal identification can be performed. Further, by providing abacklight or a sensing light source which emits a near-infrared light inthe display portion, an image of a finger vein, a palm vein, or the likecan be taken.

As described above, a display device mounted with a transistor which isexcellent in operation stability can be manufactured. Since theelectronic device includes the transistor whose operation stability isexcellent, the reliability is high.

Embodiment 11

In this embodiment, an example of a liquid crystal display device willbe described as one embodiment of a display device with reference toFIG. 32 , FIG. 33 , FIG. 34 , and FIG. 35 , which includes thetransistor described in Embodiment 1 or 3 and a liquid crystal elementas a semiconductor element. The transistor described in Embodiment 1 canbe used for TFTs 628 and 629, which are used for the liquid crystaldisplay device illustrated in FIG. 32 , FIG. 33 , FIG. 34 , and FIG. 35. Further, the TFTs 628 and 629 can be manufactured through a processsimilar to that of Embodiment 2, and have high electric characteristicsand high reliability. The TFTs 628 and 629 are transistors in each ofwhich a channel formation region is formed in an oxide semiconductorlayer. With reference to FIG. 32 , FIG. 33 , FIG. 34 , and FIG. 35 , anexample in which the transistor which can be manufactured in a mannersimilar to that of the transistor illustrated in FIG. 1B is described asan example, but an embodiment of the present invention is not limitedthereto.

Hereinafter, a vertical alignment (VA) mode liquid crystal displaydevice is described. The VA is a method to control the alignment ofliquid crystal molecules of a liquid crystal display panel. In the VAliquid crystal display device, liquid crystal molecules are aligned in avertical direction with respect to a panel surface when no voltage isapplied. In this embodiment, in particular, a pixel is divided into someregions (subpixels), and molecules are aligned in different directionsin their respective regions. This is referred to as multi-domain ormulti-domain design. Hereinafter, a liquid crystal display device ofmulti-domain design is described.

FIGS. 33 and 34 illustrate a pixel electrode and a counter electrode,respectively. FIG. 33 is a top view showing the substrate side where thepixel electrode is formed. FIG. 32 illustrates a cross-sectionalstructure taken along section line E-F in FIG. 33 . FIG. 34 is a topplan view of a side of a substrate on which a counter electrode isformed. Hereinafter, description is made with reference to thesedrawings.

FIG. 32 illustrates a state in which a substrate 600 provided with a TFT628, a pixel electrode 624 connected to the TFT 628, and a storagecapacitor portion 630 overlaps with a counter substrate 601 providedwith a counter electrode 640 and the like, and liquid crystal isinjected therebetween.

The counter substrate 601 is provided with a coloring layer 636 and thecounter electrode 640, and projections 644 are formed on the counterelectrode 640. An alignment film 648 is formed over the pixel electrode624, and an alignment film 646 is similarly formed on the counterelectrode 640 and the projections 644. A liquid crystal layer 650 isformed between the substrate 600 and the counter substrate 601.

The TFT 628, the pixel electrode 624 connected to the TFT 628, and thestorage capacitor portion 630 are formed over the substrate 600. Thepixel electrode 624 is connected to a wiring 618 in a contact hole 623.The contact hole 623 penetrates an insulating layer 620 covering the TFT628, the wiring 618, and the storage capacitor portion 630, and furtherpenetrates a third insulating layer 622 covering the insulating layer620. As the TFT 628, the transistor described in Embodiment 1 or 3 canbe used as appropriate. Further, the storage capacitor portion 630includes a first capacitor wiring 604 which is formed at the same timeas a gate wiring 602 of the TFT 628; a gate insulating layer 606; and asecond capacitor wiring 617 which is formed at the same time as thewirings 616 and 618.

The pixel electrode 624, the liquid crystal layer 650, and the counterelectrode 640 overlap with each other, so that a liquid crystal elementis formed.

FIG. 33 illustrates a structure over the substrate 600. The pixelelectrode 624 can be formed using a light-transmitting conductivematerial such as indium oxide containing tungsten oxide, an indium zincoxide containing tungsten oxide, an indium oxide containing titaniumoxide, an indium tin oxide containing titanium oxide, indium tin oxide(hereinafter referred to as ITO), indium zinc oxide, indium tin oxide towhich a silicon oxide is added, or the like.

The pixel electrode 624 can be formed using a conductive compositionincluding a conductive macromolecule (also referred to as a conductivepolymer). The pixel electrode formed using the conductive compositionpreferably has a sheet resistance of less than or equal to 10000 ohmsper square and a transmittance of greater than or equal to 70% at awavelength of 550 nm. Further, the resistivity of the conductive highmolecule included in the conductive composition is preferably less thanor equal to 0.1 Ω·cm.

As the conductive high molecule, a so-called π-electron conjugatedconductive polymer can be used. For example, polyaniline or a derivativethereof, polypyrrole or a derivative thereof, polythiophene or aderivative thereof, a copolymer of two or more kinds of them, and thelike can be given.

Slits 625 are formed in the pixel electrode 624. The slits 625 areformed to control alignment of the liquid crystals.

The TFT 629, a pixel electrode 626 connected to the TFT 629, and astorage capacitor portion 631 illustrated in FIG. 33 can be formed in asimilar manner to the TFT 628, the pixel electrode 624, and the storagecapacitor portion 630, respectively. Both the TFTs 628 and 629 areconnected to the wiring 616. A pixel of this liquid crystal displaypanel includes the pixel electrodes 624 and 626. The pixel electrodes624 and 626 are subpixels.

FIG. 34 illustrates a structure of a counter substrate side. It ispreferable to use the same material as that of the pixel electrode 624to form the counter electrode 640. The projections 644 that controlalignment of liquid crystals are formed over the counter electrode 640.

FIG. 35 illustrates an equivalent circuit of this pixel structure. Boththe TFTs 628 and 629 are connected to the gate wiring 602 and the wiring616. In this case, when potentials of the capacitor wiring 604 and acapacitor wiring 605 are different from each other, operations of liquidcrystal elements 651 and 652 can vary. That is, alignment of the liquidcrystal is precisely controlled and a viewing angle is increased byindividual control of potentials of the capacitor wirings 604 and 605.

When a voltage is applied to the pixel electrode 624 provided with theslits 625, a distorted electric field (an oblique electric field) isgenerated in the vicinity of the slits 625. The slit 625 and theprojection 644 on the counter substrate 601 side are alternatelyarranged in an engaging manner, and thus, an oblique electric field iseffectively generated to control alignment of the liquid crystal, sothat a direction of alignment of the liquid crystal varies depending onlocation. That is, a viewing angle of the liquid crystal display panelis increased by domain multiplication.

Next, another VA liquid crystal display device, which is different fromthe above, is described with reference to FIG. 36 , FIG. 37 , FIG. 38 ,and FIG. 39 .

FIGS. 36 and 37 each illustrate a pixel structure of a VA-mode liquidcrystal display panel. FIG. 37 is a top view of the substrate 600. FIG.36 is a view of a cross-sectional structure taken along section line Y-Zin FIG. 37 . Description below will be given with reference to both thedrawings.

In this pixel structure, a plurality of pixel electrodes are provided inone pixel, and a TFT is connected to each pixel electrode. The pluralityof TFTs are constructed so as to be driven by different gate signals.That is, signals that are applied to individual pixel electrodes in amulti-domain pixel are controlled independently of each other.

Through the contact hole 623, the pixel electrode 624 is connected tothe TFT 628 with the wiring 618. Through a contact hole 627, the pixelelectrode 626 is connected to a TFT 629 with a wiring 619. The gatewiring 602 of the TFT 628 is separated from a gate wiring 603 of the TFT629 so that different gate signals can be supplied. On the other hand,the wiring 616 serving as a data line is shared by the TFTs 628 and 629.As each of the TFTs 628 and 629, the transistor described in Embodiment1 or 3 can be used as appropriate. Also, a capacitor wiring 690 isprovided.

The shape of the pixel electrode 624 is different from that of the pixelelectrode 626, and the pixel electrodes are separated by slits. Thepixel electrode 626 surrounds the pixel electrode 624, which has aV-shape. The TFTs 628 and 629 make the timing of applying voltages tothe pixel electrodes 624 and 626 different from each other, therebycontrolling alignment of liquid crystals. FIG. 39 shows an equivalentcircuit of this pixel structure. The TFT 628 is connected to the gatewiring 602, and the TFT 629 is connected to the gate wiring 603. Ifdifferent gate signals are supplied to the gate wirings 602 and 603,operation timing of the TFTs 628 and 629 can be different.

A counter substrate 601 is provided with the coloring layer 636 and thecounter electrode 640. A planarization layer 637 is formed between thecoloring layer 636 and the counter electrode 640 to prevent alignmentdisorder of the liquid crystals. FIG. 38 illustrates a structure on thecounter substrate side. The counter electrode 640 is shared by pluralpixels, and slits 641 are formed in the counter electrode 640. The slit641 and the slit 625 on the pixel electrodes 624 and 626 side arealternately arranged in an engaging manner; thus, an oblique electricfield is effectively generated, and alignment of the liquid crystal canbe controlled. Accordingly, the orientation of the liquid crystals canbe varied in different places, so that the viewing angle is widened.

The pixel electrode 624, the liquid crystal layer 650, and the counterelectrode 640 overlap with each other, so that a first liquid crystalelement is formed. Further, the pixel electrode 626, the liquid crystallayer 650, and the counter electrode 640 overlap with each other, sothat a second liquid crystal element is formed. Furthermore, themulti-domain structure is employed in which the first liquid crystalelement and the second liquid crystal element are provided for onepixel.

Although the VA-mode liquid crystal display device is described in thisembodiment as a liquid crystal display device including the transistordescribed in Embodiment 1 or 3, the transistor described in Embodiment 1or 3 can be applied to an IPS-mode liquid crystal display device, aTN-mode liquid crystal display device, or the like.

In the case where a transistor in a pixel portion of the above-describedliquid crystal display device is manufactured using the manufacturingmethod of a transistor described in Embodiment 2, display unevenness dueto variations in the threshold voltage of transistors of respectivepixels can be suppressed.

Embodiment 12

In this embodiment, one embodiment of a substrate provided with acircuit of a display device whose structure is different from that ofEmbodiment 1 or 3 will be described with reference to FIG. 40 .

FIG. 40 illustrates a pixel structure provided in the display device.FIG. 40 is a cross-sectional view illustrating a stacked structure ofthe pixel.

In cross section A1-A2, a stacked structure of a transistor 153 used inthe pixel portion is illustrated. The transistor 153 is one embodimentof a transistor having a bottom gate structure.

In cross section B1-B2, a stacked structure of a capacitor formed in thepixel portion is illustrated.

Further, in cross section C1-C2, a stacked structure in an intersectionportion of a gate wiring and a source wiring is illustrated.

In the substrate provided with a circuit of a display device of thisembodiment, a channel protective layer is provided in the transistor,which is a difference from the substrate provided with a circuit of adisplay device described in Embodiment 1. In addition, the structure ofthe intersection portion of the gate wiring and the source wiring isdifferent.

Specifically, a fourth insulating layer 114 a functioning as a channelprotective layer is provided over the channel formation region of theoxide semiconductor layer 113 a in the transistor 153. Further, in theintersection portion of the gate wiring and the source wiring, a fourthinsulating layer 114 b is interposed between the gate wiring 111 cformed using a first conductive layer and the source wiring 115 c formedusing a second conductive layer.

The substrate provided with a circuit of a display device described inthis embodiment has the same structure as the substrate provided with acircuit of a display device described in Embodiment 1, except forprovision of the fourth insulating layer 114 a and the fourth insulatinglayer 114 b; thus, the detailed description is omitted.

In this embodiment, the fourth insulating layer is formed using asilicon oxide (SiO_(x) (x>0)) layer to have a thickness of 300 nm. Otherthan silicon oxide, the fourth insulating layer can be formed using onekind of an oxide, a nitride, an oxynitride, and a nitride oxide ofaluminum, tantalum, yttrium, or hafnium; or a compound including atleast two or more kinds of the above.

In this embodiment, the fourth insulating layer is formed after theoxide semiconductor layer is highly purified. As a method for formingthe fourth insulating layer, a method by which an impurity such as wateror hydrogen is not incorporated (e.g., a sputtering method or the like)is selected so as not to contaminate the highly purified oxidesemiconductor layer.

In the case where the fourth insulating layer in contact with the oxidesemiconductor layer is formed using a silicon oxide (SiO_(x) (x>0))layer with a thickness of 1 nm or more, a silicon target is preferablyused. A silicon oxide film formed by sputtering in an oxygen and raregas atmosphere by using the silicon target contains a large number ofdangling bonds of silicon atoms or oxygen atoms.

The impurity left in the oxide semiconductor layer diffuses into thefourth insulating layer including a large number of dangling bonds ofsilicon atoms or oxygen atoms and is fixed. Specifically, a hydrogenatom, a compound including a hydrogen atom such as H2O, or the like inthe oxide semiconductor layer is likely to diffuse and move into thefourth insulating layer and fixed in the fourth insulating layer.

The fourth insulating layer is deposited by a pulsed DC sputteringmethod using a columnar polycrystalline silicon target doped with boron(the resistivity is 0.01 Ωcm) with a purity of 6 N under conditionswhere the distance between the substrate and the target (T-S distance)is 89 mm, the pressure is 0.4 Pa, the direct-current (DC) power is 6 kW,and the atmosphere is an oxygen atmosphere (the proportion of the oxygenflow is 100%).

The substrate temperature in film formation may be higher than or equalto room temperature and lower than or equal to 300° C. and in thisembodiment, is 100° C.

Deposition of a silicon oxide film is performed by a sputtering methodwith use of a high-purity gas and a sputtering apparatus provided with acryopump. The sputtering method can be carried out in a rare gas(typically argon) atmosphere, an oxygen atmosphere, or an atmosphereincluding a rare gas (typically argon) and oxygen. Note that the oxideinsulating film formed by a sputtering method is distinctively dense andeven a single layer of the oxide insulating film can be used as aprotective film for suppressing a phenomenon in which an impurity isdiffused into a layer in contact therewith.

As a target, a silicon oxide target or a silicon target may be used. Inaddition, a target doped with phosphorus (P) or boron (B) can be used sothat phosphorus (P) or boron (B) is added to the oxide insulating film.

Next, by a photolithography method, an inkjet method, or the like, amask is formed over the fourth insulating layer, and etching isperformed with use of the mask, so that the fourth insulating layer 114a and the fourth insulating layer 114 b are formed.

In this embodiment, the fourth insulating layer formed using an oxideinsulating layer is formed to be in contact with the highly purifiedoxide semiconductor layer. The impurity left in the oxide semiconductorlayer diffuses into the fourth insulating layer and is fixed therein.Further, oxygen is supplied to the oxide semiconductor layer from theoxide insulating layer included in the fourth insulating layer, wherebyoxygen deficiency in the oxide semiconductor layer can be reduced.

Further, the oxide semiconductor layer and the oxide insulating layerare interposed between the gate wiring and the source wiring at theintersection portion, whereby the distance between the wirings isincreased; thus, capacitance generated between the wirings at theintersection portion can be reduced.

This embodiment can be freely combined with any of the other embodimentsin this specification.

This application is based on Japanese Patent Application serial no.2009-270784 filed with Japan Patent Office on Nov. 27, 2009, the entirecontents of which are hereby incorporated by reference.

EXPLANATION OF REFERENCE

-   10: pulse output circuit, 11: wiring, 12: wiring, 13: wiring, 14:    wiring, 15: wiring, 16: wiring, 17: wiring, 21: input terminal, 22:    input terminal, 23: input terminal, 24: input terminal, 25: input    terminal, 26: output terminal, 27: output terminal, 31: transistor,    32: transistor, 33: transistor, 34: transistor, 35: transistor, 36:    transistor, 37: transistor, 38: transistor, 39: transistor, 40:    transistor, 41: transistor, 51: power supply line, 52: power supply    line, 53: power supply line, 61: period, 62: period, 100: substrate,    101: base film, 102: insulating layer, 102 a: insulating layer, 102    b: insulating layer, 103: oxide semiconductor film, 107: insulating    layer, 107 a: insulating layer, 107 b: insulating layer, 108:    insulating layer, 109: pixel electrode, 111 a: gate electrode, 111    b: capacitor wiring, 111 c: gate wiring, 113 a: oxide semiconductor    layer, 113 b: oxide semiconductor layer, 114 a: insulating layer,    114 b: insulating layer, 115 a: electrode, 115 b: electrode, 115 c:    source wiring, 128: contact hole, 151: transistor, 152: transistor,    153: transistor, 200: substrate, 400: substrate, 402: insulating    layer, 404 a: oxide semiconductor layer, 404 b: oxide semiconductor    layer, 408: contact hole, 410 a: wiring, 410 b: wiring, 410 c:    wiring, 421 a: gate electrode, 421 b: gate electrode, 422 a:    electrode, 422 b: electrode, 428: insulating layer, 440A:    transistor, 440B: transistor, 455 a: electrode, 455 b: electrode,    455 c: electrode, 455 d: electrode, 581: transistor, 585: insulating    layer, 587: electrode layer, 588: electrode layer, 589: spherical    particle, 590 a: black region, 590 b: white region, 594: cavity,    595: filler, 600: substrate, 601: counter substrate, 602: gate    wiring, 603: gate wiring, 604: capacitor wiring, 605: capacitor    wiring, 606: gate insulating layer, 616: wiring, 617: capacitor    wiring, 618: wiring, 619: wiring, 620: insulating layer, 622:    insulating layer, 623: contact hole, 624: pixel electrode, 625:    slit, 626: pixel electrode, 627: contact hole, 628: TFT, 629: TFT,    630: storage capacitor portion, 631: storage capacitor portion, 636:    coloring layer, 637: planarization layer, 640: counter electrode,    641: slit, 644: projection, 646: alignment film, 648: alignment    film, 650: liquid crystal layer, 651: liquid crystal element, 652:    liquid crystal element, 690: capacitor wiring, 1000: mobile phone,    1001: housing, 1002: display portion, 1003: operation button, 1004:    external connection port, 1005: speaker, 1006: microphone, 2600: TFT    substrate, 2601: counter substrate, 2602: sealant, 2603: pixel    portion, 2604: display element, 2605: coloring layer, 2606:    polarizing plate, 2607: polarizing plate, 2608: wiring circuit    board, 2609: flexible wiring board, 2610: cold cathode tube, 2611:    reflective plate, 2612: circuit board, 2613: diffusion plate, 2631:    poster, 2632: advertisement, 2700: electronic book device, 2701:    housing, 2703: housing, 2705: display portion, 2707: display    portion, 2711: axis portion, 2721: power switch, 2723: operation    key, 2725: speaker, 4001: substrate, 4002: pixel portion, 4003:    signal line driver circuit, 4004: scan line driver circuit, 4005:    sealant, 4006: substrate, 4008: liquid crystal layer, 4010:    transistor, 4011: transistor, 4013: liquid crystal element, 4015:    connection terminal electrode, 4016: terminal electrode, 4018: FPC,    4019: anisotropic conductive film, 4020: insulating layer, 4021:    insulating layer, 4030: pixel electrode layer, 4031: counter    electrode layer, 4032: insulating layer, 4040: conductive layer,    4501: substrate, 4502: pixel portion, 4503 a: signal line driver    circuit, 4504 a: scan line driver circuit, 4505: sealant, 4506:    substrate, 4507: filler, 4509: transistor, 4510: transistor, 4511:    light—emitting element, 4512: electroluminescent layer, 4513:    electrode layer, 4515: connection terminal electrode, 4516: terminal    electrode, 4517: electrode layer, 4518 a: FPC, 4519: anisotropic    conductive film, 4520: partition, 4540: conductive layer, 4544:    insulating layer, 5300: substrate, 5301: pixel portion, 5302: scan    line driver circuit, 5303: scan line driver circuit, 5304: signal    line driver circuit, 5305: timing control circuit, 5601: shift    register, 5602: switching circuit, 5603: transistor, 5604: wiring,    5605: wiring, 6400: pixel, 6401: switching transistor, 6402: driver    transistor, 6403: capacitor, 6404: light—emitting element, 6405:    signal line, 6406: scan line, 6407: power supply line, 6408: common    electrode, 7001: driver TFT, 7002: light—emitting element, 7003:    electrode, 7004: EL layer, 7005: electrode, 7008: electrode, 7009:    partition, 7010: substrate, 7011: driver TFT, 7012: light—emitting    element, 7013: electrode, 7014: EL layer, 7015: electrode, 7016:    blocking film, 7017: conductive film, 7019: partition, 7020:    substrate, 7021: driver TFT, 7022: light—emitting element, 7023:    electrode, 7024: EL layer, 7025: electrode, 7026: electrode, 7027:    conductive film, 7029: partition, 7030: gate insulating layer, 7032:    insulating layer, 7033: color filter layer, 7034: overcoat layer,    7035: protective insulating layer, 7040: gate insulating layer,    7042: insulating layer, 7043: color filter layer, 7044: overcoat    layer, 7045: protective insulating layer, 7052: protective    insulating layer, 7053: planarization insulating layer, 7055:    insulating layer, 9600: television set, 9601: housing, 9603: display    portion, 9605: stand, 9607: display portion, 9609: operation key,    9610: remote controller, 9700: digital photo frame, 9701: housing,    9703: display portion, 9881: housing, 9882: display portion, 9883:    display portion, 9884: speaker portion, 9885: operation key, 9886:    storage medium inserting portion, 9887: connection terminal, 9888:    sensor, 9889: microphone, 9890: LED lamp, 9891: housing, 9893:    connection portion, 9900: slot machine, 9901: housing, 9903: display    portion

1. (canceled)
 2. A method of manufacturing a semiconductor device,comprising: forming a gate electrode including copper over a substrate;forming a first insulating layer over the gate electrode; forming anoxide semiconductor layer over the first insulating layer; performing afirst heat treatment at a temperature equal to or higher than 350° C.and equal to or lower than 700° C.; forming a source electrode and adrain electrode after the first heat treatment; forming a secondinsulating layer over and in contact with the source electrode, thedrain electrode and a portion of the oxide semiconductor layer; andperforming a second heat treatment after forming the second insulatinglayer, wherein the first insulating layer includes silicon nitride andsilicon oxide over the silicon nitride, and wherein the secondinsulating layer includes silicon oxide.
 3. The method of manufacturinga semiconductor device according to claim 2, wherein the oxidesemiconductor film includes indium, gallium and zinc.
 4. The method ofmanufacturing a semiconductor device according to claim 2, wherein thesemiconductor device is a liquid crystal display device.
 5. A method ofmanufacturing a semiconductor device, comprising: forming a gateelectrode including copper over a substrate; forming a first insulatinglayer over the gate electrode; forming an oxide semiconductor layer overthe first insulating layer; performing a first heat treatment at atemperature equal to or higher than 350° C. and equal to or lower than700° C.; forming a source electrode and a drain electrode after thefirst heat treatment; forming a second insulating layer over and incontact with the source electrode, the drain electrode and a portion ofthe oxide semiconductor layer; and performing a second heat treatment ata temperature equal to or higher than 200° C. and equal to or lower than400° C. after forming the second insulating layer, wherein the firstinsulating layer includes silicon nitride and silicon oxide over thesilicon nitride, and wherein the second insulating layer includessilicon oxide.
 6. The method of manufacturing a semiconductor deviceaccording to claim 5, wherein the oxide semiconductor film includesindium, gallium and zinc.
 7. The method of manufacturing a semiconductordevice according to claim 5, wherein the semiconductor device is aliquid crystal display device.